JP2013179300A5 - - Google Patents
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- JP2013179300A5 JP2013179300A5 JP2013059156A JP2013059156A JP2013179300A5 JP 2013179300 A5 JP2013179300 A5 JP 2013179300A5 JP 2013059156 A JP2013059156 A JP 2013059156A JP 2013059156 A JP2013059156 A JP 2013059156A JP 2013179300 A5 JP2013179300 A5 JP 2013179300A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013059156A JP5705254B2 (ja) | 2011-11-29 | 2013-03-21 | 封止材 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011260936 | 2011-11-29 | ||
JP2011260936 | 2011-11-29 | ||
JP2012019150 | 2012-01-31 | ||
JP2012019150 | 2012-01-31 | ||
JP2013059156A JP5705254B2 (ja) | 2011-11-29 | 2013-03-21 | 封止材 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013506388A Division JP5407007B2 (ja) | 2011-11-29 | 2012-06-25 | 発光デバイスの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015034589A Division JP5917739B2 (ja) | 2011-11-29 | 2015-02-24 | 蛍光体含有封止材の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013179300A JP2013179300A (ja) | 2013-09-09 |
JP2013179300A5 true JP2013179300A5 (ja) | 2014-09-11 |
JP5705254B2 JP5705254B2 (ja) | 2015-04-22 |
Family
ID=48535075
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013506388A Expired - Fee Related JP5407007B2 (ja) | 2011-11-29 | 2012-06-25 | 発光デバイスの製造方法 |
JP2013059156A Expired - Fee Related JP5705254B2 (ja) | 2011-11-29 | 2013-03-21 | 封止材 |
JP2015034589A Expired - Fee Related JP5917739B2 (ja) | 2011-11-29 | 2015-02-24 | 蛍光体含有封止材の製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013506388A Expired - Fee Related JP5407007B2 (ja) | 2011-11-29 | 2012-06-25 | 発光デバイスの製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015034589A Expired - Fee Related JP5917739B2 (ja) | 2011-11-29 | 2015-02-24 | 蛍光体含有封止材の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9006006B2 (ja) |
EP (2) | EP2787543B1 (ja) |
JP (3) | JP5407007B2 (ja) |
KR (2) | KR20140088088A (ja) |
CN (2) | CN104993036A (ja) |
TW (2) | TWI563694B (ja) |
WO (1) | WO2013080596A1 (ja) |
Families Citing this family (21)
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CN104685607B (zh) * | 2012-09-19 | 2017-09-15 | 应用材料公司 | 接合基板的方法 |
US20160032148A1 (en) * | 2013-03-15 | 2016-02-04 | Dow Corning Corporation | A method for making an optical assembly comprising depositing a solid silicone-containing hot melt composition in powder form and forming an encapsulant thereof |
JPWO2015056590A1 (ja) * | 2013-10-15 | 2017-03-09 | シャープ株式会社 | 実装基板、発光装置及び発光装置の製造方法 |
US9905737B2 (en) | 2014-01-21 | 2018-02-27 | Lumileds Llc | Hybrid chip-on-board LED module with patterned encapsulation |
US10103300B2 (en) * | 2014-05-21 | 2018-10-16 | Lumileds Llc | Method of attaching a lens to an LED module with high alignment accuracy |
EP3152619B1 (en) * | 2014-06-04 | 2018-03-28 | Dow Corning Corporation | Imprinting process of hot-melt type curable silicone composition for optical devices |
US10622522B2 (en) * | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
WO2016039593A1 (ko) * | 2014-09-12 | 2016-03-17 | 주식회사 세미콘라이트 | 반도체 발광소자의 제조 방법 |
EP3200250B1 (en) * | 2014-09-26 | 2020-09-02 | Toshiba Hokuto Electronics Corp. | Production method for light-emission module |
BR112015020761A2 (pt) * | 2014-09-27 | 2017-07-18 | Intel Corp | controle de empenamento de substrato com o uso de vidro temperado com aquecimento unidirecional |
US9627591B2 (en) * | 2015-02-25 | 2017-04-18 | Nichia Corporation | Mounting substrate and electronic device including the same |
WO2016136243A1 (ja) * | 2015-02-25 | 2016-09-01 | 東レ・ダウコーニング株式会社 | 硬化性粒状シリコーン組成物、およびその製造方法 |
KR102396332B1 (ko) * | 2015-09-22 | 2022-05-12 | 삼성전자주식회사 | Led 디스플레이용 미세간격 코팅부재 및 이를 이용한 코팅방법 |
WO2017136383A1 (en) * | 2016-02-02 | 2017-08-10 | Maintool SAS | Flexible electronic strip and its method for manufacture |
JP6394649B2 (ja) * | 2016-06-30 | 2018-09-26 | 日亜化学工業株式会社 | 発光装置の製造方法 |
US11047747B2 (en) | 2017-03-27 | 2021-06-29 | Firouzeh Sabri | Light weight flexible temperature sensor kit |
US10147787B1 (en) | 2017-05-31 | 2018-12-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure and manufacturing method thereof |
JP2019086129A (ja) * | 2017-11-09 | 2019-06-06 | 三菱重工業株式会社 | シール方法、組立体、及び組立体の製造方法 |
JP7095937B2 (ja) * | 2018-03-09 | 2022-07-05 | ミネベアミツミ株式会社 | 蛍光体シートの製造方法 |
JP7022285B2 (ja) * | 2019-07-02 | 2022-02-18 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
TWI720785B (zh) * | 2020-01-15 | 2021-03-01 | 東貝光電科技股份有限公司 | 微型led發光裝置及其製造方法 |
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JP2994219B2 (ja) * | 1994-05-24 | 1999-12-27 | シャープ株式会社 | 半導体デバイスの製造方法 |
JP4271747B2 (ja) | 1997-07-07 | 2009-06-03 | 株式会社朝日ラバー | 発光ダイオード用透光性被覆材及び蛍光カラー光源 |
US6623670B2 (en) | 1997-07-07 | 2003-09-23 | Asahi Rubber Inc. | Method of molding a transparent coating member for light-emitting diodes |
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US6924596B2 (en) * | 2001-11-01 | 2005-08-02 | Nichia Corporation | Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
JP2003262701A (ja) * | 2002-03-08 | 2003-09-19 | Kanegafuchi Chem Ind Co Ltd | 光学材料用組成物、光学材料、それを用いた液晶表示装置、発光ダイオードおよびそれらの製造方法 |
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JP2005217369A (ja) * | 2004-02-02 | 2005-08-11 | Three M Innovative Properties Co | 発光ダイオード装置用接着シート及び発光ダイオード装置 |
TWI398188B (zh) * | 2004-08-31 | 2013-06-01 | Showa Denko Kk | A luminous body, and a lighting and display device using the luminous body |
JP2006140362A (ja) | 2004-11-15 | 2006-06-01 | Nitto Denko Corp | 光半導体素子封止用シートおよび該シートを用いた光半導体装置の製造方法 |
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JP2007235104A (ja) * | 2006-01-31 | 2007-09-13 | Toshiba Lighting & Technology Corp | 発光装置の製造方法および発光装置 |
JP5428122B2 (ja) * | 2006-05-11 | 2014-02-26 | 日亜化学工業株式会社 | 樹脂成型品とその成型方法、および、発光装置とその製造方法 |
US7709853B2 (en) | 2007-02-12 | 2010-05-04 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements |
JP2008300544A (ja) * | 2007-05-30 | 2008-12-11 | Sharp Corp | 発光装置およびその製造方法 |
JP5080881B2 (ja) | 2007-06-27 | 2012-11-21 | ナミックス株式会社 | 発光ダイオードチップの封止体の製造方法 |
MY150038A (en) * | 2007-09-19 | 2013-11-29 | Toray Industries | Adhesive composition for electronic components, and adhesive sheet for electronic components using the same |
JP2009259868A (ja) * | 2008-04-11 | 2009-11-05 | Sharp Corp | 発光装置の色度調整方法および製造方法 |
JP2010027974A (ja) * | 2008-07-23 | 2010-02-04 | Sharp Corp | 発光装置の製造方法 |
EP2328994B1 (en) | 2008-09-16 | 2012-12-26 | Koninklijke Philips Electronics N.V. | Polymeric wavelength converting elements |
EP2196503B1 (en) | 2008-12-12 | 2015-02-18 | Nitto Denko Corporation | Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof |
JP2010159411A (ja) | 2008-12-12 | 2010-07-22 | Nitto Denko Corp | 半硬化状シリコーン樹脂シート |
JP5566088B2 (ja) | 2008-12-12 | 2014-08-06 | 日東電工株式会社 | 熱硬化性シリコーン樹脂用組成物 |
CN101834235B (zh) * | 2009-03-10 | 2013-01-16 | 亿光电子工业股份有限公司 | 发光二极管封装结构及其制作方法 |
JP4913858B2 (ja) * | 2009-04-14 | 2012-04-11 | 日東電工株式会社 | 熱硬化性シリコーン樹脂用組成物 |
JP2011082339A (ja) * | 2009-10-07 | 2011-04-21 | Nitto Denko Corp | 光半導体封止用キット |
JP5744386B2 (ja) * | 2009-10-07 | 2015-07-08 | 日東電工株式会社 | 光半導体封止材 |
JP5310536B2 (ja) * | 2009-12-25 | 2013-10-09 | 豊田合成株式会社 | 発光装置の製造方法 |
JP5894723B2 (ja) | 2009-12-29 | 2016-03-30 | 株式会社朝日ラバー | 半導体発光装置の製造方法 |
SG183402A1 (en) | 2010-02-19 | 2012-09-27 | Toray Industries | Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheet-shaped moldings, led package, light -emitting device, and process for production of led-mounted substrate |
JP5328705B2 (ja) | 2010-03-26 | 2013-10-30 | 日東電工株式会社 | シリコーン樹脂用組成物 |
JP5775375B2 (ja) * | 2010-07-27 | 2015-09-09 | 日東電工株式会社 | 発光ダイオード装置の製造方法 |
JP5767062B2 (ja) * | 2010-09-30 | 2015-08-19 | 日東電工株式会社 | 発光ダイオード封止材、および、発光ダイオード装置の製造方法 |
JP2012102167A (ja) | 2010-11-05 | 2012-05-31 | Nitto Denko Corp | シリコーン樹脂、封止材料および光半導体装置 |
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2012
- 2012-06-25 US US14/348,742 patent/US9006006B2/en not_active Expired - Fee Related
- 2012-06-25 EP EP12854299.0A patent/EP2787543B1/en not_active Not-in-force
- 2012-06-25 CN CN201510270212.6A patent/CN104993036A/zh active Pending
- 2012-06-25 EP EP15001377.9A patent/EP2924744B1/en not_active Not-in-force
- 2012-06-25 CN CN201280045615.5A patent/CN103814448B/zh not_active Expired - Fee Related
- 2012-06-25 KR KR1020147009111A patent/KR20140088088A/ko not_active Application Discontinuation
- 2012-06-25 JP JP2013506388A patent/JP5407007B2/ja not_active Expired - Fee Related
- 2012-06-25 KR KR1020147008816A patent/KR101404911B1/ko active IP Right Grant
- 2012-06-25 WO PCT/JP2012/066174 patent/WO2013080596A1/ja active Application Filing
- 2012-07-06 TW TW103108048A patent/TWI563694B/zh not_active IP Right Cessation
- 2012-07-06 TW TW101124507A patent/TWI435480B/zh not_active IP Right Cessation
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2013
- 2013-03-21 JP JP2013059156A patent/JP5705254B2/ja not_active Expired - Fee Related
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2015
- 2015-02-24 JP JP2015034589A patent/JP5917739B2/ja not_active Expired - Fee Related
- 2015-03-26 US US14/670,256 patent/US20150200341A1/en not_active Abandoned