JP2013513942A5 - - Google Patents
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- Publication number
- JP2013513942A5 JP2013513942A5 JP2012543100A JP2012543100A JP2013513942A5 JP 2013513942 A5 JP2013513942 A5 JP 2013513942A5 JP 2012543100 A JP2012543100 A JP 2012543100A JP 2012543100 A JP2012543100 A JP 2012543100A JP 2013513942 A5 JP2013513942 A5 JP 2013513942A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- substrate
- circuit package
- die attach
- metal clip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/635,624 | 2009-12-10 | ||
| US12/635,624 US8304887B2 (en) | 2009-12-10 | 2009-12-10 | Module package with embedded substrate and leadframe |
| PCT/US2010/053974 WO2011071603A2 (en) | 2009-12-10 | 2010-10-25 | Module package with embedded substrate and leadframe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013513942A JP2013513942A (ja) | 2013-04-22 |
| JP2013513942A5 true JP2013513942A5 (enExample) | 2013-11-28 |
Family
ID=44141994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012543100A Pending JP2013513942A (ja) | 2009-12-10 | 2010-10-25 | 埋め込まれた基板及びリードフレームを備えたモジュールパッケージ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8304887B2 (enExample) |
| JP (1) | JP2013513942A (enExample) |
| CN (1) | CN102576702B (enExample) |
| TW (1) | TWI523157B (enExample) |
| WO (1) | WO2011071603A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9035435B2 (en) * | 2012-11-14 | 2015-05-19 | Power Integrations, Inc. | Magnetically coupled galvanically isolated communication using lead frame |
| US8884414B2 (en) | 2013-01-09 | 2014-11-11 | Texas Instruments Incorporated | Integrated circuit module with dual leadframe |
| US9253910B2 (en) * | 2013-01-30 | 2016-02-02 | Texas Instruments Incorporated | Circuit assembly |
| CN104037149A (zh) | 2013-03-05 | 2014-09-10 | 飞思卡尔半导体公司 | 引线框和基板半导体封装 |
| US10163808B2 (en) * | 2015-10-22 | 2018-12-25 | Avago Technologies International Sales Pte. Limited | Module with embedded side shield structures and method of fabricating the same |
| US10134682B2 (en) | 2015-10-22 | 2018-11-20 | Avago Technologies International Sales Pte. Limited | Circuit package with segmented external shield to provide internal shielding between electronic components |
| DE102016208782A1 (de) * | 2016-05-20 | 2017-11-23 | Continental Teves Ag & Co. Ohg | Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement |
| CN107946267B (zh) * | 2017-11-23 | 2020-03-06 | 华进半导体封装先导技术研发中心有限公司 | 一种芯片结构及制作方法 |
| CN108336056B (zh) * | 2018-04-12 | 2024-06-04 | 苏州震坤科技有限公司 | 用于半导体封装结构的万用转接电路层 |
| US11735541B2 (en) * | 2018-06-28 | 2023-08-22 | Murata Manufacturing Co., Ltd. | Semiconductor device with protective protrusion |
| EP3874596A1 (en) * | 2018-10-30 | 2021-09-08 | Excelitas Canada Inc. | High speed switching circuit configuration |
| US12176274B2 (en) * | 2018-11-26 | 2024-12-24 | Texas Instruments Incorporated | Multi-die package with multiple heat channels |
| US20210082790A1 (en) * | 2019-09-18 | 2021-03-18 | Alpha And Omega Semiconductor (Cayman) Ltd. | Power semiconductor package having integrated inductor and method of making the same |
| US12055633B2 (en) * | 2020-08-25 | 2024-08-06 | Lumentum Operations Llc | Package for a time of flight device |
| CN113130454B (zh) * | 2021-04-12 | 2024-07-05 | 长沙新雷半导体科技有限公司 | 一种芯片封装装置、电子模组及电子设备 |
| IL310996A (en) * | 2021-08-26 | 2024-04-01 | Vishay Gen Semiconductor Llc | Packaging with increased cooling for improved heat management for electrical components |
| CN113793843B (zh) * | 2021-09-30 | 2024-07-30 | 重庆平创半导体研究院有限责任公司 | 一种抗辐照封装结构及方法 |
| US12125771B2 (en) | 2021-12-08 | 2024-10-22 | Nxp B.V. | Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof |
| US11910530B2 (en) * | 2022-03-25 | 2024-02-20 | Tactotek Oy | Method for manufacturing electronics assembly and electronics assembly |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5266834A (en) | 1989-03-13 | 1993-11-30 | Hitachi Ltd. | Semiconductor device and an electronic device with the semiconductor devices mounted thereon |
| US5340771A (en) * | 1993-03-18 | 1994-08-23 | Lsi Logic Corporation | Techniques for providing high I/O count connections to semiconductor dies |
| JP3003638B2 (ja) * | 1997-08-05 | 2000-01-31 | 日本電気株式会社 | 半導体装置、その製造方法 |
| JPH11312770A (ja) | 1998-04-28 | 1999-11-09 | Mitsumi Electric Co Ltd | 薄型ｉｃの放熱フィン |
| JP3674333B2 (ja) * | 1998-09-11 | 2005-07-20 | 株式会社日立製作所 | パワー半導体モジュール並びにそれを用いた電動機駆動システム |
| US6856007B2 (en) | 2001-08-28 | 2005-02-15 | Tessera, Inc. | High-frequency chip packages |
| AU2003299866A1 (en) * | 2003-02-25 | 2004-09-28 | Tessera, Inc. | High frequency chip packages with connecting elements |
| US7880282B2 (en) | 2003-12-18 | 2011-02-01 | Rf Module & Optical Design Ltd. | Semiconductor package with integrated heatsink and electromagnetic shield |
| JP2006310821A (ja) * | 2005-03-30 | 2006-11-09 | Sanyo Electric Co Ltd | 半導体モジュールおよびその製造方法 |
| JP4821537B2 (ja) * | 2006-09-26 | 2011-11-24 | 株式会社デンソー | 電子制御装置 |
| JP2009071234A (ja) * | 2007-09-18 | 2009-04-02 | Denso Corp | 半導体装置 |
| JP5233341B2 (ja) | 2008-03-17 | 2013-07-10 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2011044452A (ja) * | 2009-08-19 | 2011-03-03 | Denso Corp | 電子装置およびその製造方法 |
-
2009
- 2009-12-10 US US12/635,624 patent/US8304887B2/en active Active
-
2010
- 2010-10-25 WO PCT/US2010/053974 patent/WO2011071603A2/en not_active Ceased
- 2010-10-25 JP JP2012543100A patent/JP2013513942A/ja active Pending
- 2010-10-25 CN CN201080042885.1A patent/CN102576702B/zh active Active
- 2010-11-12 TW TW099138958A patent/TWI523157B/zh active
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