JP2013513239A5 - - Google Patents
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- Publication number
- JP2013513239A5 JP2013513239A5 JP2012542101A JP2012542101A JP2013513239A5 JP 2013513239 A5 JP2013513239 A5 JP 2013513239A5 JP 2012542101 A JP2012542101 A JP 2012542101A JP 2012542101 A JP2012542101 A JP 2012542101A JP 2013513239 A5 JP2013513239 A5 JP 2013513239A5
- Authority
- JP
- Japan
- Prior art keywords
- showerhead
- gas
- zone
- chamber
- reconfigurable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007789 gas Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26682009P | 2009-12-04 | 2009-12-04 | |
| US61/266,820 | 2009-12-04 | ||
| US12/899,062 | 2010-10-06 | ||
| US12/899,062 US9540731B2 (en) | 2009-12-04 | 2010-10-06 | Reconfigurable multi-zone gas delivery hardware for substrate processing showerheads |
| PCT/US2010/057959 WO2011068730A2 (en) | 2009-12-04 | 2010-11-24 | Reconfigurable multi-zone gas delivery hardware for substrate processing showerheads |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013513239A JP2013513239A (ja) | 2013-04-18 |
| JP2013513239A5 true JP2013513239A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2014-01-16 |
| JP5933447B2 JP5933447B2 (ja) | 2016-06-08 |
Family
ID=44115461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012542101A Active JP5933447B2 (ja) | 2009-12-04 | 2010-11-24 | 基板処理シャワーヘッド用の再構成可能なマルチゾーンガス供給ハードウェア |
Country Status (6)
Families Citing this family (41)
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| US9657397B2 (en) * | 2013-12-31 | 2017-05-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
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| US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
| US10253412B2 (en) * | 2015-05-22 | 2019-04-09 | Lam Research Corporation | Deposition apparatus including edge plenum showerhead assembly |
| JP6054471B2 (ja) | 2015-05-26 | 2016-12-27 | 株式会社日本製鋼所 | 原子層成長装置および原子層成長装置排気部 |
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| JP5990626B1 (ja) * | 2015-05-26 | 2016-09-14 | 株式会社日本製鋼所 | 原子層成長装置 |
| JP6868616B2 (ja) * | 2015-10-08 | 2021-05-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 背面でのプラズマ点火が低減されたシャワーヘッド |
| KR102462931B1 (ko) | 2015-10-30 | 2022-11-04 | 삼성전자주식회사 | 가스 공급 유닛 및 기판 처리 장치 |
| US10780447B2 (en) * | 2016-04-26 | 2020-09-22 | Applied Materials, Inc. | Apparatus for controlling temperature uniformity of a showerhead |
| US11017984B2 (en) | 2016-04-28 | 2021-05-25 | Applied Materials, Inc. | Ceramic coated quartz lid for processing chamber |
| KR102553629B1 (ko) * | 2016-06-17 | 2023-07-11 | 삼성전자주식회사 | 플라즈마 처리 장치 |
| JP6696322B2 (ja) * | 2016-06-24 | 2020-05-20 | 東京エレクトロン株式会社 | ガス処理装置、ガス処理方法及び記憶媒体 |
| KR101941488B1 (ko) * | 2016-07-04 | 2019-01-23 | 세메스 주식회사 | 샤워 헤드 유닛 및 이를 가지는 기판 처리 장치 |
| US11694911B2 (en) * | 2016-12-20 | 2023-07-04 | Lam Research Corporation | Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead |
| JP6575641B1 (ja) * | 2018-06-28 | 2019-09-18 | 株式会社明電舎 | シャワーヘッドおよび処理装置 |
| JP2021532268A (ja) | 2018-07-31 | 2021-11-25 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | Cvdチャンバのためのガスボックス |
| CN111785604B (zh) * | 2019-04-04 | 2025-04-08 | 中微半导体设备(上海)股份有限公司 | 气体喷淋头、制作方法及包括气体喷淋头的等离子体装置 |
| US10954595B2 (en) | 2019-07-30 | 2021-03-23 | Applied Materials, Inc. | High power showerhead with recursive gas flow distribution |
| US11367594B2 (en) * | 2019-11-27 | 2022-06-21 | Applied Materials, Inc. | Multizone flow gasbox for processing chamber |
| US12180589B2 (en) * | 2020-06-24 | 2024-12-31 | Tokyo Electron Limited | Showerhead for process tool |
| WO2022051079A1 (en) * | 2020-09-02 | 2022-03-10 | Applied Materials, Inc. | Showerhead design to control stray deposition |
| US20220093361A1 (en) * | 2020-09-22 | 2022-03-24 | Applied Materials, Inc. | Showerhead assembly with recursive gas channels |
| US20220108891A1 (en) * | 2020-10-06 | 2022-04-07 | Applied Materials, Inc. | Modular zone control for a processing chamber |
| CN116508141A (zh) * | 2020-11-13 | 2023-07-28 | 应用材料公司 | 用于输送气体至工艺腔室的设备及系统 |
| JP7682377B2 (ja) * | 2021-08-25 | 2025-05-23 | アプライド マテリアルズ インコーポレイテッド | クランプ式デュアルチャネルシャワーヘッド |
| US12000046B1 (en) | 2021-12-29 | 2024-06-04 | Rolls-Royce High Temperature Composites, Inc. | Load assemblies for loading parts in a furnace |
| US11932941B1 (en) * | 2021-12-29 | 2024-03-19 | Rolls-Royce High Temperature Composites, Inc. | Load assemblies for loading parts in a furnace |
| US12078417B1 (en) | 2021-12-29 | 2024-09-03 | Rolls-Royce High Temperature Composites, Inc. | Load assemblies for loading parts in a furnace |
| JP7737775B2 (ja) * | 2022-02-14 | 2025-09-11 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7717015B2 (ja) * | 2022-03-18 | 2025-08-01 | 東京エレクトロン株式会社 | 上部電極及びプラズマ処理装置 |
| KR20250079152A (ko) * | 2022-10-06 | 2025-06-04 | 램 리써치 코포레이션 | 확산 접합된 다중 구역 가스 분산을 위한 샤워헤드 |
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| DE10045958B4 (de) * | 2000-09-16 | 2008-12-04 | Muegge Electronic Gmbh | Vorrichtung zum Leiten eines gasförmigen Mediums in eine und/oder aus einer Prozeßkammer |
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| KR20070021637A (ko) | 2005-08-19 | 2007-02-23 | 세메스 주식회사 | 샤워 헤드 및 샤워 헤드를 포함하는 기판 처리 장치 |
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| JP5463536B2 (ja) * | 2006-07-20 | 2014-04-09 | 北陸成型工業株式会社 | シャワープレート及びその製造方法、並びにそのシャワープレートを用いたプラズマ処理装置、プラズマ処理方法及び電子装置の製造方法 |
| US20080078746A1 (en) | 2006-08-15 | 2008-04-03 | Noriiki Masuda | Substrate processing system, gas supply unit, method of substrate processing, computer program, and storage medium |
| JP5211450B2 (ja) * | 2006-08-15 | 2013-06-12 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| DE502007001071D1 (de) * | 2007-03-05 | 2009-08-27 | Re | Beschichtungsanlage und Gasleitungssystem |
| JP5322254B2 (ja) * | 2007-06-29 | 2013-10-23 | 東京エレクトロン株式会社 | 真空処理装置及び真空処理方法並びに記憶媒体 |
| US20090133631A1 (en) * | 2007-11-23 | 2009-05-28 | Applied Materials Inc. | Coating device and method of producing an electrode assembly |
| TW200923125A (en) * | 2007-11-23 | 2009-06-01 | Applied Materials Inc | Coating device and method of producing an electrode assembly |
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2010
- 2010-10-06 US US12/899,062 patent/US9540731B2/en active Active
- 2010-11-24 JP JP2012542101A patent/JP5933447B2/ja active Active
- 2010-11-24 CN CN201080055127.3A patent/CN102640262B/zh not_active Expired - Fee Related
- 2010-11-24 WO PCT/US2010/057959 patent/WO2011068730A2/en active Application Filing
- 2010-11-24 KR KR1020127017429A patent/KR101438705B1/ko active Active
- 2010-12-03 TW TW099142151A patent/TWI502671B/zh active