JP6539986B2 - プラズマ処理装置及びプラズマ処理方法 - Google Patents

プラズマ処理装置及びプラズマ処理方法 Download PDF

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Publication number
JP6539986B2
JP6539986B2 JP2014225519A JP2014225519A JP6539986B2 JP 6539986 B2 JP6539986 B2 JP 6539986B2 JP 2014225519 A JP2014225519 A JP 2014225519A JP 2014225519 A JP2014225519 A JP 2014225519A JP 6539986 B2 JP6539986 B2 JP 6539986B2
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Japan
Prior art keywords
high frequency
antenna
power supply
plasma processing
processing apparatus
Prior art date
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JP2014225519A
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English (en)
Japanese (ja)
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JP2016091829A5 (enExample
JP2016091829A (ja
Inventor
山涌　純
山涌　　純
龍夫 松土
龍夫 松土
輿水　地塩
地塩 輿水
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2014225519A priority Critical patent/JP6539986B2/ja
Priority to TW104135082A priority patent/TWI682424B/zh
Priority to KR1020150154193A priority patent/KR101804341B1/ko
Priority to US14/934,066 priority patent/US20160126064A1/en
Publication of JP2016091829A publication Critical patent/JP2016091829A/ja
Priority to KR1020170160011A priority patent/KR101852310B1/ko
Publication of JP2016091829A5 publication Critical patent/JP2016091829A5/ja
Priority to US16/214,599 priority patent/US20190115188A1/en
Priority to US16/214,567 priority patent/US10937631B2/en
Application granted granted Critical
Publication of JP6539986B2 publication Critical patent/JP6539986B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2014225519A 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法 Active JP6539986B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014225519A JP6539986B2 (ja) 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法
TW104135082A TWI682424B (zh) 2014-11-05 2015-10-26 電漿處理裝置及電漿處理方法
KR1020150154193A KR101804341B1 (ko) 2014-11-05 2015-11-04 플라즈마 처리 장치 및 플라즈마 처리 방법
US14/934,066 US20160126064A1 (en) 2014-11-05 2015-11-05 Plasma processing apparatus and plasma processing method
KR1020170160011A KR101852310B1 (ko) 2014-11-05 2017-11-28 플라즈마 처리 장치 및 플라즈마 처리 방법
US16/214,599 US20190115188A1 (en) 2014-11-05 2018-12-10 Plasma processing apparatus and plasma processing method
US16/214,567 US10937631B2 (en) 2014-11-05 2018-12-10 Plasma processing apparatus and plasma processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014225519A JP6539986B2 (ja) 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2016091829A JP2016091829A (ja) 2016-05-23
JP2016091829A5 JP2016091829A5 (enExample) 2018-03-29
JP6539986B2 true JP6539986B2 (ja) 2019-07-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014225519A Active JP6539986B2 (ja) 2014-11-05 2014-11-05 プラズマ処理装置及びプラズマ処理方法

Country Status (4)

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US (3) US20160126064A1 (enExample)
JP (1) JP6539986B2 (enExample)
KR (2) KR101804341B1 (enExample)
TW (1) TWI682424B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10755902B2 (en) * 2015-05-27 2020-08-25 Tokyo Electron Limited Plasma processing apparatus and focus ring
KR101986744B1 (ko) * 2017-09-27 2019-06-07 주식회사 유진테크 플라즈마 처리 장치 및 방법
CN110318028A (zh) * 2018-03-28 2019-10-11 株式会社新柯隆 等离子体源机构及薄膜形成装置
CN111066129B (zh) * 2018-06-04 2024-04-05 东京毅力科创株式会社 蚀刻处理方法和蚀刻处理装置
JP7175239B2 (ja) * 2018-06-22 2022-11-18 東京エレクトロン株式会社 制御方法、プラズマ処理装置、プログラム及び記憶媒体
JP7139181B2 (ja) * 2018-07-26 2022-09-20 ワイエイシイテクノロジーズ株式会社 プラズマ処理装置
US10354838B1 (en) * 2018-10-10 2019-07-16 Lam Research Corporation RF antenna producing a uniform near-field Poynting vector
WO2020088169A1 (zh) * 2018-10-30 2020-05-07 北京北方华创微电子装备有限公司 感应线圈组及反应腔室
JP2023020609A (ja) * 2021-07-30 2023-02-09 株式会社アルバック プラズマ処理装置
JP7324926B1 (ja) 2022-06-02 2023-08-10 恭胤 高藤 遮蔽容器
US20250087462A1 (en) * 2023-09-08 2025-03-13 Applied Materials, Inc. Radio-frequency (rf) matching network and tuning technique

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5231334A (en) 1992-04-15 1993-07-27 Texas Instruments Incorporated Plasma source and method of manufacturing
US5241245A (en) 1992-05-06 1993-08-31 International Business Machines Corporation Optimized helical resonator for plasma processing
US5401350A (en) * 1993-03-08 1995-03-28 Lsi Logic Corporation Coil configurations for improved uniformity in inductively coupled plasma systems
JPH0817799A (ja) 1994-06-28 1996-01-19 Plasma Syst:Kk プラズマ処理装置
JP3208079B2 (ja) * 1996-02-27 2001-09-10 松下電器産業株式会社 高周波電力印加装置及びプラズマ処理装置
US6164241A (en) 1998-06-30 2000-12-26 Lam Research Corporation Multiple coil antenna for inductively-coupled plasma generation systems
US6441555B1 (en) * 2000-03-31 2002-08-27 Lam Research Corporation Plasma excitation coil
JP4178775B2 (ja) 2001-08-31 2008-11-12 株式会社日立国際電気 プラズマリアクター
US9137884B2 (en) * 2006-11-29 2015-09-15 Lam Research Corporation Apparatus and method for plasma processing
JP5584412B2 (ja) * 2008-12-26 2014-09-03 株式会社メイコー プラズマ処理装置
JP5227245B2 (ja) 2009-04-28 2013-07-03 東京エレクトロン株式会社 プラズマ処理装置
JP5554099B2 (ja) * 2010-03-18 2014-07-23 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP5901887B2 (ja) * 2011-04-13 2016-04-13 東京エレクトロン株式会社 プラズマ処理装置のクリーニング方法及びプラズマ処理方法
JP6257071B2 (ja) 2012-09-12 2018-01-10 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
US20190115188A1 (en) 2019-04-18
KR20170137015A (ko) 2017-12-12
TW201630029A (zh) 2016-08-16
KR101852310B1 (ko) 2018-04-25
KR20160053808A (ko) 2016-05-13
TWI682424B (zh) 2020-01-11
KR101804341B1 (ko) 2017-12-04
JP2016091829A (ja) 2016-05-23
US10937631B2 (en) 2021-03-02
US20190108975A1 (en) 2019-04-11
US20160126064A1 (en) 2016-05-05

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