JP2013042127A - リソグラフィ装置、リソグラフィ装置の支持テーブル及びデバイス製造方法 - Google Patents

リソグラフィ装置、リソグラフィ装置の支持テーブル及びデバイス製造方法 Download PDF

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Publication number
JP2013042127A
JP2013042127A JP2012167085A JP2012167085A JP2013042127A JP 2013042127 A JP2013042127 A JP 2013042127A JP 2012167085 A JP2012167085 A JP 2012167085A JP 2012167085 A JP2012167085 A JP 2012167085A JP 2013042127 A JP2013042127 A JP 2013042127A
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JP
Japan
Prior art keywords
substrate
adjustment
thermal energy
support table
support
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Pending
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JP2012167085A
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English (en)
Japanese (ja)
Inventor
Johann Gertrudix Cornelis Kunen
クネン，ヨハン，ヘルトルディス，コルネリス
Johannes Henricus Wilhelmus Jacobs
ヤコブス，ヨハネス，ヘンリカス，ウィルヘルムス
Coen Cornelis Wilhelmus Verspaget
フェルスパゲート，コーエン，コルネリス，ウィルヘルムス
Der Ham Ronald Van
デル ハム，ロナルド ヴァン
Ivo Adam Johannes Thomas
トーマス，イヴォ，アダム，ヨハネス
Martijn Houben
フーベン，マーティン
Thibaud Simon Matthew Laurent
ローラン，ティボー，サイモン，マチュー
Martin Mason Corcoran Gregory
コルコラン，グレゴリー，マーティン，マソン
Ruud Hendrikus Martinus Johannes Bloks
ブロックス，ルート，ヘンドリカス，マルティヌス，ヨハネス
Peters Gerben
ピーテルス，ゲルベン
Pieter Lein Joseph Gunther
ギュンター，ピーター，レイン，ヨセフ
Marinus Jan Remie
レミエ，マリヌス，ヤン
Catharina Reinier Derks Sander
ダークス，サンダー，キャサリナ，ライナー
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ASML Netherlands BV
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ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of JP2013042127A publication Critical patent/JP2013042127A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Microscoopes, Condenser (AREA)
JP2012167085A 2011-08-18 2012-07-27 リソグラフィ装置、リソグラフィ装置の支持テーブル及びデバイス製造方法 Pending JP2013042127A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161524960P 2011-08-18 2011-08-18
US61/524,960 2011-08-18

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JP2013042127A true JP2013042127A (ja) 2013-02-28

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JP2015003993A Active JP6080875B2 (ja) 2011-08-18 2015-01-13 リソグラフィ装置、リソグラフィ装置の支持テーブル及びデバイス製造方法

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Country Status (7)

Country Link
US (3) US9897928B2 (enExample)
EP (1) EP2560050A1 (enExample)
JP (2) JP2013042127A (enExample)
KR (2) KR20130020636A (enExample)
CN (1) CN102981370B (enExample)
SG (1) SG188036A1 (enExample)
TW (1) TWI512408B (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
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JP2013042128A (ja) * 2011-08-17 2013-02-28 Asml Netherlands Bv リソグラフィ装置の支持テーブル、リソグラフィ装置及びデバイス製造方法
JP2016012593A (ja) * 2014-06-27 2016-01-21 東京エレクトロン株式会社 温度制御可能なステージを含むシステム、半導体製造装置及びステージの温度制御方法
JP2017526952A (ja) * 2014-07-23 2017-09-14 エーエスエムエル ネザーランズ ビー．ブイ． 調節システム及び調節システムを備えるリソグラフィ装置
US9835957B2 (en) 2013-09-27 2017-12-05 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
KR102002625B1 (ko) * 2018-06-11 2019-07-22 한국표준과학연구원 확장된 검사 영역을 갖는 웨이퍼 센서, 및 이를 이용한 건식 공정 장치
JP2022125685A (ja) * 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法
WO2025187424A1 (ja) * 2024-03-04 2025-09-12 東京エレクトロン株式会社 基板処理装置

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EP2856262B1 (en) 2012-05-29 2019-09-25 ASML Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
NL2012452A (en) * 2013-04-09 2014-10-13 Asml Netherlands Bv Support structure, associated apparatusses and methods.
WO2015028202A1 (en) 2013-08-30 2015-03-05 Asml Netherlands B.V. Immersion lithographic apparatus
US9541846B2 (en) * 2013-09-06 2017-01-10 Taiwan Semiconductor Manufacturing Co., Ltd. Homogeneous thermal equalization with active device
CN110068991B (zh) * 2014-10-23 2021-03-12 Asml荷兰有限公司 用于光刻设备的支撑台和光刻设备
CN104614951B (zh) * 2015-03-04 2016-10-19 京东方科技集团股份有限公司 曝光装置和曝光方法
KR102756397B1 (ko) * 2015-10-06 2025-01-16 에이에스엠엘 홀딩 엔.브이. 리소그래피 장치의 물체를 유지하는 척과 클램프 및 리소그래피 장치의 클램프에 의해 유지되는 물체의 온도를 제어하는 방법
JP6868109B2 (ja) 2017-01-26 2021-05-12 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びデバイスを製造する方法
CN111406235B (zh) 2017-11-20 2025-01-21 Asml荷兰有限公司 衬底保持器、衬底支撑件和将衬底夹持至夹持系统的方法
CN110554572B (zh) * 2018-05-31 2020-10-16 上海微电子装备（集团）股份有限公司 吸盘
IL283621B2 (en) 2018-12-21 2025-04-01 Asml Holding Nv Retinal subfield thermal control
US20220342322A1 (en) * 2019-06-28 2022-10-27 Asml Netherlands B.V. Substrate handling system of a lithography apparatus and method thereof
US11450552B2 (en) 2019-08-01 2022-09-20 Micron Technology, Inc. Methods and apparatus for adjusting surface topography of a substrate support apparatus
US11966165B2 (en) 2021-01-22 2024-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion exposure tool

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US10324382B2 (en) 2011-08-17 2019-06-18 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US8970822B2 (en) 2011-08-17 2015-03-03 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US11650511B2 (en) 2011-08-17 2023-05-16 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US9575419B2 (en) 2011-08-17 2017-02-21 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US9740110B2 (en) 2011-08-17 2017-08-22 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US10747126B2 (en) 2011-08-17 2020-08-18 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US9971252B2 (en) 2011-08-17 2018-05-15 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
JP2013042128A (ja) * 2011-08-17 2013-02-28 Asml Netherlands Bv リソグラフィ装置の支持テーブル、リソグラフィ装置及びデバイス製造方法
US9835957B2 (en) 2013-09-27 2017-12-05 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
TWI628408B (zh) * 2014-06-27 2018-07-01 日商東京威力科創股份有限公司 包含可控制溫度之載台之系統、半導體製造裝置及載台之溫度控制方法
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EP2560050A1 (en) 2013-02-20
US20200124993A1 (en) 2020-04-23
KR20150082145A (ko) 2015-07-15
US9897928B2 (en) 2018-02-20
US11300890B2 (en) 2022-04-12
JP2015065482A (ja) 2015-04-09
TW201314378A (zh) 2013-04-01
CN102981370B (zh) 2015-08-05
US20180284627A1 (en) 2018-10-04
KR20130020636A (ko) 2013-02-27
TWI512408B (zh) 2015-12-11
KR101932995B1 (ko) 2018-12-27
US20130045447A1 (en) 2013-02-21
US10520837B2 (en) 2019-12-31

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