JP2013131592A - リード端子およびこれを用いた半導体装置 - Google Patents

リード端子およびこれを用いた半導体装置 Download PDF

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Publication number
JP2013131592A
JP2013131592A JP2011279295A JP2011279295A JP2013131592A JP 2013131592 A JP2013131592 A JP 2013131592A JP 2011279295 A JP2011279295 A JP 2011279295A JP 2011279295 A JP2011279295 A JP 2011279295A JP 2013131592 A JP2013131592 A JP 2013131592A
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Prior art keywords
bonding
semiconductor device
lead terminal
main conductive
joint surface
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JP2011279295A
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Japanese (ja)
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JP2013131592A5 (enrdf_load_stackoverflow
Inventor
Hiroaki Tatsumi
裕章 巽
Kenichi Hayashi
建一 林
Taketsugu Otsu
健嗣 大津
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2011279295A priority Critical patent/JP2013131592A/ja
Publication of JP2013131592A publication Critical patent/JP2013131592A/ja
Publication of JP2013131592A5 publication Critical patent/JP2013131592A5/ja
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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  • Engineering & Computer Science (AREA)
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  • Pressure Welding/Diffusion-Bonding (AREA)
JP2011279295A 2011-12-21 2011-12-21 リード端子およびこれを用いた半導体装置 Pending JP2013131592A (ja)

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JP2011279295A JP2013131592A (ja) 2011-12-21 2011-12-21 リード端子およびこれを用いた半導体装置

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JP2011279295A JP2013131592A (ja) 2011-12-21 2011-12-21 リード端子およびこれを用いた半導体装置

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JP2013131592A5 JP2013131592A5 (enrdf_load_stackoverflow) 2014-01-09

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153966A (ja) * 2014-02-18 2015-08-24 三菱電機株式会社 半導体装置および半導体装置の製造方法
JPWO2016159070A1 (ja) * 2015-04-03 2017-06-22 三菱電機株式会社 半導体素子の接合方法及び半導体素子接合用シート状積層緩衝材
JP2019071448A (ja) * 2014-10-21 2019-05-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 電子装置、及び電子装置を製造する方法
CN112041972A (zh) * 2018-04-27 2020-12-04 日东电工株式会社 半导体装置制造方法
DE102022124463A1 (de) 2021-11-16 2023-05-17 Mitsubishi Electric Corporation Halbleitervorrichtung
WO2023190180A1 (ja) * 2022-03-30 2023-10-05 ローム株式会社 半導体装置
US12315838B2 (en) 2020-03-13 2025-05-27 Fuji Electric Co., Ltd. Wiring structure and semiconductor module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742967U (ja) * 1993-12-28 1995-08-11 新電元工業株式会社 樹脂封止型半導体装置
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2013135105A (ja) * 2011-12-27 2013-07-08 Mitsubishi Electric Corp 電力用半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0742967U (ja) * 1993-12-28 1995-08-11 新電元工業株式会社 樹脂封止型半導体装置
JP2008227131A (ja) * 2007-03-13 2008-09-25 Renesas Technology Corp 半導体装置及びその製造方法
JP2013135105A (ja) * 2011-12-27 2013-07-08 Mitsubishi Electric Corp 電力用半導体装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153966A (ja) * 2014-02-18 2015-08-24 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2019071448A (ja) * 2014-10-21 2019-05-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 電子装置、及び電子装置を製造する方法
JPWO2016159070A1 (ja) * 2015-04-03 2017-06-22 三菱電機株式会社 半導体素子の接合方法及び半導体素子接合用シート状積層緩衝材
CN112041972A (zh) * 2018-04-27 2020-12-04 日东电工株式会社 半导体装置制造方法
EP3787011A4 (en) * 2018-04-27 2022-06-08 Nitto Denko Corporation SEMICONDUCTOR DEVICE MANUFACTURING METHOD
US11594513B2 (en) 2018-04-27 2023-02-28 Nitto Denko Corporation Manufacturing method for semiconductor device
CN112041972B (zh) * 2018-04-27 2024-11-19 日东电工株式会社 半导体装置制造方法
US12315838B2 (en) 2020-03-13 2025-05-27 Fuji Electric Co., Ltd. Wiring structure and semiconductor module
DE102022124463A1 (de) 2021-11-16 2023-05-17 Mitsubishi Electric Corporation Halbleitervorrichtung
JP7657529B2 (ja) 2021-11-16 2025-04-07 三菱電機株式会社 半導体装置
WO2023190180A1 (ja) * 2022-03-30 2023-10-05 ローム株式会社 半導体装置

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