JP2013197547A - 半導体受光素子の製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 195
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000013078 crystal Substances 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000010931 gold Substances 0.000 claims description 53
- 238000005530 etching Methods 0.000 claims description 17
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims description 15
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 15
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 15
- 230000031700 light absorption Effects 0.000 claims description 11
- 239000011701 zinc Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 15
- 238000000605 extraction Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Abstract
【解決手段】 半導体受光素子の製造方法は、光の入射側に位置する一導電型半導体層と、前記光の入射側から2元混晶よりなる第1半導体層、3元以上の混晶よりなる第2半導体層、前記第2半導体層よりもエネルギギャップが小さい3元以上の混晶よりなる第3半導体層が順に設けられてなる反対導電型半導体層と、前記一導電型半導体層と前記反対導電型半導体層の間に設けられた光吸収層とよりなる半導体層構造を形成する第1工程と、前記第3半導体層に接する金属膜を形成する第2工程と、前記第2工程の後、熱処理を実施する第3工程とを有する。
【選択図】 図4
Description
図1(a)は、比較例に係る半導体受光素子200の模式的な断面図である。図1(a)に示すように、半導体受光素子200は、半導体基板201上において、n型半導体層202、i型半導体層203およびp型半導体層204がこの順に積層された構造を有する。p型半導体層204上において、リング状にコンタクト層205が積層されている。p型半導体層204は、i型半導体層203よりも小さい径を有する。i型半導体層203上かつp型半導体層204の側面には、n型半導体層206が配置されている。
図6は、反射ミラーの他の例を説明するための模式的な断面図である。図6に示すように、AR膜として機能する絶縁膜40を設けず、コンタクト層24およびTi/Pt層51がp型半導体層23上の略全面に設けられていてもよい。本変形例においては、コンタクト層24として、p型InGaAsPの第1層24a、p型InGaAsの第2層24b、および半導体とオーミック接触が可能な金属(例えば、Au/Zn/Au)の第3層24cをp型半導体層23側から順に積層させた積層体を用いる。InGaAsのエネルギギャップがInGaAsPよりも小さいため、ヘテロ障壁が緩和される。
11 レンズ
21 n型半導体層
22 i型半導体層
23 p型半導体層
24 コンタクト層
25 n型半導体層
26 拡散マスク
27 コンタクト層
40 絶縁膜
50a,50b 引出配線
51 Ti/Pt層
52 Auスパッタ層
53 Auめっき層
100 半導体受光素子
Claims (8)
- 光の入射側に位置する一導電型半導体層と、前記光の入射側から2元混晶よりなる第1半導体層、3元以上の混晶よりなる第2半導体層、前記第2半導体層よりもエネルギギャップが小さい3元以上の混晶よりなる第3半導体層が順に設けられてなる反対導電型半導体層と、前記一導電型半導体層と前記反対導電型半導体層の間に設けられた光吸収層とよりなる半導体層構造を形成する第1工程と、
前記第3半導体層に接する金属膜を形成する第2工程と、
前記第2工程の後、熱処理を実施する第3工程とを有することを特徴とする半導体受光素子の製造方法。 - 第1半導体層はInP、第2半導体層はInGaAsP、第3半導体層はInGaAsからなることを特徴とする請求項1記載の半導体受光素子の製造方法。
- 前記金属層は、第3半導体層側から順に金、亜鉛、金を積層することにより形成されることを特徴とする請求項2記載の半導体受光素子の製造方法。
- 前記熱処理の温度範囲は、350℃〜400℃であることを特徴とする請求項3記載の半導体受光素子の製造方法。
- 光の入射側から順に一導電型半導体層、光吸収層、反対導電型半導体層を成長する工程と、
前記反対導電型半導体層上に絶縁膜を形成する工程と、
前記絶縁膜の表面に選択エッチングマスクを形成する工程と、
前記選択エッチングマスクから露出した前記絶縁膜の厚みの一部あるいは全部をエッチングすることによって、前記絶縁膜の表面に凹凸を形成する工程と、
前記凹凸を含む前記絶縁膜の表面に金属膜を形成する工程と、を含むことを特徴とする半導体受光素子の製造方法。 - 一導電型半導体層、光吸収層、反対導電型半導体層を順に成長する工程と、
前記反対導電型半導体層上に絶縁膜を形成する工程と、
前記絶縁膜をエッチングすることによって、前記エッチングされた面内における前記絶縁膜表面の凹凸を前記エッチング前よりも大きくする工程と、
前記凹凸を含む前記絶縁膜の表面に金属膜を形成する工程と、を含むことを特徴とする半導体受光素子の製造方法。 - 前記絶縁膜は、窒化シリコン膜であることを特徴とする請求項5又は6記載の半導体受光素子の製造方法。
- 前記半導体受光素子は、裏面入射型受光素子であることを特徴とする請求項1〜7のいずれか一項に記載の半導体受光素子の製造方法。
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JP2012066398A JP6041120B2 (ja) | 2012-03-22 | 2012-03-22 | 半導体受光素子の製造方法 |
US13/838,241 US8940573B2 (en) | 2012-03-22 | 2013-03-15 | Method of manufacturing semiconductor light-receiving element |
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JP2005259829A (ja) * | 2004-03-10 | 2005-09-22 | Sumitomo Electric Ind Ltd | 裏面入射型受光素子アレイ |
JP2008153311A (ja) * | 2006-12-14 | 2008-07-03 | Sumitomo Electric Ind Ltd | 半導体受光素子、視界支援装置および生体医療装置 |
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JP2021119610A (ja) * | 2019-12-04 | 2021-08-12 | 株式会社東芝 | 光検出器およびこれを用いたライダー装置 |
JP7153106B2 (ja) | 2019-12-04 | 2022-10-13 | 株式会社東芝 | 光検出器およびこれを用いたライダー装置 |
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