JP2013513942A - 埋め込まれた基板及びリードフレームを備えたモジュールパッケージ - Google Patents

埋め込まれた基板及びリードフレームを備えたモジュールパッケージ Download PDF

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Publication number
JP2013513942A
JP2013513942A JP2012543100A JP2012543100A JP2013513942A JP 2013513942 A JP2013513942 A JP 2013513942A JP 2012543100 A JP2012543100 A JP 2012543100A JP 2012543100 A JP2012543100 A JP 2012543100A JP 2013513942 A JP2013513942 A JP 2013513942A
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JP
Japan
Prior art keywords
integrated circuit
substrate
circuit package
lead frame
die attach
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012543100A
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English (en)
Japanese (ja)
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JP2013513942A5 (enExample
Inventor
メン リー ハン
イー ウー クアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
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National Semiconductor Corp
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Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JP2013513942A publication Critical patent/JP2013513942A/ja
Publication of JP2013513942A5 publication Critical patent/JP2013513942A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2012543100A 2009-12-10 2010-10-25 埋め込まれた基板及びリードフレームを備えたモジュールパッケージ Pending JP2013513942A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/635,624 2009-12-10
US12/635,624 US8304887B2 (en) 2009-12-10 2009-12-10 Module package with embedded substrate and leadframe
PCT/US2010/053974 WO2011071603A2 (en) 2009-12-10 2010-10-25 Module package with embedded substrate and leadframe

Publications (2)

Publication Number Publication Date
JP2013513942A true JP2013513942A (ja) 2013-04-22
JP2013513942A5 JP2013513942A5 (enExample) 2013-11-28

Family

ID=44141994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012543100A Pending JP2013513942A (ja) 2009-12-10 2010-10-25 埋め込まれた基板及びリードフレームを備えたモジュールパッケージ

Country Status (5)

Country Link
US (1) US8304887B2 (enExample)
JP (1) JP2013513942A (enExample)
CN (1) CN102576702B (enExample)
TW (1) TWI523157B (enExample)
WO (1) WO2011071603A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9035435B2 (en) * 2012-11-14 2015-05-19 Power Integrations, Inc. Magnetically coupled galvanically isolated communication using lead frame
US8884414B2 (en) 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9253910B2 (en) * 2013-01-30 2016-02-02 Texas Instruments Incorporated Circuit assembly
CN104037149A (zh) 2013-03-05 2014-09-10 飞思卡尔半导体公司 引线框和基板半导体封装
US10163808B2 (en) * 2015-10-22 2018-12-25 Avago Technologies International Sales Pte. Limited Module with embedded side shield structures and method of fabricating the same
US10134682B2 (en) 2015-10-22 2018-11-20 Avago Technologies International Sales Pte. Limited Circuit package with segmented external shield to provide internal shielding between electronic components
DE102016208782A1 (de) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
CN107946267B (zh) * 2017-11-23 2020-03-06 华进半导体封装先导技术研发中心有限公司 一种芯片结构及制作方法
CN108336056B (zh) * 2018-04-12 2024-06-04 苏州震坤科技有限公司 用于半导体封装结构的万用转接电路层
US11735541B2 (en) * 2018-06-28 2023-08-22 Murata Manufacturing Co., Ltd. Semiconductor device with protective protrusion
EP3874596A1 (en) * 2018-10-30 2021-09-08 Excelitas Canada Inc. High speed switching circuit configuration
US12176274B2 (en) * 2018-11-26 2024-12-24 Texas Instruments Incorporated Multi-die package with multiple heat channels
US20210082790A1 (en) * 2019-09-18 2021-03-18 Alpha And Omega Semiconductor (Cayman) Ltd. Power semiconductor package having integrated inductor and method of making the same
US12055633B2 (en) * 2020-08-25 2024-08-06 Lumentum Operations Llc Package for a time of flight device
CN113130454B (zh) * 2021-04-12 2024-07-05 长沙新雷半导体科技有限公司 一种芯片封装装置、电子模组及电子设备
IL310996A (en) * 2021-08-26 2024-04-01 Vishay Gen Semiconductor Llc Packaging with increased cooling for improved heat management for electrical components
CN113793843B (zh) * 2021-09-30 2024-07-30 重庆平创半导体研究院有限责任公司 一种抗辐照封装结构及方法
US12125771B2 (en) 2021-12-08 2024-10-22 Nxp B.V. Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof
US11910530B2 (en) * 2022-03-25 2024-02-20 Tactotek Oy Method for manufacturing electronics assembly and electronics assembly

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154683A (ja) * 1997-08-05 1999-02-26 Nec Corp 半導体装置、その製造方法
JP2000091499A (ja) * 1998-09-11 2000-03-31 Hitachi Ltd パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP2006514438A (ja) * 2003-02-25 2006-04-27 テッセラ，インコーポレイテッド 接続要素を有する高周波チップパッケージ
JP2006310821A (ja) * 2005-03-30 2006-11-09 Sanyo Electric Co Ltd 半導体モジュールおよびその製造方法
JP2008084978A (ja) * 2006-09-26 2008-04-10 Denso Corp 電子制御装置
JP2009071234A (ja) * 2007-09-18 2009-04-02 Denso Corp 半導体装置
JP2011044452A (ja) * 2009-08-19 2011-03-03 Denso Corp 電子装置およびその製造方法

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US5266834A (en) 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
US5340771A (en) * 1993-03-18 1994-08-23 Lsi Logic Corporation Techniques for providing high I/O count connections to semiconductor dies
JPH11312770A (ja) 1998-04-28 1999-11-09 Mitsumi Electric Co Ltd 薄型ｉｃの放熱フィン
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
US7880282B2 (en) 2003-12-18 2011-02-01 Rf Module & Optical Design Ltd. Semiconductor package with integrated heatsink and electromagnetic shield
JP5233341B2 (ja) 2008-03-17 2013-07-10 富士電機株式会社 半導体装置及び半導体装置の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154683A (ja) * 1997-08-05 1999-02-26 Nec Corp 半導体装置、その製造方法
JP2000091499A (ja) * 1998-09-11 2000-03-31 Hitachi Ltd パワー半導体モジュール並びにそれを用いた電動機駆動システム
JP2006514438A (ja) * 2003-02-25 2006-04-27 テッセラ，インコーポレイテッド 接続要素を有する高周波チップパッケージ
JP2006310821A (ja) * 2005-03-30 2006-11-09 Sanyo Electric Co Ltd 半導体モジュールおよびその製造方法
JP2008084978A (ja) * 2006-09-26 2008-04-10 Denso Corp 電子制御装置
JP2009071234A (ja) * 2007-09-18 2009-04-02 Denso Corp 半導体装置
JP2011044452A (ja) * 2009-08-19 2011-03-03 Denso Corp 電子装置およびその製造方法

Also Published As

Publication number Publication date
TWI523157B (zh) 2016-02-21
WO2011071603A3 (en) 2011-09-29
US20110140262A1 (en) 2011-06-16
US8304887B2 (en) 2012-11-06
CN102576702A (zh) 2012-07-11
CN102576702B (zh) 2015-11-25
WO2011071603A2 (en) 2011-06-16
TW201126659A (en) 2011-08-01

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