JP2013187438A - 炭化珪素半導体装置およびその製造方法 - Google Patents
炭化珪素半導体装置およびその製造方法 Download PDFInfo
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- JP2013187438A JP2013187438A JP2012052546A JP2012052546A JP2013187438A JP 2013187438 A JP2013187438 A JP 2013187438A JP 2012052546 A JP2012052546 A JP 2012052546A JP 2012052546 A JP2012052546 A JP 2012052546A JP 2013187438 A JP2013187438 A JP 2013187438A
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- silicon carbide
- carbide semiconductor
- epitaxial layer
- semiconductor device
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Abstract
【解決手段】本発明は、n+型基板1と、n+型基板1上に形成された、n+型基板1より不純物濃度の低いドリフトエピタキシャル層2と、ドリフトエピタキシャル層2上に形成されたショットキー電極6と、ショットキー電極6の端部と、ドリフトエピタキシャル層2の端部および側面とを少なくとも覆って形成された、絶縁膜としてのPI8とを備える。
【選択図】図10
Description
<製造方法>
以下、本発明の炭化珪素半導体装置および炭化珪素半導体装置の製造方法の概要は、SiC−SBDを例に説明するとおよそ以下のとおりである。
本発明にかかる実施の形態によれば、炭化珪素半導体装置において、n+型基板1と、n+型基板1上に形成された、n+型基板1より不純物濃度の低いドリフトエピタキシャル層2と、ドリフトエピタキシャル層2上に形成されたショットキー電極6と、ショットキー電極6の端部と、ドリフトエピタキシャル層2の端部および側面とを少なくとも覆って形成された、絶縁膜としてのPI8とを備える。
<製造方法>
実施の形態1では、PI8形成前に、n+型基板1をブレードダイシングによりハーフカットして溝11を形成している。このようにすることにより、チップの角およびチップ側面もポリイミドを被覆させる構造を実現している。
なお、実施の形態1および2では、ショットキー電極としてTiを用いる場合について述べたが、他のNi、W、Mo等の金属を用いてもよい。
本発明にかかる実施の形態によれば、炭化珪素半導体装置の製造方法において、工程(c)が、n+型基板1下面をシートに固定し、n+型基板1下面までの深さの溝11を形成する工程である。
Claims (9)
- 炭化珪素半導体基板と、
前記炭化珪素半導体基板上に形成された、前記炭化珪素半導体基板より不純物濃度の低いエピタキシャル層と、
前記エピタキシャル層上に形成された電極と、
前記電極の端部と、前記エピタキシャル層の端部および側面とを少なくとも覆って形成された、絶縁膜とを備えることを特徴とする、
炭化珪素半導体装置。 - 前記絶縁膜が、前記エピタキシャル層近傍以外の前記炭化珪素半導体基板の側面を覆わないことを特徴とする、
請求項1に記載の炭化珪素半導体装置。 - 前記絶縁膜が、ポリイミドであることを特徴とする、
請求項1または2に記載の炭化珪素半導体装置。 - (a)炭化珪素半導体基板上に、前記炭化珪素半導体基板より不純物濃度の低いエピタキシャル層を形成する工程と、
(b)前記エピタキシャル層上に、複数の電極を形成する工程と、
(c)各前記電極に挟まれた前記エピタキシャル層上に、前記エピタキシャル層下面より深い溝を形成する工程と、
(d)前記電極の端部と、前記エピタキシャル層の端部および露出した側面とを少なくとも覆って、絶縁膜を形成する工程と、
(e)前記溝が形成された部分から、前記炭化珪素半導体基板を分断する工程とを備えることを特徴とする、
炭化珪素半導体装置の製造方法。 - 前記工程(c)が、前記エピタキシャル層下面、または、当該下面近傍の前記炭化珪素半導体基板までの深さの前記溝を形成する工程であることを特徴とする、
請求項4に記載の炭化珪素半導体装置の製造方法。 - 前記工程(c)が、前記炭化珪素半導体基板下面をシートに固定し、前記炭化珪素半導体基板下面までの深さの前記溝を形成する工程であることを特徴とする、
請求項4に記載の炭化珪素半導体装置の製造方法。 - 前記工程(e)が、前記シートに固定された前記炭化珪素半導体基板を、前記シートのエキスパンドによって分断する工程であることを特徴とする、
請求項6に記載の炭化珪素半導体装置の製造方法。 - (f)前記工程(d)の前に、前記炭化珪素半導体基板上および前記エピタキシャル層上を純水で洗浄する工程をさらに備えることを特徴とする、
請求項4〜7のいずれかに記載の炭化珪素半導体装置の製造方法。 - 前記工程(e)が、機械的ブレイクによって前記炭化珪素半導体基板を分断する工程であることを特徴とする、
請求項4、5、8のいずれかに記載の炭化珪素半導体装置の製造方法。
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US13/735,095 US9263525B2 (en) | 2012-03-09 | 2013-01-07 | Silicon carbide semiconductor device and manufacturing method thereof |
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WO2014185192A1 (ja) * | 2013-05-16 | 2014-11-20 | 住友電気工業株式会社 | 炭化珪素半導体装置および半導体モジュールの製造方法、ならびに炭化珪素半導体装置および半導体モジュール |
JP2018170305A (ja) * | 2017-03-29 | 2018-11-01 | Tdk株式会社 | 半導体装置 |
WO2018190271A1 (ja) * | 2017-04-14 | 2018-10-18 | 三菱電機株式会社 | 炭化珪素半導体装置、電力変換装置、炭化珪素半導体装置の製造方法、および電力変換装置の製造方法 |
JPWO2018190271A1 (ja) * | 2017-04-14 | 2019-11-07 | 三菱電機株式会社 | 炭化珪素半導体装置、電力変換装置、炭化珪素半導体装置の製造方法、および電力変換装置の製造方法 |
JP2020074382A (ja) * | 2018-01-09 | 2020-05-14 | ローム株式会社 | 半導体装置 |
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KR20130103359A (ko) | 2013-09-23 |
DE102013203528A1 (de) | 2013-09-12 |
CN103311317B (zh) | 2017-12-19 |
JP5914060B2 (ja) | 2016-05-11 |
US20130234160A1 (en) | 2013-09-12 |
DE102013203528B4 (de) | 2018-01-25 |
US9263525B2 (en) | 2016-02-16 |
CN103311317A (zh) | 2013-09-18 |
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