JP2013109803A5 - - Google Patents

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Publication number
JP2013109803A5
JP2013109803A5 JP2011254039A JP2011254039A JP2013109803A5 JP 2013109803 A5 JP2013109803 A5 JP 2013109803A5 JP 2011254039 A JP2011254039 A JP 2011254039A JP 2011254039 A JP2011254039 A JP 2011254039A JP 2013109803 A5 JP2013109803 A5 JP 2013109803A5
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JP
Japan
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line
lines
insulating layer
region
hole
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JP2011254039A
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English (en)
Japanese (ja)
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JP2013109803A (ja
JP5924909B2 (ja
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Priority to JP2011254039A priority Critical patent/JP5924909B2/ja
Priority claimed from JP2011254039A external-priority patent/JP5924909B2/ja
Priority to US13/671,029 priority patent/US8969736B2/en
Priority to CN201210475558.6A priority patent/CN103140023B/zh
Publication of JP2013109803A publication Critical patent/JP2013109803A/ja
Publication of JP2013109803A5 publication Critical patent/JP2013109803A5/ja
Application granted granted Critical
Publication of JP5924909B2 publication Critical patent/JP5924909B2/ja
Active legal-status Critical Current
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JP2011254039A 2011-11-21 2011-11-21 配線回路基板およびその製造方法 Active JP5924909B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011254039A JP5924909B2 (ja) 2011-11-21 2011-11-21 配線回路基板およびその製造方法
US13/671,029 US8969736B2 (en) 2011-11-21 2012-11-07 Printed circuit board and method of manufacturing the same
CN201210475558.6A CN103140023B (zh) 2011-11-21 2012-11-21 布线电路基板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011254039A JP5924909B2 (ja) 2011-11-21 2011-11-21 配線回路基板およびその製造方法

Publications (3)

Publication Number Publication Date
JP2013109803A JP2013109803A (ja) 2013-06-06
JP2013109803A5 true JP2013109803A5 (enExample) 2013-07-18
JP5924909B2 JP5924909B2 (ja) 2016-05-25

Family

ID=48425713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011254039A Active JP5924909B2 (ja) 2011-11-21 2011-11-21 配線回路基板およびその製造方法

Country Status (3)

Country Link
US (1) US8969736B2 (enExample)
JP (1) JP5924909B2 (enExample)
CN (1) CN103140023B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5793849B2 (ja) * 2010-11-02 2015-10-14 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
JP2017021878A (ja) 2015-07-13 2017-01-26 日東電工株式会社 回路付きサスペンション基板集合体シート、その製造方法およびその検査方法
JP6949453B2 (ja) * 2015-07-24 2021-10-13 大日本印刷株式会社 電磁波シールド積層材および電磁波シールド回路基板
TWI620296B (zh) * 2015-08-14 2018-04-01 矽品精密工業股份有限公司 電子封裝件及其製法
US11818834B2 (en) * 2021-06-23 2023-11-14 Western Digital Technologies, Inc. Flexible printed circuit finger layout for low crosstalk

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5737152A (en) * 1995-10-27 1998-04-07 Quantum Corporation Suspension with multi-layered integrated conductor trace array for optimized electrical parameters
US5760995A (en) 1995-10-27 1998-06-02 Quantum Corporation Multi-drive, multi-magazine mass storage and retrieval unit for tape cartridges
CN1178985A (zh) * 1996-10-03 1998-04-15 昆腾公司 带有使电参数最佳化的多层集成导线迹线阵列的磁头悬架
US5796552A (en) 1996-10-03 1998-08-18 Quantum Corporation Suspension with biaxially shielded conductor trace array
US5717547A (en) 1996-10-03 1998-02-10 Quantum Corporation Multi-trace transmission lines for R/W head interconnect in hard disk drive
US5995328A (en) 1996-10-03 1999-11-30 Quantum Corporation Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters
JP4841272B2 (ja) * 2006-03-14 2011-12-21 日東電工株式会社 配線回路基板および配線回路基板の接続構造
JP5000451B2 (ja) 2007-10-15 2012-08-15 日東電工株式会社 配線回路基板
JP2009129490A (ja) * 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP5091719B2 (ja) * 2008-02-29 2012-12-05 日東電工株式会社 配線回路基板
JP4960918B2 (ja) * 2008-04-02 2012-06-27 日東電工株式会社 配線回路基板
JP5142951B2 (ja) * 2008-11-10 2013-02-13 日東電工株式会社 配線回路基板およびその製造方法
JP4547035B2 (ja) 2008-11-10 2010-09-22 日東電工株式会社 配線回路基板およびその製造方法
JP2010125754A (ja) * 2008-11-28 2010-06-10 Tombow Pencil Co Ltd 筆記具用ホルダー
JP2010146680A (ja) * 2008-12-22 2010-07-01 Hitachi Global Storage Technologies Netherlands Bv ヘッドスタックアッセンブリ及びそれを用いた磁気記憶装置
JP5328381B2 (ja) * 2009-01-08 2013-10-30 日東電工株式会社 磁気ヘッド駆動装置
JP5396145B2 (ja) * 2009-05-15 2014-01-22 日本発條株式会社 ディスク装置用フレキシャ
US8310789B2 (en) * 2009-12-22 2012-11-13 Hitachi Global Storage Technologies Netherlands B.V. Conductor suspension structure and electrical connection assembly for transmitting complementary signals in a hard disk drive
JP5484176B2 (ja) * 2010-04-26 2014-05-07 日東電工株式会社 配線回路基板およびその製造方法

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