CN103208441A - 真空处理装置 - Google Patents

真空处理装置 Download PDF

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Publication number
CN103208441A
CN103208441A CN2012100545875A CN201210054587A CN103208441A CN 103208441 A CN103208441 A CN 103208441A CN 2012100545875 A CN2012100545875 A CN 2012100545875A CN 201210054587 A CN201210054587 A CN 201210054587A CN 103208441 A CN103208441 A CN 103208441A
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CN
China
Prior art keywords
aforementioned
vacuum
chamber
wafer
vacuum processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012100545875A
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English (en)
Chinese (zh)
Inventor
矶村僚一
田内勤
近藤英明
小林满知明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN103208441A publication Critical patent/CN103208441A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN2012100545875A 2012-01-12 2012-03-05 真空处理装置 Pending CN103208441A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-003692 2012-01-12
JP2012003692A JP2013143513A (ja) 2012-01-12 2012-01-12 真空処理装置

Publications (1)

Publication Number Publication Date
CN103208441A true CN103208441A (zh) 2013-07-17

Family

ID=48755623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012100545875A Pending CN103208441A (zh) 2012-01-12 2012-03-05 真空处理装置

Country Status (5)

Country Link
US (1) US20130183121A1 (https=)
JP (1) JP2013143513A (https=)
KR (1) KR101338229B1 (https=)
CN (1) CN103208441A (https=)
TW (1) TWI471968B (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109936340A (zh) * 2017-12-19 2019-06-25 成都晶宝时频技术股份有限公司 一种石英谐振器连续微调系统及方法
CN110577082A (zh) * 2018-06-08 2019-12-17 徽拓真空阀门有限公司 晶片传送单元和晶片传送系统
CN113380680A (zh) * 2020-03-10 2021-09-10 上海临港凯世通半导体有限公司 硅片输运装置
WO2021204050A1 (zh) * 2020-04-10 2021-10-14 北京北方华创微电子装备有限公司 一种半导体加工设备
CN114568036A (zh) * 2020-09-25 2022-05-31 株式会社日立高新技术 真空处理装置的运转方法
CN119108320A (zh) * 2024-11-07 2024-12-10 深圳市柠檬光子科技有限公司 真空存储装置及真空存储方法

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JP5785712B2 (ja) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ 真空処理装置
US9117865B2 (en) * 2012-04-12 2015-08-25 Applied Materials, Inc. Robot systems, apparatus, and methods having independently rotatable waists
JP2014036025A (ja) * 2012-08-07 2014-02-24 Hitachi High-Technologies Corp 真空処理装置または真空処理装置の運転方法
JP6002532B2 (ja) * 2012-10-10 2016-10-05 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
KR101530024B1 (ko) * 2013-12-20 2015-06-22 주식회사 유진테크 기판 처리 모듈, 이를 포함하는 기판 처리 장치 및 기판 전달 방법
KR102238649B1 (ko) * 2014-09-16 2021-04-09 삼성전자주식회사 반도체 칩 본딩 장치
JP6430889B2 (ja) * 2015-05-13 2018-11-28 株式会社日立ハイテクノロジーズ 真空処理装置およびその運転方法
US10062599B2 (en) * 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
JP6718755B2 (ja) * 2016-06-22 2020-07-08 株式会社日立ハイテク 真空処理装置およびその運転方法
SG11201901208RA (en) * 2016-10-18 2019-05-30 Mattson Tech Inc Systems and methods for workpiece processing
US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
US11077535B2 (en) * 2018-02-14 2021-08-03 Samsung Electronics Co., Ltd. Process system having locking pin and locking pin
US11293551B2 (en) 2018-09-30 2022-04-05 ColdQuanta, Inc. Break-seal system with breakable-membrane bridging rings
KR102515863B1 (ko) 2020-03-24 2023-03-31 주식회사 히타치하이테크 진공 처리 장치
JP7803631B2 (ja) * 2022-02-21 2026-01-21 東京エレクトロン株式会社 基板処理システム、基板処理方法及び記録媒体
WO2025230551A1 (en) * 2024-04-30 2025-11-06 Brooks Automation Us, Llc Substrate processing apparatus with substrate feed through bypass and method therefor

Citations (3)

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Publication number Priority date Publication date Assignee Title
CN1902031A (zh) * 2003-11-10 2007-01-24 布卢希弗特科技公司 用于处理基于真空的半导体处理系统中的工件的方法和系统
US20110110751A1 (en) * 2009-11-12 2011-05-12 Susumu Tauchi Vacuum processing system and vacuum processing method of semiconductor processing substrate
US20110318143A1 (en) * 2010-06-23 2011-12-29 Hitachi High-Technologies Corporation Vacuum processing apparatus

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KR100267617B1 (ko) * 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
US7486498B2 (en) * 2004-01-12 2009-02-03 Case Western Reserve University Strong substrate alloy and compressively stressed dielectric film for capacitor with high energy density
KR100839191B1 (ko) * 2007-03-28 2008-06-17 세메스 주식회사 기판 처리 장치 및 방법
CN101855717B (zh) * 2007-11-09 2011-10-19 佳能安内华股份有限公司 在线型晶圆输送装置
JP5384925B2 (ja) * 2008-12-18 2014-01-08 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5208800B2 (ja) * 2009-02-17 2013-06-12 東京エレクトロン株式会社 基板処理システム及び基板搬送方法
JP2011091334A (ja) * 2009-10-26 2011-05-06 Ulvac Japan Ltd 基板処理装置
TW201123340A (en) * 2009-11-12 2011-07-01 Hitachi High Tech Corp Vacuum processing system and vacuum processing method of semiconductor processing substrate
JP5282021B2 (ja) * 2009-12-14 2013-09-04 株式会社日立ハイテクノロジーズ 半導体処理システム及び半導体処理方法
JP5476162B2 (ja) * 2010-03-02 2014-04-23 株式会社日立ハイテクノロジーズ 真空処理装置及びプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1902031A (zh) * 2003-11-10 2007-01-24 布卢希弗特科技公司 用于处理基于真空的半导体处理系统中的工件的方法和系统
US20110110751A1 (en) * 2009-11-12 2011-05-12 Susumu Tauchi Vacuum processing system and vacuum processing method of semiconductor processing substrate
US20110318143A1 (en) * 2010-06-23 2011-12-29 Hitachi High-Technologies Corporation Vacuum processing apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109936340A (zh) * 2017-12-19 2019-06-25 成都晶宝时频技术股份有限公司 一种石英谐振器连续微调系统及方法
CN110577082A (zh) * 2018-06-08 2019-12-17 徽拓真空阀门有限公司 晶片传送单元和晶片传送系统
CN110577082B (zh) * 2018-06-08 2023-02-21 徽拓真空阀门有限公司 晶片传送单元和晶片传送系统
CN113380680A (zh) * 2020-03-10 2021-09-10 上海临港凯世通半导体有限公司 硅片输运装置
WO2021204050A1 (zh) * 2020-04-10 2021-10-14 北京北方华创微电子装备有限公司 一种半导体加工设备
US12278123B2 (en) 2020-04-10 2025-04-15 Beijing Naura Microelectronics Equipment Co., Ltd. Semiconductor processing apparatus
CN114568036A (zh) * 2020-09-25 2022-05-31 株式会社日立高新技术 真空处理装置的运转方法
CN119108320A (zh) * 2024-11-07 2024-12-10 深圳市柠檬光子科技有限公司 真空存储装置及真空存储方法

Also Published As

Publication number Publication date
KR20130083355A (ko) 2013-07-22
JP2013143513A (ja) 2013-07-22
KR101338229B1 (ko) 2013-12-06
US20130183121A1 (en) 2013-07-18
TWI471968B (zh) 2015-02-01
TW201330163A (zh) 2013-07-16

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