JP2013089763A - パワー半導体装置およびその製造方法 - Google Patents
パワー半導体装置およびその製造方法 Download PDFInfo
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Abstract
【解決手段】アルミニウムに微量のGd元素を添加したボンディングワイヤ(ワイヤ10)を用い、ボンディング接合部10aを200℃〜400℃の熱時効処理と、その後に冷却速度が1℃/min以下の徐冷を行なうことにより、200℃以上の高温環境に耐え、Gd添加のアルミニウムワイヤ(ワイヤ10)を有する低コストのパワー半導体装置およびその製造方法を提供することができる。
【選択図】 図5
Description
そのため、微量なGd(ガドリニウム)元素をAl(アルミニウム),Au(金),Ag(銀),Cu(銅)などに添加して高温環境に耐えるようにしたワイヤが特許文献1に記載されている。
また、特許文献2〜5では、ワイヤの主成分をAlとし、Gd元素を添加したボンディングワイヤを適用したパワー半導体装置については記載されていない。
<実施例1>
図1は、この発明の第1実施例のパワー半導体装置の要部断面図である。このパワー半導体装置100は、放熱ベース板1と、この放熱ベース板1上に高温半田などの接合材2で固着した導電パターン付き絶縁基板3とからなる。また、この導電パターン付き絶縁基板3の導電パターン4a上にドレイン電極6aが高温半田などの接合材8で固着したSiC−MOSFETチップ5aと、導電パターン付き絶縁基板3の導電パターン4a上にカソード電極6bが高温半田8で固着したSiC−ダイオードチップ5bとからなる。このSiC−MOSFETチップ5aとSiC−ダイオードチップ5bは互いに逆並列接続され、インバータ回路などの1アームとして用いられる。また、SiC−MOSFETチップ5aのソース電極7a、SiC−ダイオードチップ5bのアノード電極7bにボンディングで接続するGd元素添加のアルミニウムワイヤ(ワイヤ10)と、これらを収納し放熱ベース板1に固着するケース13からなる。前記したSiC半導体基板を用いた半導体チップ(SiC−MOSFETチップ5a,SiC−ダイオードチップ5b)のほかにGaN半導体基板などのワイドキャップ半導体基板を用いた半導体チップがある。また、このワイドギャップ半導体チップとSi半導体チップが混在して格納されたパワー半導体装置も対象である。
前記したパワー半導体装置は、例えば、ワイドギャップ素子であるSiC半導体基板やGaN半導体基板を用いて形成されるショットキーダイオード,pnダイオード,MOSFET,IGBTおよびバイポーラトランジスタなどである。しかし、Si半導体基板を用いた半導体素子に適用しても構わない。
<実施例2>
図2〜図5は、この発明の第2実施例のパワー半導体装置の製造方法を示し、工程順に示した要部製造工程断面図である。
2、8 高温半田
3 導電パターン付き絶縁基板
4a、4b 導電パターン
5 半導体チップ
5a SiC−MOSFETチップ
5b SiC−Diチップ
6 裏面電極
7 表面電極
7a ソース電極
7b アノード電極
9 外部導出端子
10 ワイヤ
11 加熱炉
12 N2雰囲気
13 ケース
14 ゲル
100 半導体装置
100a ユニット
Claims (5)
- 半導体チップの表面電極にボンディングワイヤがボンディングされるパワー半導体装置において、前記表面電極が、シリコン元素が添加されたアルミニウム膜であり前記ボンディングワイヤが、ガドリニウム元素が添加されたアルミニウムワイヤであり、前記ボンディングワイヤが前記表面電極に超音波振動でボンディングされることを特徴とするパワー半導体装置。
- 前記半導体チップがSiCチップもしくはGaNチップを含むワイドギャップ半導体チップであるかもしくは該ワイドギャップ半導体チップとSiチップが混在することを特徴とする請求項1に記載のパワー半導体装置。
- 前記ボンディングワイヤが、少なくとも0.005重量%〜1重量%のガドリニウム元素が添加されたアルミニウムワイヤであることを特徴とする請求項1に記載のパワー半導体装置。
- 前記表面電極が、0.5重量%〜3重量%のシリコン元素が添加されたアルミニウム膜であることを特徴とする請求項1または3に記載のパワー半導体装置。
- 半導体チップの表面電極にワイヤがボンディングされるパワー半導体装置の製造方法において、
前記表面電極である0.5重量%〜3重量%のシリコン元素が添加されたアルミニウム膜に0.005重量%〜1重量%のガドリニウム元素が添加されたアルミニウムワイヤが超音波振動でボンディングされる工程と、
前記アルミニウムワイヤと前記アルミニウム膜のボンディングされた接合部が、200℃〜400℃の高温で熱時効処理される工程と、
前記アルミニウムワイヤと前記アルミニウム膜のボンディングされた前記接合部が、不活性ガス雰囲気で、1℃/min以下の冷却速度で冷却される工程と、
を含むことを特徴とするパワー半導体装置の製造方法。
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JP2017011026A (ja) * | 2015-06-18 | 2017-01-12 | 株式会社デンソー | 半導体装置 |
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WO2016185666A1 (ja) * | 2015-05-18 | 2016-11-24 | 株式会社デンソー | 半導体装置 |
JP2016219532A (ja) * | 2015-05-18 | 2016-12-22 | 株式会社デンソー | 半導体装置 |
CN107534032A (zh) * | 2015-05-18 | 2018-01-02 | 株式会社电装 | 半导体装置 |
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CN111599796A (zh) * | 2019-02-20 | 2020-08-28 | 丰田自动车株式会社 | 半导体模块、及使用该半导体模块的电力变换装置 |
JP2020136516A (ja) * | 2019-02-20 | 2020-08-31 | トヨタ自動車株式会社 | 半導体モジュールとそれを用いた電力変換装置 |
JP7135930B2 (ja) | 2019-02-20 | 2022-09-13 | 株式会社デンソー | 半導体モジュールとそれを用いた電力変換装置 |
CN111599796B (zh) * | 2019-02-20 | 2023-09-08 | 株式会社电装 | 半导体模块、及使用该半导体模块的电力变换装置 |
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