JP2013059855A5 - - Google Patents
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- Publication number
- JP2013059855A5 JP2013059855A5 JP2012181674A JP2012181674A JP2013059855A5 JP 2013059855 A5 JP2013059855 A5 JP 2013059855A5 JP 2012181674 A JP2012181674 A JP 2012181674A JP 2012181674 A JP2012181674 A JP 2012181674A JP 2013059855 A5 JP2013059855 A5 JP 2013059855A5
- Authority
- JP
- Japan
- Prior art keywords
- sealing layer
- layer
- substrate
- mems
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims 23
- 239000000758 substrate Substances 0.000 claims 7
- 238000005530 etching Methods 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
- 229910001936 tantalum oxide Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012181674A JP6034619B2 (ja) | 2011-08-22 | 2012-08-20 | Ｍｅｍｓ素子およびそれを用いた電気機器 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011180432 | 2011-08-22 | ||
| JP2011180432 | 2011-08-22 | ||
| JP2012181674A JP6034619B2 (ja) | 2011-08-22 | 2012-08-20 | Ｍｅｍｓ素子およびそれを用いた電気機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013059855A JP2013059855A (ja) | 2013-04-04 |
| JP2013059855A5 true JP2013059855A5 (enExample) | 2015-04-09 |
| JP6034619B2 JP6034619B2 (ja) | 2016-11-30 |
Family
ID=48185009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012181674A Expired - Fee Related JP6034619B2 (ja) | 2011-08-22 | 2012-08-20 | Ｍｅｍｓ素子およびそれを用いた電気機器 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8610224B2 (enExample) |
| JP (1) | JP6034619B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5807664B2 (ja) * | 2013-08-07 | 2015-11-10 | 横河電機株式会社 | 振動式トランスデューサおよびその製造方法 |
| JP6221965B2 (ja) * | 2014-06-26 | 2017-11-01 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP6594619B2 (ja) * | 2014-11-14 | 2019-10-23 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
| JP2016099234A (ja) * | 2014-11-21 | 2016-05-30 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP6461030B2 (ja) | 2016-03-15 | 2019-01-30 | 株式会社東芝 | 電子装置及び電子装置の製造方法 |
| US10793427B2 (en) * | 2017-04-04 | 2020-10-06 | Kionix, Inc. | Eutectic bonding with AlGe |
| US10167191B2 (en) | 2017-04-04 | 2019-01-01 | Kionix, Inc. | Method for manufacturing a micro electro-mechanical system |
| JP6897455B2 (ja) * | 2017-09-27 | 2021-06-30 | セイコーエプソン株式会社 | 電子デバイスおよび電子デバイスの製造方法 |
| US11313877B2 (en) | 2018-06-19 | 2022-04-26 | Kionix, Inc. | Near-zero power wakeup electro-mechanical system |
| CN109374917B (zh) * | 2018-11-15 | 2020-07-31 | 中国兵器工业集团第二一四研究所苏州研发中心 | 蜂窝状微止挡结构设计方法 |
| WO2020171123A1 (ja) * | 2019-02-20 | 2020-08-27 | 京セラ株式会社 | 蓋体、パッケージ、電子装置および電子モジュール |
| CN117751522A (zh) * | 2021-07-29 | 2024-03-22 | 株式会社村田制作所 | 谐振装置及其制造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000124469A (ja) * | 1998-10-13 | 2000-04-28 | Toyota Central Res & Dev Lab Inc | 微小密閉容器及びその製造方法 |
| ATE360896T1 (de) * | 2001-04-19 | 2007-05-15 | Imec Inter Uni Micro Electr | Herstellung von integrierten abstimmbaren/umschaltbaren passiven mikro- und millimeterwellenmodulen |
| US6822326B2 (en) * | 2002-09-25 | 2004-11-23 | Ziptronix | Wafer bonding hermetic encapsulation |
| US7129576B2 (en) * | 2003-09-26 | 2006-10-31 | Tessera, Inc. | Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps |
| EP1758814A4 (en) * | 2004-03-15 | 2010-12-15 | Georgia Tech Res Inst | CAPACITY FOR ELECTRO-MECHANICAL MICROSYSTEMS AND MANUFACTURING METHOD THEREFOR |
| JP4617743B2 (ja) * | 2004-07-06 | 2011-01-26 | ソニー株式会社 | 機能素子およびその製造方法、ならびに流体吐出ヘッド |
| US7442570B2 (en) * | 2005-03-18 | 2008-10-28 | Invensence Inc. | Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom |
| JP5054936B2 (ja) * | 2005-06-22 | 2012-10-24 | パナソニック株式会社 | 電気機械メモリ、それを用いた電気回路及び電気機械メモリの駆動方法 |
| US7245009B2 (en) * | 2005-06-29 | 2007-07-17 | Motorola, Inc. | Hermetic cavity package |
| JP2007222956A (ja) | 2006-02-21 | 2007-09-06 | Seiko Epson Corp | Ｍｅｍｓデバイスおよびｍｅｍｓデバイスの製造方法 |
| EP1840081B1 (en) * | 2006-03-28 | 2013-08-28 | Imec | Method for forming a hermetically sealed cavity |
| JP4387392B2 (ja) * | 2006-09-15 | 2009-12-16 | パナソニック株式会社 | シールドケースおよびこれを有するｍｅｍｓマイクロホン |
| JP4495711B2 (ja) * | 2006-10-27 | 2010-07-07 | 株式会社日立製作所 | 機能素子及びその製造方法 |
| JP2008137139A (ja) | 2006-12-05 | 2008-06-19 | Toshiba Corp | 微小電気機械式装置及びその製造方法 |
| JP2008188711A (ja) * | 2007-02-05 | 2008-08-21 | Oki Electric Ind Co Ltd | 半導体装置製造方法 |
| JP2009045712A (ja) * | 2007-08-21 | 2009-03-05 | Toshiba Corp | Ｍｅｍｓ装置およびｍｅｍｓ装置製造方法 |
| US8030823B2 (en) * | 2009-01-26 | 2011-10-04 | Resonance Semiconductor Corporation | Protected resonator |
| US7919842B2 (en) * | 2009-03-17 | 2011-04-05 | Texas Instruments Incorporated | Structure and method for sealing cavity of micro-electro-mechanical device |
-
2012
- 2012-08-20 JP JP2012181674A patent/JP6034619B2/ja not_active Expired - Fee Related
- 2012-08-21 US US13/590,439 patent/US8610224B2/en active Active
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