TWI520665B - 圖案形成設備與方法以及形成有圖案的基板的製造方法 - Google Patents
圖案形成設備與方法以及形成有圖案的基板的製造方法 Download PDFInfo
- Publication number
- TWI520665B TWI520665B TW101131214A TW101131214A TWI520665B TW I520665 B TWI520665 B TW I520665B TW 101131214 A TW101131214 A TW 101131214A TW 101131214 A TW101131214 A TW 101131214A TW I520665 B TWI520665 B TW I520665B
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- substrate
- pattern forming
- unit
- light
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 195
- 238000000034 method Methods 0.000 title claims description 74
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000000151 deposition Methods 0.000 claims description 68
- 230000008021 deposition Effects 0.000 claims description 62
- 239000000463 material Substances 0.000 claims description 37
- 239000007789 gas Substances 0.000 claims description 32
- 239000012495 reaction gas Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 10
- 230000001965 increasing effect Effects 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 76
- 238000012545 processing Methods 0.000 description 75
- 230000008569 process Effects 0.000 description 46
- 238000002407 reforming Methods 0.000 description 21
- 239000007788 liquid Substances 0.000 description 20
- 230000007246 mechanism Effects 0.000 description 20
- 238000012986 modification Methods 0.000 description 13
- 230000004048 modification Effects 0.000 description 13
- 230000032258 transport Effects 0.000 description 12
- 238000012937 correction Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 230000002708 enhancing effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- -1 or the like Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011186300A JP5606412B2 (ja) | 2011-08-29 | 2011-08-29 | パターン形成装置、パターン形成方法及びパターン形成基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201325362A TW201325362A (zh) | 2013-06-16 |
| TWI520665B true TWI520665B (zh) | 2016-02-01 |
Family
ID=47756467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101131214A TWI520665B (zh) | 2011-08-29 | 2012-08-28 | 圖案形成設備與方法以及形成有圖案的基板的製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20140178566A1 (enExample) |
| JP (1) | JP5606412B2 (enExample) |
| KR (1) | KR101532521B1 (enExample) |
| CN (1) | CN103766013B (enExample) |
| TW (1) | TWI520665B (enExample) |
| WO (1) | WO2013031994A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6317935B2 (ja) * | 2014-02-05 | 2018-04-25 | 株式会社ディスコ | 保持テーブル |
| JP6420608B2 (ja) * | 2014-09-25 | 2018-11-07 | 東レエンジニアリング株式会社 | 基材処理方法および基材処理装置 |
| TW201724356A (zh) * | 2015-08-13 | 2017-07-01 | Idemitsu Kosan Co | 導體及其製造方法、及使用其之積層電路與積層佈線構件 |
| US20170100916A1 (en) * | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Electronic Component and Process of Producing Electronic Component |
| JP2017228669A (ja) * | 2016-06-23 | 2017-12-28 | 京セラ株式会社 | 配線基板およびその製造方法 |
| JP6881409B2 (ja) * | 2018-09-27 | 2021-06-02 | 日亜化学工業株式会社 | 照明装置およびその製造方法 |
| US10950463B2 (en) | 2019-01-31 | 2021-03-16 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Manufacturing trapezoidal through-hole in component carrier material |
| CN113265615A (zh) * | 2021-04-13 | 2021-08-17 | 上海大学 | 用于纳米量热仪定位衬底蒸镀的硅掩模装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60133992A (ja) * | 1983-12-21 | 1985-07-17 | Canon Inc | プリント基板の穴明け加工装置 |
| JPH1158051A (ja) * | 1997-08-25 | 1999-03-02 | Ngk Spark Plug Co Ltd | 基板の貫通孔の形成方法 |
| JP2004022916A (ja) * | 2002-06-19 | 2004-01-22 | Nikon Corp | レーザ光源制御方法及び装置、露光方法及び装置、並びにデバイス製造方法 |
| JP3779697B2 (ja) * | 2003-05-26 | 2006-05-31 | 株式会社野田スクリーン | 回路基板の孔埋め方法 |
| JP2005081159A (ja) * | 2003-09-04 | 2005-03-31 | Ricoh Co Ltd | 機能性基体製造装置ならびに製造される機能性基体 |
| JP2005183847A (ja) * | 2003-12-22 | 2005-07-07 | Seiko Epson Corp | 配線基板の形成方法 |
| JP2006041352A (ja) * | 2004-07-29 | 2006-02-09 | Dainippon Screen Mfg Co Ltd | 皮膜検査装置、検査システム、プログラム、皮膜検査方法およびプリント基板検査方法 |
| KR100993056B1 (ko) * | 2006-12-05 | 2010-11-08 | 주식회사 엘지화학 | 프리 패턴된 기판을 이용한 고해상도 잉크젯 인쇄 방법 및이 방법에 의해 제조된 도전성 기판 |
| JP2010123772A (ja) * | 2008-11-20 | 2010-06-03 | Panasonic Corp | プリント配線板の位置認識マークおよびプリント配線板の製造方法 |
-
2011
- 2011-08-29 JP JP2011186300A patent/JP5606412B2/ja not_active Expired - Fee Related
-
2012
- 2012-08-27 CN CN201280042240.7A patent/CN103766013B/zh not_active Expired - Fee Related
- 2012-08-27 KR KR1020147005250A patent/KR101532521B1/ko not_active Expired - Fee Related
- 2012-08-27 WO PCT/JP2012/072276 patent/WO2013031994A1/en not_active Ceased
- 2012-08-28 TW TW101131214A patent/TWI520665B/zh not_active IP Right Cessation
-
2014
- 2014-02-26 US US14/191,157 patent/US20140178566A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| KR101532521B1 (ko) | 2015-06-29 |
| TW201325362A (zh) | 2013-06-16 |
| JP2013048181A (ja) | 2013-03-07 |
| CN103766013B (zh) | 2016-10-05 |
| JP5606412B2 (ja) | 2014-10-15 |
| CN103766013A (zh) | 2014-04-30 |
| WO2013031994A1 (en) | 2013-03-07 |
| US20140178566A1 (en) | 2014-06-26 |
| KR20140057297A (ko) | 2014-05-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |