JP6594619B2 - 圧電薄膜共振器、フィルタおよびデュプレクサ - Google Patents
圧電薄膜共振器、フィルタおよびデュプレクサ Download PDFInfo
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- JP6594619B2 JP6594619B2 JP2014231794A JP2014231794A JP6594619B2 JP 6594619 B2 JP6594619 B2 JP 6594619B2 JP 2014231794 A JP2014231794 A JP 2014231794A JP 2014231794 A JP2014231794 A JP 2014231794A JP 6594619 B2 JP6594619 B2 JP 6594619B2
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- 239000010408 film Substances 0.000 claims description 398
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- 230000005540 biological transmission Effects 0.000 claims description 23
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
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- 239000010936 titanium Substances 0.000 description 9
- 239000011651 chromium Substances 0.000 description 8
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 230000008878 coupling Effects 0.000 description 6
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- 229910052802 copper Inorganic materials 0.000 description 4
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- 238000004088 simulation Methods 0.000 description 4
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- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
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- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 235000019687 Lamb Nutrition 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
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- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
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- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/703—Networks using bulk acoustic wave devices
- H03H9/706—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/564—Monolithic crystal filters implemented with thin-film techniques
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezo-electric or electrostrictive material
- H03H9/56—Monolithic crystal filters
- H03H9/566—Electric coupling means therefor
- H03H9/568—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H2003/021—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks being of the air-gap type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Description
12 下部電極
14 圧電膜
14a 下部圧電膜
14b 上部圧電膜
16 上部電極
28 挿入膜
30 空隙
31 音響反射膜
40 送信フィルタ
42 受信フィルタ
46 凹部
47 凸部
50 共振領域
52 外周領域
54 中央領域
60、62 領域
Claims (6)
- 基板と、
前記基板上に設けられた圧電膜と、
前記圧電膜の少なくとも一部を挟んで対向した下部電極および上部電極と、
前記圧電膜中に挿入され、前記圧電膜を挟み前記下部電極と前記上部電極とが対向し厚み縦振動モードの弾性波が共振する共振領域内の外周領域の少なくとも一部に設けられ、前記共振領域の中央領域には設けられておらず、前記共振領域の外周に沿って前記中央領域を囲む領域に設けられた挿入膜と、
を具備し、
前記共振領域内の前記挿入膜が挿入された第1領域における前記圧電膜と前記挿入膜との合計膜厚と、前記挿入膜が挿入されていない第2領域における前記圧電膜の膜厚と、の差は前記挿入膜の膜厚より小さく、
前記挿入膜のヤング率は前記圧電膜のヤング率より小さく、
前記第1領域における前記圧電膜の上面と前記第2領域における前記圧電膜の上面との間は平坦、または前記第1領域における前記圧電膜の上面と前記第2領域における前記圧電膜との間の段差は挿入膜の膜厚より小さく、
前記基板と前記下部電極との間、または前記基板と前記下部電極に接する絶縁膜との間に、平面視において前記共振領域を含むように空隙が形成されている、または、前記下部電極下に、平面視において前記共振領域を含むように、前記圧電膜を伝搬する弾性波を反射する音響反射膜を具備することを特徴とする圧電薄膜共振器。 - 前記圧電膜は、下部圧電膜と前記下部圧電膜上に設けられた上部圧電膜とを備え、前記下部圧電膜の上面には、前記第1領域が凹部の底となるように凹部が形成され、前記挿入膜は前記凹部の前記底上に設けられていることを特徴とする請求項1記載の圧電薄膜共振器。
- 前記凹部の深さと前記挿入膜の膜厚との差は前記挿入膜の膜厚より小さいことを特徴とする請求項2記載の圧電薄膜共振器。
- 前記第1領域における前記圧電膜と前記挿入膜との合計膜厚と前記第2領域における圧電膜の膜厚は同じであることを特徴とする請求項1から3のいずれか一項記載の圧電薄膜共振器。
- 請求項1から4のいずれか一項記載の圧電薄膜共振器を含むことを特徴とするフィルタ。
- 送信フィルタと受信フィルタとを具備し、
前記送信フィルタおよび前記受信フィルタの少なくとも一方は請求項5記載のフィルタであることを特徴とするデュプレクサ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014231794A JP6594619B2 (ja) | 2014-11-14 | 2014-11-14 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
US14/824,778 US9748925B2 (en) | 2014-11-14 | 2015-08-12 | Piezoelectric thin film resonator including an insertion film, filter, and duplexer |
CN201510765123.9A CN105610407B (zh) | 2014-11-14 | 2015-11-11 | 压电薄膜谐振器、滤波器和双工器 |
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JP2014231794A JP6594619B2 (ja) | 2014-11-14 | 2014-11-14 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
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JP6594619B2 true JP6594619B2 (ja) | 2019-10-23 |
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JP6085147B2 (ja) * | 2012-11-15 | 2017-02-22 | 太陽誘電株式会社 | 弾性波デバイスおよびその製造方法 |
JP6441761B2 (ja) | 2015-07-29 | 2018-12-19 | 太陽誘電株式会社 | 圧電薄膜共振器及びフィルタ |
JP6469601B2 (ja) * | 2016-02-05 | 2019-02-13 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
TWI632772B (zh) * | 2016-10-17 | 2018-08-11 | 穩懋半導體股份有限公司 | 具有質量調整結構之體聲波共振器及其應用於體聲波濾波器 |
JP6886357B2 (ja) * | 2017-07-03 | 2021-06-16 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびマルチプレクサ |
JP7017364B2 (ja) | 2017-10-18 | 2022-02-08 | 太陽誘電株式会社 | ラダー型フィルタ、圧電薄膜共振器およびその製造方法 |
US11437975B2 (en) * | 2019-09-06 | 2022-09-06 | Samsung Electro-Mechanics Co., Ltd. | Bulk acoustic resonator and filter device |
CN112187213B (zh) * | 2020-09-29 | 2021-06-01 | 诺思(天津)微系统有限责任公司 | 双工器设计方法和双工器、多工器、通信设备 |
CN113556100B (zh) * | 2021-07-30 | 2022-06-21 | 武汉衍熙微器件有限公司 | 体声波谐振器 |
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TWI365603B (en) | 2004-10-01 | 2012-06-01 | Avago Technologies Wireless Ip | A thin film bulk acoustic resonator with a mass loaded perimeter |
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US7280007B2 (en) | 2004-11-15 | 2007-10-09 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Thin film bulk acoustic resonator with a mass loaded perimeter |
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JP5161698B2 (ja) * | 2008-08-08 | 2013-03-13 | 太陽誘電株式会社 | 圧電薄膜共振子及びこれを用いたフィルタあるいは分波器 |
JP5345917B2 (ja) * | 2009-10-05 | 2013-11-20 | 富士フイルム株式会社 | 液体吐出装置 |
FR2954582B1 (fr) * | 2009-12-23 | 2017-11-03 | Commissariat A L'energie Atomique | Dispositif electromecanique a base d'electret, et son procede de fabrication |
US9099983B2 (en) * | 2011-02-28 | 2015-08-04 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator device comprising a bridge in an acoustic reflector |
US9048812B2 (en) * | 2011-02-28 | 2015-06-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer |
JP5905677B2 (ja) * | 2011-08-02 | 2016-04-20 | 太陽誘電株式会社 | 圧電薄膜共振器およびその製造方法 |
JP6034619B2 (ja) * | 2011-08-22 | 2016-11-30 | パナソニック株式会社 | Mems素子およびそれを用いた電気機器 |
US8941286B2 (en) * | 2012-02-14 | 2015-01-27 | Taiyo Yuden Co., Ltd. | Acoustic wave device |
JP6336712B2 (ja) * | 2013-01-28 | 2018-06-06 | 太陽誘電株式会社 | 圧電薄膜共振器、フィルタおよびデュプレクサ |
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US9748925B2 (en) | 2017-08-29 |
JP2016096466A (ja) | 2016-05-26 |
US20160142038A1 (en) | 2016-05-19 |
CN105610407A (zh) | 2016-05-25 |
CN105610407B (zh) | 2018-09-14 |
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