CN102576702B - 具有嵌入式衬底及引线框的模块封装 - Google Patents

具有嵌入式衬底及引线框的模块封装 Download PDF

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Publication number
CN102576702B
CN102576702B CN201080042885.1A CN201080042885A CN102576702B CN 102576702 B CN102576702 B CN 102576702B CN 201080042885 A CN201080042885 A CN 201080042885A CN 102576702 B CN102576702 B CN 102576702B
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China
Prior art keywords
substrate
integrated circuit
lead
metal clip
electric devices
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CN201080042885.1A
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English (en)
Chinese (zh)
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CN102576702A (zh
Inventor
李汉明@尤金·李
光·义·禹
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National Semiconductor Corp
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National Semiconductor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201080042885.1A 2009-12-10 2010-10-25 具有嵌入式衬底及引线框的模块封装 Active CN102576702B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/635,624 2009-12-10
US12/635,624 US8304887B2 (en) 2009-12-10 2009-12-10 Module package with embedded substrate and leadframe
PCT/US2010/053974 WO2011071603A2 (en) 2009-12-10 2010-10-25 Module package with embedded substrate and leadframe

Publications (2)

Publication Number Publication Date
CN102576702A CN102576702A (zh) 2012-07-11
CN102576702B true CN102576702B (zh) 2015-11-25

Family

ID=44141994

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080042885.1A Active CN102576702B (zh) 2009-12-10 2010-10-25 具有嵌入式衬底及引线框的模块封装

Country Status (5)

Country Link
US (1) US8304887B2 (enExample)
JP (1) JP2013513942A (enExample)
CN (1) CN102576702B (enExample)
TW (1) TWI523157B (enExample)
WO (1) WO2011071603A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12125771B2 (en) 2021-12-08 2024-10-22 Nxp B.V. Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof

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US9035435B2 (en) * 2012-11-14 2015-05-19 Power Integrations, Inc. Magnetically coupled galvanically isolated communication using lead frame
US8884414B2 (en) 2013-01-09 2014-11-11 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US9253910B2 (en) * 2013-01-30 2016-02-02 Texas Instruments Incorporated Circuit assembly
CN104037149A (zh) 2013-03-05 2014-09-10 飞思卡尔半导体公司 引线框和基板半导体封装
US10163808B2 (en) * 2015-10-22 2018-12-25 Avago Technologies International Sales Pte. Limited Module with embedded side shield structures and method of fabricating the same
US10134682B2 (en) 2015-10-22 2018-11-20 Avago Technologies International Sales Pte. Limited Circuit package with segmented external shield to provide internal shielding between electronic components
DE102016208782A1 (de) * 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
CN107946267B (zh) * 2017-11-23 2020-03-06 华进半导体封装先导技术研发中心有限公司 一种芯片结构及制作方法
CN108336056B (zh) * 2018-04-12 2024-06-04 苏州震坤科技有限公司 用于半导体封装结构的万用转接电路层
US11735541B2 (en) * 2018-06-28 2023-08-22 Murata Manufacturing Co., Ltd. Semiconductor device with protective protrusion
EP3874596A1 (en) * 2018-10-30 2021-09-08 Excelitas Canada Inc. High speed switching circuit configuration
US12176274B2 (en) * 2018-11-26 2024-12-24 Texas Instruments Incorporated Multi-die package with multiple heat channels
US20210082790A1 (en) * 2019-09-18 2021-03-18 Alpha And Omega Semiconductor (Cayman) Ltd. Power semiconductor package having integrated inductor and method of making the same
US12055633B2 (en) * 2020-08-25 2024-08-06 Lumentum Operations Llc Package for a time of flight device
CN113130454B (zh) * 2021-04-12 2024-07-05 长沙新雷半导体科技有限公司 一种芯片封装装置、电子模组及电子设备
IL310996A (en) * 2021-08-26 2024-04-01 Vishay Gen Semiconductor Llc Packaging with increased cooling for improved heat management for electrical components
CN113793843B (zh) * 2021-09-30 2024-07-30 重庆平创半导体研究院有限责任公司 一种抗辐照封装结构及方法
US11910530B2 (en) * 2022-03-25 2024-02-20 Tactotek Oy Method for manufacturing electronics assembly and electronics assembly

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US5266834A (en) * 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
US5767570A (en) * 1993-03-18 1998-06-16 Lsi Logic Corporation Semiconductor packages for high I/O semiconductor dies

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JP3003638B2 (ja) * 1997-08-05 2000-01-31 日本電気株式会社 半導体装置、その製造方法
JPH11312770A (ja) 1998-04-28 1999-11-09 Mitsumi Electric Co Ltd 薄型ｉｃの放熱フィン
JP3674333B2 (ja) * 1998-09-11 2005-07-20 株式会社日立製作所 パワー半導体モジュール並びにそれを用いた電動機駆動システム
US6856007B2 (en) 2001-08-28 2005-02-15 Tessera, Inc. High-frequency chip packages
AU2003299866A1 (en) * 2003-02-25 2004-09-28 Tessera, Inc. High frequency chip packages with connecting elements
US7880282B2 (en) 2003-12-18 2011-02-01 Rf Module & Optical Design Ltd. Semiconductor package with integrated heatsink and electromagnetic shield
JP2006310821A (ja) * 2005-03-30 2006-11-09 Sanyo Electric Co Ltd 半導体モジュールおよびその製造方法
JP4821537B2 (ja) * 2006-09-26 2011-11-24 株式会社デンソー 電子制御装置
JP2009071234A (ja) * 2007-09-18 2009-04-02 Denso Corp 半導体装置
JP5233341B2 (ja) 2008-03-17 2013-07-10 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP2011044452A (ja) * 2009-08-19 2011-03-03 Denso Corp 電子装置およびその製造方法

Patent Citations (2)

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US5266834A (en) * 1989-03-13 1993-11-30 Hitachi Ltd. Semiconductor device and an electronic device with the semiconductor devices mounted thereon
US5767570A (en) * 1993-03-18 1998-06-16 Lsi Logic Corporation Semiconductor packages for high I/O semiconductor dies

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12125771B2 (en) 2021-12-08 2024-10-22 Nxp B.V. Semiconductor package having lead frame with semiconductor die and component module mounted on opposite surfaces of the lead frame and methods of manufacture thereof

Also Published As

Publication number Publication date
TWI523157B (zh) 2016-02-21
WO2011071603A3 (en) 2011-09-29
US20110140262A1 (en) 2011-06-16
US8304887B2 (en) 2012-11-06
CN102576702A (zh) 2012-07-11
WO2011071603A2 (en) 2011-06-16
TW201126659A (en) 2011-08-01
JP2013513942A (ja) 2013-04-22

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