JP2013048181A5 - - Google Patents

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Publication number
JP2013048181A5
JP2013048181A5 JP2011186300A JP2011186300A JP2013048181A5 JP 2013048181 A5 JP2013048181 A5 JP 2013048181A5 JP 2011186300 A JP2011186300 A JP 2011186300A JP 2011186300 A JP2011186300 A JP 2011186300A JP 2013048181 A5 JP2013048181 A5 JP 2013048181A5
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JP
Japan
Prior art keywords
hole
pattern forming
forming apparatus
substrate
opening
Prior art date
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Application number
JP2011186300A
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English (en)
Japanese (ja)
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JP5606412B2 (ja
JP2013048181A (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2011186300A external-priority patent/JP5606412B2/ja
Priority to JP2011186300A priority Critical patent/JP5606412B2/ja
Priority to CN201280042240.7A priority patent/CN103766013B/zh
Priority to PCT/JP2012/072276 priority patent/WO2013031994A1/en
Priority to KR1020147005250A priority patent/KR101532521B1/ko
Priority to TW101131214A priority patent/TWI520665B/zh
Publication of JP2013048181A publication Critical patent/JP2013048181A/ja
Publication of JP2013048181A5 publication Critical patent/JP2013048181A5/ja
Priority to US14/191,157 priority patent/US20140178566A1/en
Publication of JP5606412B2 publication Critical patent/JP5606412B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011186300A 2011-08-29 2011-08-29 パターン形成装置、パターン形成方法及びパターン形成基板の製造方法 Expired - Fee Related JP5606412B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011186300A JP5606412B2 (ja) 2011-08-29 2011-08-29 パターン形成装置、パターン形成方法及びパターン形成基板の製造方法
CN201280042240.7A CN103766013B (zh) 2011-08-29 2012-08-27 图案形成装置和方法以及制造形成有图案的基板的方法
PCT/JP2012/072276 WO2013031994A1 (en) 2011-08-29 2012-08-27 Pattern forming apparatus and method, and method of manufacturing substrate formed with pattern
KR1020147005250A KR101532521B1 (ko) 2011-08-29 2012-08-27 패턴 형성 장치 및 방법, 그리고 패턴이 형성된 기판의 제조 방법
TW101131214A TWI520665B (zh) 2011-08-29 2012-08-28 圖案形成設備與方法以及形成有圖案的基板的製造方法
US14/191,157 US20140178566A1 (en) 2011-08-29 2014-02-26 Pattern forming apparatus and method, and method of manufacturing substrate formed with pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011186300A JP5606412B2 (ja) 2011-08-29 2011-08-29 パターン形成装置、パターン形成方法及びパターン形成基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013048181A JP2013048181A (ja) 2013-03-07
JP2013048181A5 true JP2013048181A5 (enExample) 2014-02-06
JP5606412B2 JP5606412B2 (ja) 2014-10-15

Family

ID=47756467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011186300A Expired - Fee Related JP5606412B2 (ja) 2011-08-29 2011-08-29 パターン形成装置、パターン形成方法及びパターン形成基板の製造方法

Country Status (6)

Country Link
US (1) US20140178566A1 (enExample)
JP (1) JP5606412B2 (enExample)
KR (1) KR101532521B1 (enExample)
CN (1) CN103766013B (enExample)
TW (1) TWI520665B (enExample)
WO (1) WO2013031994A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6317935B2 (ja) * 2014-02-05 2018-04-25 株式会社ディスコ 保持テーブル
JP6420608B2 (ja) * 2014-09-25 2018-11-07 東レエンジニアリング株式会社 基材処理方法および基材処理装置
WO2017026127A1 (ja) * 2015-08-13 2017-02-16 出光興産株式会社 導体とその製造方法、及びそれを用いた積層回路及び積層配線部材
US20170100916A1 (en) * 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
JP2017228669A (ja) * 2016-06-23 2017-12-28 京セラ株式会社 配線基板およびその製造方法
JP6881409B2 (ja) * 2018-09-27 2021-06-02 日亜化学工業株式会社 照明装置およびその製造方法
US10950463B2 (en) 2019-01-31 2021-03-16 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Manufacturing trapezoidal through-hole in component carrier material
CN113265615A (zh) * 2021-04-13 2021-08-17 上海大学 用于纳米量热仪定位衬底蒸镀的硅掩模装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133992A (ja) * 1983-12-21 1985-07-17 Canon Inc プリント基板の穴明け加工装置
JPH1158051A (ja) * 1997-08-25 1999-03-02 Ngk Spark Plug Co Ltd 基板の貫通孔の形成方法
JP2004022916A (ja) * 2002-06-19 2004-01-22 Nikon Corp レーザ光源制御方法及び装置、露光方法及び装置、並びにデバイス製造方法
JP3779697B2 (ja) * 2003-05-26 2006-05-31 株式会社野田スクリーン 回路基板の孔埋め方法
JP2005081159A (ja) * 2003-09-04 2005-03-31 Ricoh Co Ltd 機能性基体製造装置ならびに製造される機能性基体
JP2005183847A (ja) * 2003-12-22 2005-07-07 Seiko Epson Corp 配線基板の形成方法
JP2006041352A (ja) * 2004-07-29 2006-02-09 Dainippon Screen Mfg Co Ltd 皮膜検査装置、検査システム、プログラム、皮膜検査方法およびプリント基板検査方法
KR100993056B1 (ko) * 2006-12-05 2010-11-08 주식회사 엘지화학 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법 및이 방법에 의해 제조된 도전성 기판
JP2010123772A (ja) * 2008-11-20 2010-06-03 Panasonic Corp プリント配線板の位置認識マークおよびプリント配線板の製造方法

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