JP2013098209A - 回路基板、電子デバイス、電子機器、及び回路基板の製造方法 - Google Patents

回路基板、電子デバイス、電子機器、及び回路基板の製造方法 Download PDF

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Publication number
JP2013098209A
JP2013098209A JP2011236931A JP2011236931A JP2013098209A JP 2013098209 A JP2013098209 A JP 2013098209A JP 2011236931 A JP2011236931 A JP 2011236931A JP 2011236931 A JP2011236931 A JP 2011236931A JP 2013098209 A JP2013098209 A JP 2013098209A
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JP
Japan
Prior art keywords
circuit board
recess
hole
insulating substrate
layer insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011236931A
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English (en)
Japanese (ja)
Other versions
JP2013098209A5 (enExample
Inventor
Hideyuki Sugano
英幸 菅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2011236931A priority Critical patent/JP2013098209A/ja
Priority to US13/652,685 priority patent/US20130107467A1/en
Priority to CN2012104177694A priority patent/CN103096619A/zh
Publication of JP2013098209A publication Critical patent/JP2013098209A/ja
Publication of JP2013098209A5 publication Critical patent/JP2013098209A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2011236931A 2011-10-28 2011-10-28 回路基板、電子デバイス、電子機器、及び回路基板の製造方法 Withdrawn JP2013098209A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011236931A JP2013098209A (ja) 2011-10-28 2011-10-28 回路基板、電子デバイス、電子機器、及び回路基板の製造方法
US13/652,685 US20130107467A1 (en) 2011-10-28 2012-10-16 Circuit substrate, electronic device, electronic apparatus, and method of manufacturing circuit substrate
CN2012104177694A CN103096619A (zh) 2011-10-28 2012-10-26 电路基板、电子装置、电子设备及电路基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011236931A JP2013098209A (ja) 2011-10-28 2011-10-28 回路基板、電子デバイス、電子機器、及び回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2013098209A true JP2013098209A (ja) 2013-05-20
JP2013098209A5 JP2013098209A5 (enExample) 2014-11-13

Family

ID=48172217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011236931A Withdrawn JP2013098209A (ja) 2011-10-28 2011-10-28 回路基板、電子デバイス、電子機器、及び回路基板の製造方法

Country Status (3)

Country Link
US (1) US20130107467A1 (enExample)
JP (1) JP2013098209A (enExample)
CN (1) CN103096619A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016157848A (ja) * 2015-02-25 2016-09-01 京セラ株式会社 セラミック配線基板および電子部品実装パッケージ
JP2018512724A (ja) * 2015-02-10 2018-05-17 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ 電子コンポーネントおよびその製造方法
JP2020098874A (ja) * 2018-12-19 2020-06-25 日本特殊陶業株式会社 配線基板およびその製造方法
JP2020199748A (ja) * 2019-06-13 2020-12-17 セイコーエプソン株式会社 配線基板、配線基板の製造方法、インクジェットヘッド、ｍｅｍｓデバイスおよび発振器

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109551A (ja) * 2013-12-04 2015-06-11 ソニー株式会社 チューナ装置
TWI554028B (zh) * 2014-11-25 2016-10-11 Oscillator package structure with temperature sensing element and its making method
JP2017139682A (ja) * 2016-02-05 2017-08-10 セイコーエプソン株式会社 振動片、振動片の製造方法、発振器、電子機器、移動体、および基地局
JP6332330B2 (ja) * 2016-05-20 2018-05-30 日亜化学工業株式会社 配線基体の製造方法及びそれを用いた発光装置の製造方法並びに配線基体及びそれを用いた発光装置。
JP7188454B2 (ja) * 2018-12-27 2022-12-13 株式会社大真空 圧電振動デバイス
JP7287116B2 (ja) * 2019-05-30 2023-06-06 セイコーエプソン株式会社 振動デバイスおよび電子機器
US11988727B1 (en) * 2019-07-31 2024-05-21 Hrl Laboratories, Llc Magnetostrictive MEMS magnetic gradiometer
JP7353156B2 (ja) * 2019-11-29 2023-09-29 日本電波工業株式会社 発振器

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367471U (enExample) * 1989-11-02 1991-07-01
JP2000216514A (ja) * 1999-01-27 2000-08-04 Matsushita Electric Ind Co Ltd 配線基板とその製造方法
JP2000302488A (ja) * 1999-04-23 2000-10-31 Seiko Epson Corp ガラスの微細穴加工方法
JP2003179456A (ja) * 2001-12-11 2003-06-27 Nippon Dempa Kogyo Co Ltd 水晶製品用表面実装容器及びこれを用いた水晶製品
JP2004253405A (ja) * 2002-12-24 2004-09-09 Noritake Co Ltd 膜埋込型基板の製造方法
JP2004363212A (ja) * 2003-06-03 2004-12-24 Hitachi Metals Ltd スルーホール導体を持った配線基板
JP2008085098A (ja) * 2006-09-28 2008-04-10 Kyocera Corp 配線基板および電子装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4202641B2 (ja) * 2001-12-26 2008-12-24 富士通株式会社 回路基板及びその製造方法
JP4033100B2 (ja) * 2003-09-29 2008-01-16 セイコーエプソン株式会社 圧電デバイスと圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
JP4311376B2 (ja) * 2005-06-08 2009-08-12 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法、電子部品、回路基板及び電子機器
JP2007288268A (ja) * 2006-04-12 2007-11-01 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP4240053B2 (ja) * 2006-04-24 2009-03-18 エプソントヨコム株式会社 圧電発振器とその製造方法
JP2009206506A (ja) * 2008-01-31 2009-09-10 Sanyo Electric Co Ltd 素子搭載用基板およびその製造方法、半導体モジュールおよびこれを搭載した携帯機器
CN101510538A (zh) * 2008-01-31 2009-08-19 三洋电机株式会社 元件搭载用基板及其制造方法、半导体组件及便携式设备
JP2010232806A (ja) * 2009-03-26 2010-10-14 Seiko Epson Corp 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367471U (enExample) * 1989-11-02 1991-07-01
JP2000216514A (ja) * 1999-01-27 2000-08-04 Matsushita Electric Ind Co Ltd 配線基板とその製造方法
JP2000302488A (ja) * 1999-04-23 2000-10-31 Seiko Epson Corp ガラスの微細穴加工方法
JP2003179456A (ja) * 2001-12-11 2003-06-27 Nippon Dempa Kogyo Co Ltd 水晶製品用表面実装容器及びこれを用いた水晶製品
JP2004253405A (ja) * 2002-12-24 2004-09-09 Noritake Co Ltd 膜埋込型基板の製造方法
JP2004363212A (ja) * 2003-06-03 2004-12-24 Hitachi Metals Ltd スルーホール導体を持った配線基板
JP2008085098A (ja) * 2006-09-28 2008-04-10 Kyocera Corp 配線基板および電子装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018512724A (ja) * 2015-02-10 2018-05-17 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉ Ｔｅｍｉｃ ｍｉｃｒｏｅｌｅｃｔｒｏｎｉｃ ＧｍｂＨ 電子コンポーネントおよびその製造方法
JP2016157848A (ja) * 2015-02-25 2016-09-01 京セラ株式会社 セラミック配線基板および電子部品実装パッケージ
JP2020098874A (ja) * 2018-12-19 2020-06-25 日本特殊陶業株式会社 配線基板およびその製造方法
JP7217142B2 (ja) 2018-12-19 2023-02-02 日本特殊陶業株式会社 配線基板およびその製造方法
JP2020199748A (ja) * 2019-06-13 2020-12-17 セイコーエプソン株式会社 配線基板、配線基板の製造方法、インクジェットヘッド、ｍｅｍｓデバイスおよび発振器
JP7302318B2 (ja) 2019-06-13 2023-07-04 セイコーエプソン株式会社 配線基板、配線基板の製造方法、インクジェットヘッド、ｍｅｍｓデバイスおよび発振器

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Publication number Publication date
CN103096619A (zh) 2013-05-08
US20130107467A1 (en) 2013-05-02

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