JP2013131592A5 - - Google Patents
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- Publication number
- JP2013131592A5 JP2013131592A5 JP2011279295A JP2011279295A JP2013131592A5 JP 2013131592 A5 JP2013131592 A5 JP 2013131592A5 JP 2011279295 A JP2011279295 A JP 2011279295A JP 2011279295 A JP2011279295 A JP 2011279295A JP 2013131592 A5 JP2013131592 A5 JP 2013131592A5
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- joint surface
- conductive portion
- semiconductor device
- main conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004065 semiconductor Substances 0.000 claims 14
- 239000000463 material Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 229910002601 GaN Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 229910000765 intermetallic Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011279295A JP2013131592A (ja) | 2011-12-21 | 2011-12-21 | リード端子およびこれを用いた半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011279295A JP2013131592A (ja) | 2011-12-21 | 2011-12-21 | リード端子およびこれを用いた半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013131592A JP2013131592A (ja) | 2013-07-04 |
| JP2013131592A5 true JP2013131592A5 (enrdf_load_stackoverflow) | 2014-01-09 |
Family
ID=48908934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011279295A Pending JP2013131592A (ja) | 2011-12-21 | 2011-12-21 | リード端子およびこれを用いた半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013131592A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6143687B2 (ja) * | 2014-02-18 | 2017-06-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| DE102014115319A1 (de) * | 2014-10-21 | 2016-04-21 | Osram Opto Semiconductors Gmbh | Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung |
| WO2016159070A1 (ja) * | 2015-04-03 | 2016-10-06 | 三菱電機株式会社 | 半導体素子の接合方法及び半導体素子接合用シート状積層緩衝材 |
| JP7228577B2 (ja) | 2018-04-27 | 2023-02-24 | 日東電工株式会社 | 半導体装置製造方法 |
| JP7524559B2 (ja) | 2020-03-13 | 2024-07-30 | 富士電機株式会社 | 配線構造及び半導体モジュール |
| JP7657529B2 (ja) | 2021-11-16 | 2025-04-07 | 三菱電機株式会社 | 半導体装置 |
| DE112023001273T5 (de) * | 2022-03-30 | 2025-02-27 | Rohm Co., Ltd. | Halbleitervorrichtung |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0742967U (ja) * | 1993-12-28 | 1995-08-11 | 新電元工業株式会社 | 樹脂封止型半導体装置 |
| JP2008227131A (ja) * | 2007-03-13 | 2008-09-25 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| JP5665729B2 (ja) * | 2011-12-27 | 2015-02-04 | 三菱電機株式会社 | 電力用半導体装置 |
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2011
- 2011-12-21 JP JP2011279295A patent/JP2013131592A/ja active Pending