JP2013132756A - 積層体及びこれを用いた有機el素子、窓、太陽電池モジュール - Google Patents
積層体及びこれを用いた有機el素子、窓、太陽電池モジュール Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31623—Next to polyamide or polyimide
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- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
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- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
- Photovoltaic Devices (AREA)
Abstract
【解決手段】樹脂またはゴムを含む基材9と、前記基材の少なくとも一面に形成された酸化物ガラス10とを備えた積層体において、前記酸化物ガラスが、前記基材の軟化温度以下で軟化流動し、前記基材へ接着されている。又、前記酸化物ガラスが、Te、P、Vの少なくとも2種とAgを含有する。
【選択図】図7
Description
表1に示す組成を有するガラス(SPL−01〜25)を作製した。表中の組成は、各成分の酸化物換算における質量比率で表示してある。出発原料としては、(株)高純度化学研究所製の酸化物粉末(純度99.9%)を用いた。一部の試料においては、Ba源およびP源としてBa(PO3)2(リン酸バリウム、ラサ工業(株)製)を用いた。
上記で得られた各ガラス粉末に対して、示差熱分析(DTA)により軟化点Tsを測定した。DTA測定は、参照試料(α−アルミナ)および測定試料の質量をそれぞれ650mgとし、大気中5℃/minの昇温速度で行い、第2吸熱ピークのピーク温度を軟化点Tsとして求めた(図1参照)。結果を表1に併記する。
上述のように作製したガスバリア性フィルムを使用し、温度30℃、湿度90%RHの条件で、米国モコン(MOCON)株式会社製の酸素透過度測定装置(OX−TRAN(R)2/20)を使用し、圧力差0.1MPaの条件で酸素透過度を測定した。装置の測定限界は0.01cc/m2/dayである。
上述のように作製したガスバリア性フィルムを使用し、温度30℃、湿度90%RHの条件で、米国モコン(MOCON)株式会社製の透湿度測定装置(PERMATRAN(R)2/20)を使用し、圧力差0.1MPaの条件で水蒸気透過度を測定した。装置の測定限界は0.01g/m2/dayである。
2、10 酸化物ガラス層
3 スプレー
4 ガラス基板
5 金属カソード
6 有機EL層
7 ITO電極
8 積層体
9 ポリカーボネート基材
11 半導体レーザ
12 樹脂窓
13 アルミニウム枠
14 太陽電池セル
15 アルミ電極
16 バックシート
17 EVAシート
Claims (12)
- 樹脂またはゴムを含む基材と、前記基材の少なくとも一面に形成された酸化物ガラスとを備えた積層体において、前記酸化物ガラスが、前記基材の軟化温度以下で軟化流動し、前記基材へ接着されていることを特徴とする積層体。
- 請求項1において、前記酸化物ガラスが、Te、P、Vの少なくとも2種とAgを含有することを特徴とする積層体。
- 請求項2において、前記酸化物ガラスが、Te、V、Agを含有することを特徴とする積層体。
- 請求項3において、前記酸化物ガラスが、Ag2O、V2O5、TeO2を含有し、Ag2OとV2O5とTeO2との合計含有率が75質量%以上であることを特徴とする積層体。
- 請求項4において、前記酸化物ガラスが、10〜60質量%のAg2Oと、5〜65質量%のV2O5と、15〜50質量%のTeO2とを含有することを特徴とする積層体。
- 請求項5において、前記酸化物ガラスのAg2O含有率がV2O5含有率の2.6倍以下であることを特徴とする積層体。
- 請求項5において、前記酸化物ガラスのAg2O含有率とV2O5含有率との和が40〜80質量%であることを特徴とする積層体。
- 請求項1において、前記酸化物ガラスの厚みが500nm〜500μmであることを特徴とする積層体。
- 請求項1において、前記酸化物ガラスがレーザ照射により軟化流動し、前記基材へ接着されていることを特徴とする積層体。
- 請求項1に記載の積層体を封止用シートとした有機EL素子。
- 請求項1に記載の積層体を用いた窓。
- 請求項1に記載の積層体を封止用シートとした太陽電池モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011282621A JP5732381B2 (ja) | 2011-12-26 | 2011-12-26 | 積層体及びこれを用いた有機el素子、窓、太陽電池モジュール |
PCT/JP2012/080120 WO2013099479A1 (ja) | 2011-12-26 | 2012-11-21 | 積層体及びこれを用いた有機el素子、窓、太陽電池モジュール |
CN201280064588.6A CN104039547B (zh) | 2011-12-26 | 2012-11-21 | 层叠体及使用其的有机el元件、窗、太阳能电池组件 |
US14/369,056 US20150020879A1 (en) | 2011-12-26 | 2012-11-21 | Laminate and organic el element, window, and solar battery module using same |
TW101144464A TWI461290B (zh) | 2011-12-26 | 2012-11-28 | A laminated body and an organic EL element, a window, and a solar cell module using the same |
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JP2011282621A JP5732381B2 (ja) | 2011-12-26 | 2011-12-26 | 積層体及びこれを用いた有機el素子、窓、太陽電池モジュール |
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JP2013132756A true JP2013132756A (ja) | 2013-07-08 |
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US (1) | US20150020879A1 (ja) |
JP (1) | JP5732381B2 (ja) |
CN (1) | CN104039547B (ja) |
TW (1) | TWI461290B (ja) |
WO (1) | WO2013099479A1 (ja) |
Cited By (5)
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US9334415B2 (en) | 2012-01-26 | 2016-05-10 | Hitachi Industrial Equipment Systems Co., Ltd. | Ink, base to be printed, printing device, printing method, and method for producing base to be printed |
US9708460B2 (en) | 2011-12-26 | 2017-07-18 | Hitachi, Ltd. | Composite material |
WO2017126378A1 (ja) * | 2016-01-18 | 2017-07-27 | 株式会社日立製作所 | 無鉛ガラス組成物、ガラス複合材料、ガラスペースト、封止構造体、電気電子部品及び塗装部品 |
US9796821B2 (en) | 2011-12-26 | 2017-10-24 | Hitachi, Ltd. | Composite material |
US10252938B2 (en) | 2011-07-04 | 2019-04-09 | Hitachi, Ltd. | Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same |
Families Citing this family (1)
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JPWO2014102915A1 (ja) * | 2012-12-26 | 2017-01-12 | 株式会社日立製作所 | 低融点ガラス樹脂複合材料と、それを用いた電子・電気機器、アキシャルギャップモータ |
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- 2012-11-21 US US14/369,056 patent/US20150020879A1/en not_active Abandoned
- 2012-11-21 WO PCT/JP2012/080120 patent/WO2013099479A1/ja active Application Filing
- 2012-11-28 TW TW101144464A patent/TWI461290B/zh not_active IP Right Cessation
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US10252938B2 (en) | 2011-07-04 | 2019-04-09 | Hitachi, Ltd. | Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same |
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US10913680B2 (en) | 2016-01-18 | 2021-02-09 | Hitachi, Ltd. | Lead-free glass composition, glass composite material, glass paste, sealing structure, electrical/electronic component and coated component |
Also Published As
Publication number | Publication date |
---|---|
CN104039547A (zh) | 2014-09-10 |
TWI461290B (zh) | 2014-11-21 |
US20150020879A1 (en) | 2015-01-22 |
JP5732381B2 (ja) | 2015-06-10 |
WO2013099479A1 (ja) | 2013-07-04 |
TW201334960A (zh) | 2013-09-01 |
CN104039547B (zh) | 2015-11-25 |
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