JP2016091829A5 - - Google Patents

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Publication number
JP2016091829A5
JP2016091829A5 JP2014225519A JP2014225519A JP2016091829A5 JP 2016091829 A5 JP2016091829 A5 JP 2016091829A5 JP 2014225519 A JP2014225519 A JP 2014225519A JP 2014225519 A JP2014225519 A JP 2014225519A JP 2016091829 A5 JP2016091829 A5 JP 2016091829A5
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JP
Japan
Prior art keywords
frequency
plasma processing
antenna
processing apparatus
power source
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JP2014225519A
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English (en)
Japanese (ja)
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JP2016091829A (ja
JP6539986B2 (ja
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Priority claimed from JP2014225519A external-priority patent/JP6539986B2/ja
Priority to JP2014225519A priority Critical patent/JP6539986B2/ja
Priority to TW104135082A priority patent/TWI682424B/zh
Priority to KR1020150154193A priority patent/KR101804341B1/ko
Priority to US14/934,066 priority patent/US20160126064A1/en
Publication of JP2016091829A publication Critical patent/JP2016091829A/ja
Priority to KR1020170160011A priority patent/KR101852310B1/ko
Publication of JP2016091829A5 publication Critical patent/JP2016091829A5/ja
Priority to US16/214,599 priority patent/US20190115188A1/en
Priority to US16/214,567 priority patent/US10937631B2/en
Publication of JP6539986B2 publication Critical patent/JP6539986B2/ja
Application granted granted Critical
Active legal-status Critical Current
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JP2014225519A 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法 Active JP6539986B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014225519A JP6539986B2 (ja) 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法
TW104135082A TWI682424B (zh) 2014-11-05 2015-10-26 電漿處理裝置及電漿處理方法
KR1020150154193A KR101804341B1 (ko) 2014-11-05 2015-11-04 플라즈마 처리 장치 및 플라즈마 처리 방법
US14/934,066 US20160126064A1 (en) 2014-11-05 2015-11-05 Plasma processing apparatus and plasma processing method
KR1020170160011A KR101852310B1 (ko) 2014-11-05 2017-11-28 플라즈마 처리 장치 및 플라즈마 처리 방법
US16/214,599 US20190115188A1 (en) 2014-11-05 2018-12-10 Plasma processing apparatus and plasma processing method
US16/214,567 US10937631B2 (en) 2014-11-05 2018-12-10 Plasma processing apparatus and plasma processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014225519A JP6539986B2 (ja) 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2016091829A JP2016091829A (ja) 2016-05-23
JP2016091829A5 true JP2016091829A5 (enExample) 2018-03-29
JP6539986B2 JP6539986B2 (ja) 2019-07-10

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JP2014225519A Active JP6539986B2 (ja) 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法

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US (3) US20160126064A1 (enExample)
JP (1) JP6539986B2 (enExample)
KR (2) KR101804341B1 (enExample)
TW (1) TWI682424B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10755902B2 (en) * 2015-05-27 2020-08-25 Tokyo Electron Limited Plasma processing apparatus and focus ring
KR101986744B1 (ko) * 2017-09-27 2019-06-07 주식회사 유진테크 플라즈마 처리 장치 및 방법
CN110318028A (zh) * 2018-03-28 2019-10-11 株式会社新柯隆 等离子体源机构及薄膜形成装置
CN111066129B (zh) * 2018-06-04 2024-04-05 东京毅力科创株式会社 蚀刻处理方法和蚀刻处理装置
JP7175239B2 (ja) * 2018-06-22 2022-11-18 東京エレクトロン株式会社 制御方法、プラズマ処理装置、プログラム及び記憶媒体
JP7139181B2 (ja) * 2018-07-26 2022-09-20 ワイエイシイテクノロジーズ株式会社 プラズマ処理装置
US10354838B1 (en) * 2018-10-10 2019-07-16 Lam Research Corporation RF antenna producing a uniform near-field Poynting vector
WO2020088169A1 (zh) * 2018-10-30 2020-05-07 北京北方华创微电子装备有限公司 感应线圈组及反应腔室
JP2023020609A (ja) * 2021-07-30 2023-02-09 株式会社アルバック プラズマ処理装置
JP7324926B1 (ja) 2022-06-02 2023-08-10 恭胤 高藤 遮蔽容器
US20250087462A1 (en) * 2023-09-08 2025-03-13 Applied Materials, Inc. Radio-frequency (rf) matching network and tuning technique

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5231334A (en) 1992-04-15 1993-07-27 Texas Instruments Incorporated Plasma source and method of manufacturing
US5241245A (en) 1992-05-06 1993-08-31 International Business Machines Corporation Optimized helical resonator for plasma processing
US5401350A (en) * 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
JPH0817799A (ja) 1994-06-28 1996-01-19 Plasma Syst:Kk プラズマ処理装置
JP3208079B2 (ja) * 1996-02-27 2001-09-10 松下電器産業株式会社 高周波電力印加装置及びプラズマ処理装置
US6164241A (en) 1998-06-30 2000-12-26 Lam Research Corporation Multiple coil antenna for inductively-coupled plasma generation systems
US6441555B1 (en) * 2000-03-31 2002-08-27 Lam Research Corporation Plasma excitation coil
JP4178775B2 (ja) 2001-08-31 2008-11-12 株式会社日立国際電気 プラズマリアクター
US9137884B2 (en) * 2006-11-29 2015-09-15 Lam Research Corporation Apparatus and method for plasma processing
JP5584412B2 (ja) * 2008-12-26 2014-09-03 株式会社メイコー プラズマ処理装置
JP5227245B2 (ja) 2009-04-28 2013-07-03 東京エレクトロン株式会社 プラズマ処理装置
JP5554099B2 (ja) * 2010-03-18 2014-07-23 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP5901887B2 (ja) * 2011-04-13 2016-04-13 東京エレクトロン株式会社 プラズマ処理装置のクリーニング方法及びプラズマ処理方法
JP6257071B2 (ja) 2012-09-12 2018-01-10 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法

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