JP2013143513A - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP2013143513A
JP2013143513A JP2012003692A JP2012003692A JP2013143513A JP 2013143513 A JP2013143513 A JP 2013143513A JP 2012003692 A JP2012003692 A JP 2012003692A JP 2012003692 A JP2012003692 A JP 2012003692A JP 2013143513 A JP2013143513 A JP 2013143513A
Authority
JP
Japan
Prior art keywords
vacuum
chamber
wafer
transfer
vacuum processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012003692A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013143513A5 (https=
Inventor
Ryoichi Isomura
僚一 磯村
Tsutomu Tauchi
勤 田内
Hideaki Kondo
英明 近藤
Michiaki Kobayashi
満知明 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2012003692A priority Critical patent/JP2013143513A/ja
Priority to TW101105092A priority patent/TWI471968B/zh
Priority to KR1020120015871A priority patent/KR101338229B1/ko
Priority to US13/409,371 priority patent/US20130183121A1/en
Priority to CN2012100545875A priority patent/CN103208441A/zh
Publication of JP2013143513A publication Critical patent/JP2013143513A/ja
Publication of JP2013143513A5 publication Critical patent/JP2013143513A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2012003692A 2012-01-12 2012-01-12 真空処理装置 Pending JP2013143513A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012003692A JP2013143513A (ja) 2012-01-12 2012-01-12 真空処理装置
TW101105092A TWI471968B (zh) 2012-01-12 2012-02-16 Vacuum processing device
KR1020120015871A KR101338229B1 (ko) 2012-01-12 2012-02-16 진공 처리 장치
US13/409,371 US20130183121A1 (en) 2012-01-12 2012-03-01 Vacuum processing apparatus
CN2012100545875A CN103208441A (zh) 2012-01-12 2012-03-05 真空处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012003692A JP2013143513A (ja) 2012-01-12 2012-01-12 真空処理装置

Publications (2)

Publication Number Publication Date
JP2013143513A true JP2013143513A (ja) 2013-07-22
JP2013143513A5 JP2013143513A5 (https=) 2015-02-26

Family

ID=48755623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012003692A Pending JP2013143513A (ja) 2012-01-12 2012-01-12 真空処理装置

Country Status (5)

Country Link
US (1) US20130183121A1 (https=)
JP (1) JP2013143513A (https=)
KR (1) KR101338229B1 (https=)
CN (1) CN103208441A (https=)
TW (1) TWI471968B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015122502A (ja) * 2013-12-20 2015-07-02 ユ−ジーン テクノロジー カンパニー．リミテッド 基板処理モジュール、これを含む基板処理装置及び基板搬送方法
JP2016213393A (ja) * 2015-05-13 2016-12-15 株式会社日立ハイテクノロジーズ 真空処理装置およびその運転方法
JP2017228626A (ja) * 2016-06-22 2017-12-28 株式会社日立ハイテクノロジーズ 真空処理装置およびその運転方法
JP2023121571A (ja) * 2022-02-21 2023-08-31 東京エレクトロン株式会社 基板処理システム、基板処理方法及び記録媒体

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置
US9117865B2 (en) * 2012-04-12 2015-08-25 Applied Materials, Inc. Robot systems, apparatus, and methods having independently rotatable waists
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
JP6002532B2 (ja) * 2012-10-10 2016-10-05 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
KR102238649B1 (ko) * 2014-09-16 2021-04-09 삼성전자주식회사 반도체 칩 본딩 장치
US10062599B2 (en) * 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
SG11201901208RA (en) * 2016-10-18 2019-05-30 Mattson Tech Inc Systems and methods for workpiece processing
US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
CN109936340A (zh) * 2017-12-19 2019-06-25 成都晶宝时频技术股份有限公司 一种石英谐振器连续微调系统及方法
US11077535B2 (en) * 2018-02-14 2021-08-03 Samsung Electronics Co., Ltd. Process system having locking pin and locking pin
DE102018113786A1 (de) * 2018-06-08 2019-12-12 Vat Holding Ag Waferübergabeeinheit und Waferübergabesystem
US11293551B2 (en) 2018-09-30 2022-04-05 ColdQuanta, Inc. Break-seal system with breakable-membrane bridging rings
CN113380680A (zh) * 2020-03-10 2021-09-10 上海临港凯世通半导体有限公司 硅片输运装置
KR102515863B1 (ko) 2020-03-24 2023-03-31 주식회사 히타치하이테크 진공 처리 장치
CN211879343U (zh) * 2020-04-10 2020-11-06 北京北方华创微电子装备有限公司 一种半导体加工设备
US12062564B2 (en) * 2020-09-25 2024-08-13 Hitachi High-Tech Corporation Operating method of vacuum processing apparatus
WO2025230551A1 (en) * 2024-04-30 2025-11-06 Brooks Automation Us, Llc Substrate processing apparatus with substrate feed through bypass and method therefor
CN119108320A (zh) * 2024-11-07 2024-12-10 深圳市柠檬光子科技有限公司 真空存储装置及真空存储方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010147250A (ja) * 2008-12-18 2010-07-01 Hitachi Kokusai Electric Inc 基板処理装置
JP2010192571A (ja) * 2009-02-17 2010-09-02 Tokyo Electron Ltd 基板処理システム及び基板搬送方法
JP2011124496A (ja) * 2009-12-14 2011-06-23 Hitachi High-Technologies Corp 半導体処理システム及びプログラム
JP2011124564A (ja) * 2009-11-12 2011-06-23 Hitachi High-Technologies Corp 半導体被処理基板の真空処理システム及び半導体被処理基板の真空処理方法

Family Cites Families (9)

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KR100267617B1 (ko) * 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
CN1902031A (zh) * 2003-11-10 2007-01-24 布卢希弗特科技公司 用于处理基于真空的半导体处理系统中的工件的方法和系统
US7486498B2 (en) * 2004-01-12 2009-02-03 Case Western Reserve University Strong substrate alloy and compressively stressed dielectric film for capacitor with high energy density
KR100839191B1 (ko) * 2007-03-28 2008-06-17 세메스 주식회사 기판 처리 장치 및 방법
CN101855717B (zh) * 2007-11-09 2011-10-19 佳能安内华股份有限公司 在线型晶圆输送装置
JP2011091334A (ja) * 2009-10-26 2011-05-06 Ulvac Japan Ltd 基板処理装置
TW201123340A (en) * 2009-11-12 2011-07-01 Hitachi High Tech Corp Vacuum processing system and vacuum processing method of semiconductor processing substrate
JP5476162B2 (ja) * 2010-03-02 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置及びプログラム
JP2012009519A (ja) * 2010-06-23 2012-01-12 Hitachi High-Technologies Corp 真空処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010147250A (ja) * 2008-12-18 2010-07-01 Hitachi Kokusai Electric Inc 基板処理装置
JP2010192571A (ja) * 2009-02-17 2010-09-02 Tokyo Electron Ltd 基板処理システム及び基板搬送方法
JP2011124564A (ja) * 2009-11-12 2011-06-23 Hitachi High-Technologies Corp 半導体被処理基板の真空処理システム及び半導体被処理基板の真空処理方法
JP2011124496A (ja) * 2009-12-14 2011-06-23 Hitachi High-Technologies Corp 半導体処理システム及びプログラム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015122502A (ja) * 2013-12-20 2015-07-02 ユ−ジーン テクノロジー カンパニー．リミテッド 基板処理モジュール、これを含む基板処理装置及び基板搬送方法
JP2016213393A (ja) * 2015-05-13 2016-12-15 株式会社日立ハイテクノロジーズ 真空処理装置およびその運転方法
JP2017228626A (ja) * 2016-06-22 2017-12-28 株式会社日立ハイテクノロジーズ 真空処理装置およびその運転方法
JP2023121571A (ja) * 2022-02-21 2023-08-31 東京エレクトロン株式会社 基板処理システム、基板処理方法及び記録媒体
JP7803631B2 (ja) 2022-02-21 2026-01-21 東京エレクトロン株式会社 基板処理システム、基板処理方法及び記録媒体

Also Published As

Publication number Publication date
KR20130083355A (ko) 2013-07-22
CN103208441A (zh) 2013-07-17
KR101338229B1 (ko) 2013-12-06
US20130183121A1 (en) 2013-07-18
TWI471968B (zh) 2015-02-01
TW201330163A (zh) 2013-07-16

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