JP2016018918A5 - - Google Patents

Download PDF

Info

Publication number
JP2016018918A5
JP2016018918A5 JP2014141330A JP2014141330A JP2016018918A5 JP 2016018918 A5 JP2016018918 A5 JP 2016018918A5 JP 2014141330 A JP2014141330 A JP 2014141330A JP 2014141330 A JP2014141330 A JP 2014141330A JP 2016018918 A5 JP2016018918 A5 JP 2016018918A5
Authority
JP
Japan
Prior art keywords
processing apparatus
plasma processing
temperature sensor
disposed
sample stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014141330A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016018918A (ja
JP6408270B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014141330A priority Critical patent/JP6408270B2/ja
Priority claimed from JP2014141330A external-priority patent/JP6408270B2/ja
Publication of JP2016018918A publication Critical patent/JP2016018918A/ja
Publication of JP2016018918A5 publication Critical patent/JP2016018918A5/ja
Application granted granted Critical
Publication of JP6408270B2 publication Critical patent/JP6408270B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014141330A 2014-07-09 2014-07-09 プラズマ処理装置 Active JP6408270B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014141330A JP6408270B2 (ja) 2014-07-09 2014-07-09 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014141330A JP6408270B2 (ja) 2014-07-09 2014-07-09 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2016018918A JP2016018918A (ja) 2016-02-01
JP2016018918A5 true JP2016018918A5 (enExample) 2017-08-03
JP6408270B2 JP6408270B2 (ja) 2018-10-17

Family

ID=55233931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014141330A Active JP6408270B2 (ja) 2014-07-09 2014-07-09 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP6408270B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6960737B2 (ja) * 2017-01-23 2021-11-05 株式会社日立ハイテク 真空処理装置
KR102524258B1 (ko) * 2018-06-18 2023-04-21 삼성전자주식회사 온도 조절 유닛, 온도 측정 유닛 및 이들을 포함하는 플라즈마 처리 장치
KR102608957B1 (ko) * 2018-08-27 2023-12-01 삼성전자주식회사 플라즈마 처리 장치
CN113826189B (zh) 2020-04-21 2024-03-22 株式会社日立高新技术 等离子处理装置以及等离子处理方法
KR102672547B1 (ko) 2021-03-25 2024-06-07 주식회사 히타치하이테크 플라스마 처리 장치 및 플라스마 처리 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155034U (enExample) * 1987-03-30 1988-10-12
JPH0281037U (enExample) * 1988-12-09 1990-06-22
JP2892787B2 (ja) * 1990-07-20 1999-05-17 東京エレクトロン株式会社 電気信号の抽出方法
JP3186008B2 (ja) * 1994-03-18 2001-07-11 株式会社日立製作所 ウエハ保持装置
JP3617294B2 (ja) * 1998-03-27 2005-02-02 Ｊｆｅスチール株式会社 金属体の温度を測定するシース熱電対の取付け方法
JP2000306883A (ja) * 1999-04-19 2000-11-02 Hitachi Ltd プラズマ処理装置及びプラズマ処理方法
JP2002313900A (ja) * 2001-04-11 2002-10-25 Sumitomo Electric Ind Ltd 基板保持構造体および基板処理装置
JP4071002B2 (ja) * 2002-01-25 2008-04-02 東京エレクトロン株式会社 真空処理装置
JP2007088411A (ja) * 2005-06-28 2007-04-05 Hitachi High-Technologies Corp 静電吸着装置およびウエハ処理装置ならびにプラズマ処理方法

Similar Documents

Publication Publication Date Title
JP2016018918A5 (enExample)
PH12018502476A1 (en) Aerosol generating device with inductor
TWI724258B (zh) 電漿處理裝置
JP2013182996A5 (enExample)
JP2017028111A5 (enExample)
JP2019102638A5 (enExample)
JP2010135298A5 (enExample)
JP2007250755A5 (enExample)
TWI587354B (zh) A heater for a plasma processing device
JP2007250967A5 (enExample)
JP2017504955A5 (enExample)
WO2010122459A3 (en) Method and apparatus for high aspect ratio dielectric etch
JP2015162618A5 (enExample)
CN203761669U (zh) 一种可用于伤口愈合的常压冷等离子体发生装置
JP2018107304A5 (enExample)
JP2012216737A5 (enExample)
JP2016092342A5 (enExample)
CN103781271A (zh) 一种可用于伤口愈合的常压冷等离子体发生装置
JP2011199003A5 (enExample)
JP2016091829A5 (enExample)
JP2016512393A5 (enExample)
TW201435966A (zh) 在製程室中使用調節環來調節電漿分佈的裝置和方法
JP2019507467A5 (ja) 間接加熱陰極イオン源および間接加熱陰極イオン源と共に使用するための装置
WO2014079120A1 (zh) 一种电极引入结构
JP2012238629A5 (enExample)