JP2013255892A - 塗布装置 - Google Patents
塗布装置 Download PDFInfo
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- JP2013255892A JP2013255892A JP2012133501A JP2012133501A JP2013255892A JP 2013255892 A JP2013255892 A JP 2013255892A JP 2012133501 A JP2012133501 A JP 2012133501A JP 2012133501 A JP2012133501 A JP 2012133501A JP 2013255892 A JP2013255892 A JP 2013255892A
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- 239000011248 coating agent Substances 0.000 title claims abstract description 72
- 238000000576 coating method Methods 0.000 title claims abstract description 62
- 238000003384 imaging method Methods 0.000 claims abstract description 82
- 238000012937 correction Methods 0.000 claims abstract description 6
- 238000000926 separation method Methods 0.000 claims description 12
- 238000013459 approach Methods 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract 1
- 239000007767 bonding agent Substances 0.000 description 14
- 238000012545 processing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1021—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to presence or shape of target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1023—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to velocity of target, e.g. to web advancement rate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【解決手段】ワークW上に塗布剤を塗布する塗布手段2と、塗布手段2をワークWに対して接近離間する方向に移動させる接離方向駆動部15と、ワークWを撮像する撮像手段3と、撮像手段3によって得られた撮像データに基づいて塗布手段の塗布位置を補正する位置補正手段5とを備えた塗布装置において、撮像手段3を、接離方向駆動部15によって塗布手段2と一体的にワークWに対して接近離間する方向に移動可能に構成し、接離方向駆動部15を駆動させてワークWに対する撮像手段3の撮像距離を調整する制御部17を備える。
【選択図】図1
Description
図1に示すように、塗布装置1は、ワークWにペースト状の塗布剤を塗布する塗布手段2と、撮像手段であるカメラ3と、塗布手段2及びカメラ3を移動させる駆動手段4と、カメラ3によって得られた撮像データに基づいて塗布手段2の塗布位置を補正する位置補正手段5とを備えている。ここでは、塗布剤を、エポキシ樹脂やポリイミド樹脂などの樹脂接着剤としているが、銀ペーストやその他の塗布剤を用いることも可能である。
本実施形態では、接合剤の塗布予定箇所であるアイランド9上に接合剤の塗布を行う前に、まず、アイランド9の位置検出を行う。アイランド9の位置検出は、カメラ3によってアイランド9の画像を取り込み、それを画像処理系16で画像処理することによって行うが、このとき、カメラ3の撮像焦点がリードフレーム10(又はアイランド9)の表面に合っていない場合は、カメラ3の高さ調整を行う。具体的には、Z方向駆動部15を駆動させ、図2に示すリードフレーム10(又はアイランド9)に対するカメラ3の距離Aを撮像可能距離に設定する。
図5に示す実施形態では、固定フレーム8に2つのカメラ3を取り付けている。2つのカメラ3は、塗布手段2に対して図のY方向の両側に配設されている。この構成の場合、塗布手段2と2つのカメラ3をY方向に移動させることで、進行方向の前方のカメラ3でアイランド9の位置検出を行いつつ、塗布手段2で位置検出後のアイランド9に接合剤の塗布を行い、さらに、同時に後方のカメラ3で塗布状態の確認を行うことができる。
2 塗布手段
3 カメラ(撮像手段)
4 駆動手段
5 位置補正手段
9 アイランド
10 リードフレーム
15 Z方向駆動部(接離方向駆動部)
17 制御部
W ワーク
Claims (6)
- ワーク上に塗布剤を塗布する塗布手段と、前記塗布手段を前記ワークに対して接近離間する方向に移動させる接離方向駆動部と、前記ワークを撮像する撮像手段と、前記撮像手段によって得られた撮像データに基づいて前記塗布手段の塗布位置を補正する位置補正手段とを備えた塗布装置において、
前記撮像手段を、前記接離方向駆動部によって前記塗布手段と一体的に前記ワークに対して接近離間する方向に移動可能に構成し、
前記接離方向駆動部を駆動させて前記ワークに対する前記撮像手段の撮像距離を調整する制御部を備えることを特徴とする塗布装置。 - 前記制御部は、前記ワークの厚さ又は高さに基づき前記撮像距離を調整するように構成された請求項1に記載の塗布装置。
- 前記撮像手段の撮像方向を、前記ワークの表面に対して直交する方向に設定した請求項1又は2に記載の塗布装置。
- 前記ワークに対する前記撮像手段の距離を撮像可能距離に設定し、前記撮像手段によって前記ワーク上の塗布予定箇所を撮像してから、前記塗布手段を前記ワークから所定距離離れた待機位置に移動させ、当該待機位置から前記塗布手段を前記ワークに対して接離させて塗布剤を塗布するように制御する請求項1から3のいずれか1項に記載の塗布装置。
- 前記塗布手段によって塗布剤を塗布した後、再度、前記ワークに対する前記撮像手段の距離を撮像可能距離に設定し、前記撮像手段によって前記ワーク上の塗布済み箇所を撮像するように制御する請求項4に記載の塗布装置。
- 前記ワーク上の複数の塗布予定箇所のうち、一部のみを前記撮像手段によって撮像するように制御する請求項4又は5に記載の塗布装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012133501A JP5475059B2 (ja) | 2012-06-13 | 2012-06-13 | 塗布装置 |
PCT/JP2013/065810 WO2013187321A1 (ja) | 2012-06-13 | 2013-06-07 | 塗布装置 |
TW102120777A TWI507101B (zh) | 2012-06-13 | 2013-06-11 | 塗布裝置 |
Applications Claiming Priority (1)
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JP2012133501A JP5475059B2 (ja) | 2012-06-13 | 2012-06-13 | 塗布装置 |
Publications (2)
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JP2013255892A true JP2013255892A (ja) | 2013-12-26 |
JP5475059B2 JP5475059B2 (ja) | 2014-04-16 |
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JP2012133501A Active JP5475059B2 (ja) | 2012-06-13 | 2012-06-13 | 塗布装置 |
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JP (1) | JP5475059B2 (ja) |
TW (1) | TWI507101B (ja) |
WO (1) | WO2013187321A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105080799B (zh) * | 2014-05-19 | 2017-05-17 | 技鼎股份有限公司 | 具有胶量调整的点胶装置 |
KR20170137253A (ko) * | 2016-06-02 | 2017-12-13 | 주식회사 탑 엔지니어링 | 위치 조절 장치 및 이를 구비한 페이스트 디스펜서 |
CN106890764A (zh) * | 2017-03-15 | 2017-06-27 | 复旦大学 | 触控屏的边框胶涂胶设备 |
CN108816676B (zh) * | 2018-06-07 | 2023-04-28 | 上海天永智能装备股份有限公司 | 一种涂胶和摄像检测组合式的涂胶装置 |
CN108722785A (zh) * | 2018-07-18 | 2018-11-02 | 正雄箱包(河源)有限公司 | 一种数控智能悬臂点胶机 |
JP6988767B2 (ja) * | 2018-11-07 | 2022-01-05 | オムロン株式会社 | 塗布装置 |
CN114849968B (zh) * | 2020-01-20 | 2024-04-09 | 深圳硅基传感科技有限公司 | 滴涂设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001246299A (ja) * | 2000-03-07 | 2001-09-11 | Toshiba Corp | ぺースト塗布方法および実装装置 |
JP2002084060A (ja) * | 2000-09-07 | 2002-03-22 | Matsushita Electric Ind Co Ltd | 材料塗布方法および装置 |
JP2010026181A (ja) * | 2008-07-17 | 2010-02-04 | Shibaura Mechatronics Corp | 液滴塗布装置及び液滴塗布方法 |
JP2011258826A (ja) * | 2010-06-10 | 2011-12-22 | Elpida Memory Inc | 半導体装置の製造方法 |
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2012
- 2012-06-13 JP JP2012133501A patent/JP5475059B2/ja active Active
-
2013
- 2013-06-07 WO PCT/JP2013/065810 patent/WO2013187321A1/ja active Application Filing
- 2013-06-11 TW TW102120777A patent/TWI507101B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001246299A (ja) * | 2000-03-07 | 2001-09-11 | Toshiba Corp | ぺースト塗布方法および実装装置 |
JP2002084060A (ja) * | 2000-09-07 | 2002-03-22 | Matsushita Electric Ind Co Ltd | 材料塗布方法および装置 |
JP2010026181A (ja) * | 2008-07-17 | 2010-02-04 | Shibaura Mechatronics Corp | 液滴塗布装置及び液滴塗布方法 |
JP2011258826A (ja) * | 2010-06-10 | 2011-12-22 | Elpida Memory Inc | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
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TWI507101B (zh) | 2015-11-01 |
TW201412208A (zh) | 2014-03-16 |
JP5475059B2 (ja) | 2014-04-16 |
WO2013187321A1 (ja) | 2013-12-19 |
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