TWI512408B - 微影設備，用於微影設備之支撐平台及元件製造方法 - Google Patents

微影設備，用於微影設備之支撐平台及元件製造方法 Download PDF

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Publication number
TWI512408B
TWI512408B TW101128658A TW101128658A TWI512408B TW I512408 B TWI512408 B TW I512408B TW 101128658 A TW101128658 A TW 101128658A TW 101128658 A TW101128658 A TW 101128658A TW I512408 B TWI512408 B TW I512408B
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TW
Taiwan
Prior art keywords
support
substrate
support platform
thermal energy
adjustment
Prior art date
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TW101128658A
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English (en)
Chinese (zh)
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TW201314378A (zh
Inventor
約翰 葛卓迪斯 寇尼里斯 庫尼
喬漢斯 亨利哈斯 威廉瑪斯 賈庫博
柯尹 康那利斯 威廉斯 弗斯班根
德 翰 羅納德 凡
艾佛 亞當 喬翰納 湯瑪士
馬提恩 豪班
帝寶 賽門 馬修 勞倫
葛雷格里 馬丁 梅森 科可瑞
羅德 亨利克斯 馬丁尼司 喬漢尼斯 布洛克
葛本 派特司
彼得 里恩 約瑟夫 剛特
瑪里努斯 珍 瑞米
山多 卡特琳娜 雷納 德可
Original Assignee
Ａｓｍｌ荷蘭公司
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Application filed by Ａｓｍｌ荷蘭公司 filed Critical Ａｓｍｌ荷蘭公司
Publication of TW201314378A publication Critical patent/TW201314378A/zh
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Publication of TWI512408B publication Critical patent/TWI512408B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H10P72/70—
    • H10P76/2041—

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microscoopes, Condenser (AREA)
TW101128658A 2011-08-18 2012-08-08 微影設備，用於微影設備之支撐平台及元件製造方法 TWI512408B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161524960P 2011-08-18 2011-08-18

Publications (2)

Publication Number Publication Date
TW201314378A TW201314378A (zh) 2013-04-01
TWI512408B true TWI512408B (zh) 2015-12-11

Family

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Family Applications (1)

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TW101128658A TWI512408B (zh) 2011-08-18 2012-08-08 微影設備，用於微影設備之支撐平台及元件製造方法

Country Status (7)

Country Link
US (3) US9897928B2 (enExample)
EP (1) EP2560050A1 (enExample)
JP (2) JP2013042127A (enExample)
KR (2) KR20130020636A (enExample)
CN (1) CN102981370B (enExample)
SG (1) SG188036A1 (enExample)
TW (1) TWI512408B (enExample)

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CN107367907B (zh) 2012-05-29 2019-05-03 Asml荷兰有限公司 支撑装置、光刻装置和器件制造方法
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JP6018606B2 (ja) 2014-06-27 2016-11-02 東京エレクトロン株式会社 温度制御可能なステージを含むシステム、半導体製造装置及びステージの温度制御方法
NL2015013A (en) 2014-07-23 2016-06-27 Asml Netherlands Bv Conditioning System and Method for a Lithographic Apparatus and a Lithographic Apparatus Comprising a Conditioning System.
CN110068991B (zh) * 2014-10-23 2021-03-12 Asml荷兰有限公司 用于光刻设备的支撑台和光刻设备
CN104614951B (zh) * 2015-03-04 2016-10-19 京东方科技集团股份有限公司 曝光装置和曝光方法
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CN110554572B (zh) * 2018-05-31 2020-10-16 上海微电子装备（集团）股份有限公司 吸盘
KR102002625B1 (ko) * 2018-06-11 2019-07-22 한국표준과학연구원 확장된 검사 영역을 갖는 웨이퍼 센서, 및 이를 이용한 건식 공정 장치
KR20210105903A (ko) 2018-12-21 2021-08-27 에이에스엠엘 홀딩 엔.브이. 레티클 서브필드 열 제어
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JP2022125685A (ja) 2021-02-17 2022-08-29 株式会社Kelk 半導体ウエハの温度制御装置及び半導体ウエハの温度制御方法
WO2025187424A1 (ja) * 2024-03-04 2025-09-12 東京エレクトロン株式会社 基板処理装置

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Also Published As

Publication number Publication date
TW201314378A (zh) 2013-04-01
KR20150082145A (ko) 2015-07-15
KR20130020636A (ko) 2013-02-27
US9897928B2 (en) 2018-02-20
US11300890B2 (en) 2022-04-12
JP2013042127A (ja) 2013-02-28
US10520837B2 (en) 2019-12-31
CN102981370B (zh) 2015-08-05
JP6080875B2 (ja) 2017-02-15
US20180284627A1 (en) 2018-10-04
SG188036A1 (en) 2013-03-28
EP2560050A1 (en) 2013-02-20
JP2015065482A (ja) 2015-04-09
US20130045447A1 (en) 2013-02-21
KR101932995B1 (ko) 2018-12-27
CN102981370A (zh) 2013-03-20
US20200124993A1 (en) 2020-04-23

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