CN103766013B - 图案形成装置和方法以及制造形成有图案的基板的方法 - Google Patents

图案形成装置和方法以及制造形成有图案的基板的方法 Download PDF

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Publication number
CN103766013B
CN103766013B CN201280042240.7A CN201280042240A CN103766013B CN 103766013 B CN103766013 B CN 103766013B CN 201280042240 A CN201280042240 A CN 201280042240A CN 103766013 B CN103766013 B CN 103766013B
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CN
China
Prior art keywords
hole
substrate
data
deviation
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280042240.7A
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English (en)
Chinese (zh)
Other versions
CN103766013A (zh
Inventor
儿玉淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN103766013A publication Critical patent/CN103766013A/zh
Application granted granted Critical
Publication of CN103766013B publication Critical patent/CN103766013B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/087—Using a reactive gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN201280042240.7A 2011-08-29 2012-08-27 图案形成装置和方法以及制造形成有图案的基板的方法 Expired - Fee Related CN103766013B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-186300 2011-08-29
JP2011186300A JP5606412B2 (ja) 2011-08-29 2011-08-29 パターン形成装置、パターン形成方法及びパターン形成基板の製造方法
PCT/JP2012/072276 WO2013031994A1 (en) 2011-08-29 2012-08-27 Pattern forming apparatus and method, and method of manufacturing substrate formed with pattern

Publications (2)

Publication Number Publication Date
CN103766013A CN103766013A (zh) 2014-04-30
CN103766013B true CN103766013B (zh) 2016-10-05

Family

ID=47756467

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280042240.7A Expired - Fee Related CN103766013B (zh) 2011-08-29 2012-08-27 图案形成装置和方法以及制造形成有图案的基板的方法

Country Status (6)

Country Link
US (1) US20140178566A1 (enExample)
JP (1) JP5606412B2 (enExample)
KR (1) KR101532521B1 (enExample)
CN (1) CN103766013B (enExample)
TW (1) TWI520665B (enExample)
WO (1) WO2013031994A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6317935B2 (ja) * 2014-02-05 2018-04-25 株式会社ディスコ 保持テーブル
JP6420608B2 (ja) * 2014-09-25 2018-11-07 東レエンジニアリング株式会社 基材処理方法および基材処理装置
TW201724356A (zh) * 2015-08-13 2017-07-01 Idemitsu Kosan Co 導體及其製造方法、及使用其之積層電路與積層佈線構件
US20170100916A1 (en) * 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
JP2017228669A (ja) * 2016-06-23 2017-12-28 京セラ株式会社 配線基板およびその製造方法
JP6881409B2 (ja) * 2018-09-27 2021-06-02 日亜化学工業株式会社 照明装置およびその製造方法
US10950463B2 (en) 2019-01-31 2021-03-16 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Manufacturing trapezoidal through-hole in component carrier material
CN113265615A (zh) * 2021-04-13 2021-08-17 上海大学 用于纳米量热仪定位衬底蒸镀的硅掩模装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1472777A (zh) * 2002-06-19 2004-02-04 ������������ʽ���� 激光光源控制法及其装置、曝光法及其设备和器件制造法
JP2004349618A (ja) * 2003-05-26 2004-12-09 Noda Screen:Kk 回路基板の孔埋め方法および孔埋め装置
JP2005183847A (ja) * 2003-12-22 2005-07-07 Seiko Epson Corp 配線基板の形成方法
CN1755322A (zh) * 2004-07-29 2006-04-05 大日本网目版制造株式会社 膜检测装置、检验系统以及检验印刷电路板的方法
WO2008069565A1 (en) * 2006-12-05 2008-06-12 Lg Chem, Ltd. Method for high resolution ink-jet print using pre-patterned substrate and conductive substrate manufactured using the same
JP2010123772A (ja) * 2008-11-20 2010-06-03 Panasonic Corp プリント配線板の位置認識マークおよびプリント配線板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133992A (ja) * 1983-12-21 1985-07-17 Canon Inc プリント基板の穴明け加工装置
JPH1158051A (ja) * 1997-08-25 1999-03-02 Ngk Spark Plug Co Ltd 基板の貫通孔の形成方法
JP2005081159A (ja) * 2003-09-04 2005-03-31 Ricoh Co Ltd 機能性基体製造装置ならびに製造される機能性基体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1472777A (zh) * 2002-06-19 2004-02-04 ������������ʽ���� 激光光源控制法及其装置、曝光法及其设备和器件制造法
JP2004349618A (ja) * 2003-05-26 2004-12-09 Noda Screen:Kk 回路基板の孔埋め方法および孔埋め装置
JP2005183847A (ja) * 2003-12-22 2005-07-07 Seiko Epson Corp 配線基板の形成方法
CN1755322A (zh) * 2004-07-29 2006-04-05 大日本网目版制造株式会社 膜检测装置、检验系统以及检验印刷电路板的方法
WO2008069565A1 (en) * 2006-12-05 2008-06-12 Lg Chem, Ltd. Method for high resolution ink-jet print using pre-patterned substrate and conductive substrate manufactured using the same
JP2010123772A (ja) * 2008-11-20 2010-06-03 Panasonic Corp プリント配線板の位置認識マークおよびプリント配線板の製造方法

Also Published As

Publication number Publication date
KR101532521B1 (ko) 2015-06-29
TW201325362A (zh) 2013-06-16
JP2013048181A (ja) 2013-03-07
JP5606412B2 (ja) 2014-10-15
TWI520665B (zh) 2016-02-01
CN103766013A (zh) 2014-04-30
WO2013031994A1 (en) 2013-03-07
US20140178566A1 (en) 2014-06-26
KR20140057297A (ko) 2014-05-12

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