JP2013080643A5 - - Google Patents

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Publication number
JP2013080643A5
JP2013080643A5 JP2011220611A JP2011220611A JP2013080643A5 JP 2013080643 A5 JP2013080643 A5 JP 2013080643A5 JP 2011220611 A JP2011220611 A JP 2011220611A JP 2011220611 A JP2011220611 A JP 2011220611A JP 2013080643 A5 JP2013080643 A5 JP 2013080643A5
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JP
Japan
Prior art keywords
processing apparatus
induction coil
processing chamber
plasma processing
vacuum processing
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Application number
JP2011220611A
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English (en)
Japanese (ja)
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JP2013080643A (ja
JP5856791B2 (ja
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Priority to JP2011220611A priority Critical patent/JP5856791B2/ja
Priority claimed from JP2011220611A external-priority patent/JP5856791B2/ja
Priority to US13/363,427 priority patent/US10541115B2/en
Publication of JP2013080643A publication Critical patent/JP2013080643A/ja
Publication of JP2013080643A5 publication Critical patent/JP2013080643A5/ja
Application granted granted Critical
Publication of JP5856791B2 publication Critical patent/JP5856791B2/ja
Priority to US16/669,711 priority patent/US10998168B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011220611A 2011-10-05 2011-10-05 プラズマ処理装置 Active JP5856791B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011220611A JP5856791B2 (ja) 2011-10-05 2011-10-05 プラズマ処理装置
US13/363,427 US10541115B2 (en) 2011-10-05 2012-02-01 Plasma processing apparatus
US16/669,711 US10998168B2 (en) 2011-10-05 2019-10-31 Plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011220611A JP5856791B2 (ja) 2011-10-05 2011-10-05 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2013080643A JP2013080643A (ja) 2013-05-02
JP2013080643A5 true JP2013080643A5 (enExample) 2014-10-09
JP5856791B2 JP5856791B2 (ja) 2016-02-10

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ID=48041304

Family Applications (1)

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JP2011220611A Active JP5856791B2 (ja) 2011-10-05 2011-10-05 プラズマ処理装置

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US (2) US10541115B2 (enExample)
JP (1) JP5856791B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9779953B2 (en) * 2013-09-25 2017-10-03 Applied Materials, Inc. Electromagnetic dipole for plasma density tuning in a substrate processing chamber
CN106611643A (zh) * 2015-10-23 2017-05-03 北京北方微电子基地设备工艺研究中心有限责任公司 立体线圈、反应腔室及半导体加工设备
JP6620078B2 (ja) * 2016-09-05 2019-12-11 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP7139181B2 (ja) * 2018-07-26 2022-09-20 ワイエイシイテクノロジーズ株式会社 プラズマ処理装置
CN113972125B (zh) * 2020-07-24 2022-07-29 江苏鲁汶仪器有限公司 一种等离子体处理系统及其多段式法拉第屏蔽装置
CN114231936A (zh) * 2021-11-09 2022-03-25 中山市博顿光电科技有限公司 防污染装置、电离腔体及射频离子源

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3150058B2 (ja) * 1994-12-05 2001-03-26 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP4119547B2 (ja) * 1997-10-20 2008-07-16 東京エレクトロンＡｔ株式会社 プラズマ処理装置
JP4384301B2 (ja) * 1999-09-13 2009-12-16 株式会社日立製作所 プラズマ処理装置
US6666982B2 (en) * 2001-10-22 2003-12-23 Tokyo Electron Limited Protection of dielectric window in inductively coupled plasma generation
JP4079834B2 (ja) * 2003-06-04 2008-04-23 東京エレクトロン株式会社 プラズマ処理方法
US7273533B2 (en) * 2003-11-19 2007-09-25 Tokyo Electron Limited Plasma processing system with locally-efficient inductive plasma coupling
JP2006216903A (ja) 2005-02-07 2006-08-17 Hitachi High-Technologies Corp プラズマ処理装置
JP4659771B2 (ja) 2007-02-13 2011-03-30 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4933329B2 (ja) * 2007-03-30 2012-05-16 パナソニック株式会社 プラズマ処理装置
JP5451324B2 (ja) 2009-11-10 2014-03-26 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2011124293A (ja) * 2009-12-09 2011-06-23 Hitachi High-Technologies Corp プラズマ処理装置

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