JP2013042095A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device Download PDF

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JP2013042095A
JP2013042095A JP2011179919A JP2011179919A JP2013042095A JP 2013042095 A JP2013042095 A JP 2013042095A JP 2011179919 A JP2011179919 A JP 2011179919A JP 2011179919 A JP2011179919 A JP 2011179919A JP 2013042095 A JP2013042095 A JP 2013042095A
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emitting device
light emitting
led
led light
fluorescent
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JP5837775B2 (en
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Katsuyuki Tanaka
克幸 田中
Shusaku Mochizuki
周作 望月
Ryo Tamura
量 田村
Atsushi Shiraishi
篤 白石
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which includes: a semiconductor light emitting element where at least a side surface and an upper surface are covered by a transparent member (hereinafter, referred to as the fluorescent member) including a fluorescence material; a circuit board on which the semiconductor light emitting element is mounted; and a reflection member disposed on an upper surface of the fluorescent member, the semiconductor light emitting device being an LED light emitting device which improves fastening forces between the fluorescent member and the reflection member and between the fluorescent member and the circuit board.SOLUTION: An LED light emitting device 10 includes: an LED 1 where at least a side surface and an upper surface are covered by a fluorescent member 7; and a reflection member 6 disposed on an upper surface of the fluorescent member 7. The LED light emitting device 10 further includes a transparent member 5 at a region which is located around the fluorescent member 7 and is sandwiched between a circuit board 2 and the reflection member 6. The adhesion between the circuit board 2 and the fluorescent member 7 and between the fluorescent member 7 and the reflection member 6 are reinforced.

Description

本発明はＬＥＤ素子等の半導体発光素子を備えた半導体発光装置に関するものであり、詳しくは実装した半導体発光素子の発光面上に透光部材を介して反射部材を設けた半導体発光装置に関する。   The present invention relates to a semiconductor light emitting device including a semiconductor light emitting element such as an LED element, and more particularly to a semiconductor light emitting device in which a reflective member is provided on a light emitting surface of a mounted semiconductor light emitting element via a light transmitting member.

近年、ＬＥＤ素子（以下ＬＥＤと略記する）は半導体発光素子であるため、長寿命で優れた駆動特性を有し、さらに小型で発光効率が良く、鮮やかな発光色を有することから、カラー表示装置のバックライトや照明等に広く利用されるようになってきた。本発明においても半導体発光装置として、ＬＥＤ発光装置を事例として説明する。   In recent years, an LED element (hereinafter abbreviated as LED) is a semiconductor light emitting element, and therefore has a long life and excellent driving characteristics, is small in size, has high luminous efficiency, and has a bright emission color. It has come to be widely used for backlights and lighting. In the present invention, an LED light emitting device will be described as an example of the semiconductor light emitting device.

特に近年、ＬＥＤの周囲を透光部材である透光性樹脂で被覆し、さらに被覆した透光性樹脂の上面側に反射部材の層を設けたＬＥＤ発光装置が提案されている。（例えば特許文献１、特許文献２）   Particularly in recent years, an LED light emitting device has been proposed in which the periphery of an LED is coated with a translucent resin as a translucent member, and a reflective member layer is provided on the top surface side of the coated translucent resin. (For example, Patent Document 1 and Patent Document 2)

以下、反射部材を透光部材の上面に配設した従来のＬＥＤ発光装置に付いて説明する。なお、理解し易いように発明の趣旨を外さない範囲において図面を一部簡略化し、また部品名称も本願にそろえている。図７は特許文献１に示されたＬＥＤ発光装置１００の断面図であり、回路基板１０２の上面には配線電極１０３ａ、１０３ｂが設けられており、配線電極１０３ａに実装固着されたＬＥＤ１０１の電極がワイヤー１０４によって、配線電極１０３ｂにワイヤーボンディングされている。さらに配線電極１０３ａ、１０３ｂは回路基板１０２の側面を通じて回路基板１０２の裏面側に導かれ、駆動電極１０３ｃを形成している。   Hereinafter, a conventional LED light emitting device in which a reflecting member is disposed on the upper surface of the light transmitting member will be described. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and component names are also included in the present application. FIG. 7 is a cross-sectional view of the LED light emitting device 100 disclosed in Patent Document 1. Wiring electrodes 103a and 103b are provided on the upper surface of the circuit board 102, and the electrodes of the LED 101 mounted and fixed to the wiring electrode 103a are provided. The wire 104 is wire-bonded to the wiring electrode 103b. Further, the wiring electrodes 103a and 103b are guided to the back side of the circuit board 102 through the side surface of the circuit board 102 to form the drive electrode 103c.

またＬＥＤ１０１の上面及び側面は透光性樹脂１０５（透光部材）により封止されており、さらに透光性樹脂１０５の上面には反射部材１０６（光遮蔽層）が設けられている。すなわちＬＥＤ１０１の真上に放射される強い放射光を遮る位置に反射部材１０６を配置している。   Further, the upper surface and side surfaces of the LED 101 are sealed with a translucent resin 105 (translucent member), and a reflective member 106 (light shielding layer) is provided on the upper surface of the translucent resin 105. That is, the reflecting member 106 is arranged at a position that blocks strong radiated light emitted directly above the LED 101.

次に上記ＬＥＤ発光装置１００の発光動作を説明する。図示しない実装基板に半田付け等により接続した回路基板１０２の駆動電極１０３ｃより、ＬＥＤ１０１へ駆動電流を供給するとＬＥＤ１０１が発光する。このとき反射部材１０６がない場合を考える。ＬＥＤ１０１は上面及び側面方向に光を出射するとしても、上方への出射光は極めて強くなる。このため、ＬＥＤ１０１の真上が極端に強く周辺が弱い発光状態となり、照明装置にＬＥＤ発光装置１００を組み込むと輝度むらが生じる。つまりＬＤＥ１０１の中心のみ明るくて周囲は暗い照明装置となる。   Next, the light emitting operation of the LED light emitting device 100 will be described. When a drive current is supplied to the LED 101 from the drive electrode 103c of the circuit board 102 connected to a mounting board (not shown) by soldering or the like, the LED 101 emits light. Consider a case where the reflecting member 106 is not present at this time. Even if the LED 101 emits light in the upper surface and side surface directions, the upward emitted light is extremely strong. For this reason, the LED 101 is in an extremely strong light emitting state where the area directly above the LED 101 is extremely strong and the periphery is weak, and when the LED light emitting device 100 is incorporated into the lighting device, uneven brightness occurs. That is, only the center of the LDE 101 is bright and the surroundings are dark.

上記問題を解決するために、ＬＥＤ発光装置１００では、ＬＥＤ１０１を封止している透光性樹脂１０５の透光樹脂上面１０５ａに反射部材１０６（光遮蔽層）を設けている。すなわちＬＥＤ１０１の真上の極端に強い放射光を反射部材１０６によって阻止または抑制し、さらに反射部材１０６によって反射させ周囲から放射させることによって、ＬＥＤ１０１の正面が局部的に明るくなるという配光むらを改善している。なお、反射部材１０６としては白色樹脂や金属層のようにＬＥＤ１０１の発光を反射させる材料が使われている。   In order to solve the above problem, in the LED light emitting device 100, a reflective member 106 (light shielding layer) is provided on the translucent resin upper surface 105a of the translucent resin 105 sealing the LED 101. That is, the extremely strong radiated light directly above the LED 101 is blocked or suppressed by the reflecting member 106, and further reflected by the reflecting member 106 and radiated from the surroundings, thereby improving the uneven light distribution in which the front surface of the LED 101 becomes locally bright. doing. The reflective member 106 is made of a material that reflects light emitted from the LED 101, such as a white resin or a metal layer.

図８は特許文献２の図１に示されたＬＥＤ発光装置２００の断面図である。ＬＥＤ発光装置２００は、回路基板２０２の上面に設けた配線電極（図示せず）にフリップチップ実装したＬＥＤ２０１と、ＬＥＤ２０１を覆うようにして封止する透光性樹脂２０５と、透光性樹脂２０５の上面に形成した反射部材２０６を備えている。反射部材２０６は、半透過反射性の金属箔膜よりなり、蒸着またはメッキ法で形成する。反射部材２０６の反射率（又は透過率）及び面積、透光性樹脂２０５の厚み等を任意に設定することにより、正面方向の光出射量や広がり角の制御が可能となる。例えば、反射部材２０６を透過する透過光Ｐ１の量や側面方向へ出射する反射光Ｐ２の光路長を調節して指向特性を改善することができる。このＬＥＤ発光装置２００は少ない構成部品で発光ムラの緩和を行っている。   FIG. 8 is a cross-sectional view of the LED light emitting device 200 shown in FIG. The LED light emitting device 200 includes an LED 201 flip-chip mounted on a wiring electrode (not shown) provided on an upper surface of a circuit board 202, a translucent resin 205 that seals the LED 201 so as to cover the LED 201, and a translucent resin 205. A reflection member 206 formed on the upper surface of the substrate is provided. The reflection member 206 is made of a transflective metal foil film and is formed by vapor deposition or plating. By arbitrarily setting the reflectance (or transmittance) and area of the reflecting member 206, the thickness of the translucent resin 205, and the like, it is possible to control the light emission amount and the spread angle in the front direction. For example, the directivity can be improved by adjusting the amount of transmitted light P1 transmitted through the reflecting member 206 and the optical path length of the reflected light P2 emitted in the side surface direction. This LED light emitting device 200 reduces light emission unevenness with a small number of components.

特開２００１−２５７３８１号公報（図１）Japanese Patent Laying-Open No. 2001-257381 (FIG. 1) 特開２００４−３０４０４１号公報（図１）Japanese Patent Laying-Open No. 2004-304041 (FIG. 1)

上記引用文献１，２に記載されたＬＥＤ発光装置１００，２００において、透光性樹脂１０５，２０５は、回路基板１０２，２０２や反射部材１０６，２０６との間で強く接着している。しかしながら、よく知られているように発光色を白色化するため透光性樹脂１０５，２０５に蛍光粒子を混入すると接着性能が低下することがある。   In the LED light emitting devices 100 and 200 described in the cited documents 1 and 2, the translucent resins 105 and 205 are strongly bonded to the circuit boards 102 and 202 and the reflecting members 106 and 206. However, as is well known, if fluorescent particles are mixed in the translucent resins 105 and 205 in order to whiten the emission color, the adhesion performance may be lowered.

そこで本発明の目的は、上記問題点を解決しようとするものであり、蛍光体を含有する透光部材（以下蛍光部材と呼ぶ）により少なくとも側面及び上面を被覆した半導体発光素子と、この半導体発光素子を搭載する回路基板と、この蛍光部材の上面に配置された反射部材とを備える半導体発光装置において、蛍光部材と回路基板及び反射部材との固着力を高めたＬＥＤ発光装置を提供することである。   Accordingly, an object of the present invention is to solve the above-described problems. A semiconductor light-emitting element having at least a side surface and an upper surface covered with a light-transmitting member (hereinafter referred to as a fluorescent member) containing a phosphor, and the semiconductor light-emitting device. In a semiconductor light emitting device including a circuit board on which an element is mounted and a reflecting member disposed on the upper surface of the fluorescent member, an LED light emitting device in which the adhesion between the fluorescent member, the circuit board, and the reflecting member is increased is provided. is there.

上記目的を達成するため本発明におけるＬＥＤ発光装置の構成は、下記の通りである。
蛍光部材で少なくとも側面及び上面を被覆した半導体発光素子と、該半導体発光素子を搭載する回路基板と、前記蛍光部材の上面に反射部材とを備える半導体発光装置において、前記蛍光部材の周囲であって前記回路基板と前記反射部材により挟まれる領域に透明部材を備えることを特徴とする。 In order to achieve the above object, the configuration of the LED light emitting device in the present invention is as follows.
In a semiconductor light emitting device comprising a semiconductor light emitting device having at least a side surface and an upper surface covered with a fluorescent member, a circuit board on which the semiconductor light emitting device is mounted, and a reflective member on the upper surface of the fluorescent member, A transparent member is provided in a region sandwiched between the circuit board and the reflecting member.

上記構成によれば、回路基板及び反射部材に対する蛍光部材の接着性の悪さを、蛍光部材の周囲に設けた透明部材の接着性の良さによって補償できる。   According to the above configuration, the poor adhesion of the fluorescent member to the circuit board and the reflecting member can be compensated by the good adhesion of the transparent member provided around the fluorescent member.

前記回路基板の周囲に段差部を設け、該段差部と前記透明部材が係合していると良い。   A step portion may be provided around the circuit board, and the step portion and the transparent member may be engaged with each other.

上記構成によれば、回路基板周囲の段差部に透明部材が係合することによって、さらに回路基板と透明部材の結合をより強固にすることができる。   According to the above configuration, the coupling between the circuit board and the transparent member can be further strengthened by engaging the transparent member with the step portion around the circuit board.

前記反射部材が前記蛍光部材に比べ硬質の材料からなり、前記反射部材が前記蛍光部材に貼りついていると良い。   The reflecting member is preferably made of a material harder than the fluorescent member, and the reflecting member is preferably attached to the fluorescent member.

前記反射部材の上面に溝を有すると良い。   A groove may be provided on the upper surface of the reflecting member.

上記構成によれば、反射部材として取り扱い性の良い金属板や硬質の樹脂板を用いることによって製造が簡単になる。さらに板状の反射部材の上面に溝を設けることによって、反射部材と他の部材との間の熱膨張率差で生じる反りを防止することができる。   According to the said structure, manufacture becomes easy by using a metal plate with good handleability or a hard resin board as a reflecting member. Furthermore, by providing a groove on the upper surface of the plate-like reflecting member, it is possible to prevent warpage caused by a difference in thermal expansion coefficient between the reflecting member and another member.

前記反射部材が透過性を有すると良く、さらに前記反射部材が透過性の微細開口を有すると良い。   The reflective member may be transmissive, and the reflective member may have transmissive fine openings.

上記構成によれば、反射部材の透過性によって反射部材の上面側にも出射光が存在するため、この反射部材の透過率と反射率を調整することにより配光をバランスよくできる。この半導体発光装置を照明装置に組み込めば、配光が良いため照明装置としての特性が改善される。
また、反射部材に透過性の微細開口を設ける構成の場合は、反射部材として高反射性の金属板を使用することができるため、反射部材の透過率と反射率の調整をより高い精度で行うことができる。 According to the said structure, since emitted light exists also in the upper surface side of a reflection member by the transmittance | permeability of a reflection member, light distribution can be balanced by adjusting the transmittance | permeability and reflectance of this reflection member. If this semiconductor light-emitting device is incorporated in a lighting device, the light distribution is good and the characteristics of the lighting device are improved.
Further, in the case of a configuration in which a transmissive fine opening is provided in the reflective member, a highly reflective metal plate can be used as the reflective member, so that the transmittance and reflectance of the reflective member are adjusted with higher accuracy. be able to.

上記の如く本発明によれば、回路基板及び反射部材に対する蛍光樹脂の接着性の悪さを、蛍光部材の周囲に設けた透明部材の接着性の良さによって補償できる。このため、接着部分の剥がれや、接着部分からの水分侵入等によるトラブルの発生を防止することができる。   As described above, according to the present invention, the poor adhesion of the fluorescent resin to the circuit board and the reflecting member can be compensated by the good adhesion of the transparent member provided around the fluorescent member. For this reason, it is possible to prevent the occurrence of troubles due to peeling of the bonded portion or moisture intrusion from the bonded portion.

本発明の第１実施形態におけるＬＥＤ発光装置を示し、（ａ）は断面図、（ｂ）は上面図、（ｃ）は側面図、（ｄ）は下面図である。The LED light-emitting device in 1st Embodiment of this invention is shown, (a) is sectional drawing, (b) is a top view, (c) is a side view, (d) is a bottom view. 図１（ａ）に示すＬＥＤ発光装置の出射特性を示す断面図である。It is sectional drawing which shows the emission characteristic of the LED light-emitting device shown to Fig.1 (a). 本発明の第２実施形態におけるＬＥＤ発光装置を示し、（ａ）は断面図、（ｂ）は上面図、（ｃ）は側面図、（ｄ）は下面図である。The LED light-emitting device in 2nd Embodiment of this invention is shown, (a) is sectional drawing, (b) is a top view, (c) is a side view, (d) is a bottom view. 本発明の第３実施形態におけるＬＥＤ発光装置を示し、（ａ）は断面図、（ｂ）は上面図、（ｃ）は側面図、（ｄ）は下面図である。The LED light-emitting device in 3rd Embodiment of this invention is shown, (a) is sectional drawing, (b) is a top view, (c) is a side view, (d) is a bottom view. 図４（ａ）に示すＬＥＤ発光装置の出射特性を示す断面図である。It is sectional drawing which shows the emission characteristic of the LED light-emitting device shown to Fig.4 (a). 参考例におけるＬＥＤ発光装置を示し、（ａ）は断面図、（ｂ）は上面図、（ｃ）は側面図、（ｄ）は下面図である。The LED light-emitting device in a reference example is shown, (a) is sectional drawing, (b) is a top view, (c) is a side view, (d) is a bottom view. 従来のＬＥＤ発光装置の断面図である。It is sectional drawing of the conventional LED light-emitting device. 従来のＬＥＤ発光装置の断面図である。It is sectional drawing of the conventional LED light-emitting device.

（第１実施形態）
以下図面により本発明の実施形態を説明する。図１は本発明の第１実施形態におけるＬＥＤ発光装置１０を示し、（ａ）はＬＥＤ発光装置１０の断面図、（ｂ）は（ａ）に示すＬＥＤ発光装置１０の上面図、（ｃ）は側面図、（ｄ）は下面図を示している。 (First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an LED light emitting device 10 according to a first embodiment of the present invention, wherein (a) is a cross-sectional view of the LED light emitting device 10, (b) is a top view of the LED light emitting device 10 shown in (a), and (c). Is a side view, and (d) is a bottom view.

図１（ａ）に示すＬＥＤ発光装置１０の断面図おいて、回路基板２の上面に設けられた２個の配線電極３ａは、スルーホール電極３ｂを通して駆動電極３ｃに接続している。配線電極３ａにはＬＥＤ１がフリップチップ実装（以後ＦＣ実装と略記する）されており、回路基板２の周囲には段差部２ｄが設けられている。ＬＥＤ１の上面及び側面は蛍光樹脂７（蛍光部材）で被覆されており、この蛍光樹脂７の蛍光樹脂上面７ａには反射部材６が接着している。この反射部材６の上面には後述する溝６ａが設けられている。さらに蛍光樹脂７の周囲であって反射部材６と回路基板２の間隙となる空間には透明樹脂５が充填されている。透明樹脂５は回路基板２の段差部２ｄで接着することにより周辺部が強固になる。   In the cross-sectional view of the LED light emitting device 10 shown in FIG. 1A, the two wiring electrodes 3a provided on the upper surface of the circuit board 2 are connected to the drive electrode 3c through the through-hole electrode 3b. The LED 1 is flip-chip mounted (hereinafter abbreviated as FC mounting) on the wiring electrode 3 a, and a step portion 2 d is provided around the circuit board 2. The upper surface and side surfaces of the LED 1 are covered with a fluorescent resin 7 (fluorescent member), and a reflective member 6 is bonded to the fluorescent resin upper surface 7 a of the fluorescent resin 7. A groove 6 a described later is provided on the upper surface of the reflecting member 6. Further, a transparent resin 5 is filled in a space around the fluorescent resin 7 and serving as a gap between the reflecting member 6 and the circuit board 2. The transparent resin 5 is bonded at the stepped portion 2d of the circuit board 2 to strengthen the peripheral portion.

次にＬＥＤ発光装置１０の全体構成を図１（ｂ）〜（ｄ）により説明する。
図１(ｂ)はＬＥＤ発光装置１０の上面図であり、（ａ）は（ｂ）のＡ−Ａ断面図に該当する。（ｂ）において反射部材６としては、適度の光透過性と適度の光反射性を有することが要求されており、例えばアクリル樹脂やエポキシ樹脂に酸化チタン等の反射材を混入した白色樹脂板や金属板等である。 Next, the whole structure of the LED light-emitting device 10 is demonstrated with reference to FIG.1 (b)-(d).
FIG. 1B is a top view of the LED light emitting device 10, and FIG. 1A corresponds to the AA cross-sectional view of FIG. In (b), the reflecting member 6 is required to have an appropriate light transmittance and an appropriate light reflectivity. For example, a white resin plate in which a reflective material such as titanium oxide is mixed in an acrylic resin or an epoxy resin, It is a metal plate or the like.

また、（ｃ）に示す側面図の如く、板状の反射部材６は蛍光樹脂７に比べて硬質の材料であり、反射部材６が蛍光樹脂７に貼りついて固定されているため、反射部材６の熱膨張係数と他の部材の熱膨張係数の差により反りが発生する恐れがある。そこで反ろうとする内部応力を分散させるため反射部材６の上面に溝６ａが升目状に形成されている。さらに反射部材６の周囲及び断差部２ｄを含む回路基板２の周囲を透明樹脂５によって接着することにより、接着力の低下した蛍光樹脂７を補強している。（ｄ）はＬＥＤ発光装置１０の下面図であり、回路基板２の下面には２個の駆動電極３ｃが設けられている。   Further, as shown in the side view of (c), the plate-like reflecting member 6 is made of a harder material than the fluorescent resin 7, and the reflecting member 6 is fixed to the fluorescent resin 7 so that the reflecting member 6 is fixed. There is a risk that warping may occur due to the difference between the coefficient of thermal expansion and the coefficient of thermal expansion of other members. Therefore, grooves 6a are formed in a grid shape on the upper surface of the reflecting member 6 in order to disperse the internal stress to be warped. Further, the periphery of the reflection member 6 and the periphery of the circuit board 2 including the cut-off portion 2d are adhered by the transparent resin 5, thereby reinforcing the fluorescent resin 7 having a reduced adhesive force. (D) is a bottom view of the LED light emitting device 10, and two drive electrodes 3 c are provided on the bottom surface of the circuit board 2.

次に図２によりＬＥＤ発光装置１０の発光動作を説明する。図２は図１に示すＬＥＤ発光装置１０の発光状態を示す断面図であり、構成については図１のＬＥＤ発光装置１０と同じであり、重複する説明は省略する。また、本実施形態においてはＬＥＤ１として青色ＬＥＤ、蛍光樹脂７としてシリコーン樹脂にＹＡＧを混練しＬＥＤ１の青色発光を黄色光に変換するＹＡＧ蛍光樹脂を用い、ＬＥＤ発光装置１０として白色光を出射する発光装置の事例について説明する。   Next, the light emitting operation of the LED light emitting device 10 will be described with reference to FIG. FIG. 2 is a cross-sectional view showing a light emission state of the LED light emitting device 10 shown in FIG. 1, and the configuration is the same as that of the LED light emitting device 10 of FIG. In this embodiment, the LED 1 is a blue LED, the fluorescent resin 7 is a YAG fluorescent resin that kneads YAG in a silicone resin and converts the blue light emission of the LED 1 to yellow light, and the LED light emitting device 10 emits white light. An example of the apparatus will be described.

ＬＥＤ発光装置１０では駆動電極３ｃに駆動電流を供給することによってＬＥＤ１が青色光Ｐｂを発する。その青色光Ｐｂの一部は矢印付き実線で示すように半透過性の反射部材６を透過して出射する。青色光の別の一部は反射部材６や回路基板２等で反射し、透明樹脂５を通過してＬＥＤ発光装置１０の側面方向に出射する。また、ＬＥＤ１の出射光が蛍光樹脂７中に分散したＹＡＧ粒子によって波長変換した矢印付き点線で示す黄色光Ｐｙの一部は、反射部材６を通過して出射する。また黄色光Ｐｙの別の一部は反射部材６や回路基板２で反射しながら透明樹脂５を通過してＬＥＤ発光装置１０の側面方向に出射する。なお反射せずにＬＥＤ発光装置１０の側面から出射する青色光Ｐｂ、黄色光Ｐｙは図示していない。この結果ＬＥＤ発光装置１０の上面から側面方向を含む広い範囲に青色光Ｐｂと黄色光Ｐｙが配光され、その合成光によって広い範囲に白色光を出射する半導体発光装置が得られる。   In the LED light emitting device 10, the LED 1 emits blue light Pb by supplying a drive current to the drive electrode 3c. A part of the blue light Pb is transmitted through the semi-transmissive reflecting member 6 and is emitted as indicated by a solid line with an arrow. Another part of the blue light is reflected by the reflecting member 6, the circuit board 2, etc., passes through the transparent resin 5, and is emitted in the side surface direction of the LED light emitting device 10. Further, a part of the yellow light Py indicated by the dotted line with an arrow obtained by converting the wavelength of the emitted light of the LED 1 by the YAG particles dispersed in the fluorescent resin 7 passes through the reflecting member 6 and is emitted. Further, another part of the yellow light Py passes through the transparent resin 5 while being reflected by the reflecting member 6 and the circuit board 2 and is emitted in the side surface direction of the LED light emitting device 10. Note that blue light Pb and yellow light Py emitted from the side surface of the LED light emitting device 10 without being reflected are not shown. As a result, a blue light Pb and a yellow light Py are distributed over a wide range including the side surface direction from the upper surface of the LED light emitting device 10, and a semiconductor light emitting device that emits white light over a wide range by the combined light is obtained.

（第２実施形態）
次に図３により本発明の第２実施形態におけるＬＥＤ発光装置２０について説明する。図３はＬＥＤ発光装置２０を示し、（ａ）はＬＥＤ発光装置２０の断面図、（ｂ）は（ａ）に示すＬＥＤ発光装置２０の上面図、（ｃ）は側面図、（ｄ）は下面図を示している。 (Second Embodiment)
Next, the LED light-emitting device 20 in 2nd Embodiment of this invention is demonstrated with FIG. FIG. 3 shows the LED light emitting device 20, (a) is a cross-sectional view of the LED light emitting device 20, (b) is a top view of the LED light emitting device 20 shown in (a), (c) is a side view, and (d) is a side view. A bottom view is shown.

図３（ａ）に示すＬＥＤ発光装２０の断面図おいて、図１（ａ）に示す第１実施形態のＬＥＤ発光装置１０と異なるところは、ＬＥＤ発光装置１０の周囲を被覆している蛍光樹脂７が回路基板２と反射部材６の間に充填されていたのに対し、ＬＥＤ発光装置２０において蛍光樹脂７がＬＥＤ１の周囲を一定の厚さで被覆しており、透明樹脂５がその外側部分、すなわち蛍光樹脂７と反射層６の間隙を含む空間に充填されていることである。なおＬＥＤ発光装置２０の全体構成を示す図３（ｂ）〜（ｄ）は第１実施形態におけるＬＥＤ発光装置１０の全体構成を示す図１（ｂ）〜（ｄ）と基本的に同じであり、重複する説明は省略する。   In the cross-sectional view of the LED light emitting device 20 shown in FIG. 3A, the difference from the LED light emitting device 10 of the first embodiment shown in FIG. While the resin 7 is filled between the circuit board 2 and the reflecting member 6, the fluorescent resin 7 covers the periphery of the LED 1 with a certain thickness in the LED light emitting device 20, and the transparent resin 5 is on the outside thereof. That is, a space including the gap between the fluorescent resin 7 and the reflective layer 6 is filled. 3B to 3D showing the entire configuration of the LED light emitting device 20 are basically the same as FIGS. 1B to 1D showing the overall configuration of the LED light emitting device 10 in the first embodiment. The overlapping description is omitted.

ＬＥＤ発光装置１０に比べて、ＬＥＤ発光装置２０は回路基板２と反射部材６との接着をほとんど全て透明樹脂５で行っているため、回路基板２と反射部材６との接着力が極めて強い。本実施形態では回路基板２に段差部２ｄを設けて係合接着を行っているが、この係合接着を行わなくても十分な強度が得られるので、必要により省略しても良い。   Compared with the LED light-emitting device 10, the LED light-emitting device 20 has almost all the adhesion between the circuit board 2 and the reflecting member 6 made of the transparent resin 5, so that the adhesive force between the circuit board 2 and the reflecting member 6 is extremely strong. In the present embodiment, the stepped portion 2d is provided on the circuit board 2 and engaged and bonded. However, sufficient strength can be obtained without performing the engaged and bonded, and may be omitted if necessary.

（第３実施形態）
次に図４により本発明の第３実施形態におけるＬＥＤ発光装置３０について説明する。図４はＬＥＤ発光装置３０を示し、（ａ）はＬＥＤ発光装置３０の断面図、（ｂ）は（ａ）に示すＬＥＤ発光装置３０の上面図、（ｃ）は側面図、（ｄ）は下面図を示している。 (Third embodiment)
Next, an LED light emitting device 30 according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 shows the LED light emitting device 30, (a) is a cross-sectional view of the LED light emitting device 30, (b) is a top view of the LED light emitting device 30 shown in (a), (c) is a side view, and (d) is a side view. A bottom view is shown.

図４（ａ）に示すＬＥＤ発光装置３０の断面図おいて、図１（ａ）に示す第１実施形態のＬＥＤ発光装置１０と異なるところは、ＬＥＤ発光装置１０における反射部材６が半透過性の白色樹脂を用いていたのに対し、ＬＥＤ発光装置３０の反射部材４６は金属板を用いており、所定の透過性を持たせるため反射部材４６に複数の微細開口４６ａを設けたことである。   4A is different from the LED light emitting device 10 of the first embodiment shown in FIG. 1A in that the reflecting member 6 in the LED light emitting device 10 is semi-transmissive. In contrast, the reflective member 46 of the LED light emitting device 30 uses a metal plate, and the reflective member 46 is provided with a plurality of fine openings 46a in order to give a predetermined transparency. .

次にＬＥＤ発光装置３０の全体構成を図４（ｂ）〜（ｄ）により説明する。
図４(ｂ)はＬＥＤ発光装置３０の上面図であり、（ａ）は（ｂ）のＡ−Ａ断面図に該当する。（ｂ）において反射部材４６は金属板による完全反射性と複数の微細開口４６ａの透光性によって半透過反射部材を構成している。
なお、図４（ｃ）（ｄ）は図１（ｃ）（ｄ）と反射部材の構成を除いて同一の構成なので、重複する説明を省略する。 Next, the overall configuration of the LED light emitting device 30 will be described with reference to FIGS.
FIG. 4B is a top view of the LED light emitting device 30, and FIG. 4A corresponds to the AA cross-sectional view of FIG. In (b), the reflecting member 46 constitutes a semi-transmissive reflecting member by the complete reflection by the metal plate and the translucency of the plurality of fine openings 46a.
4 (c) and 4 (d) are the same as FIGS. 1 (c) and 1 (d) except for the configuration of the reflecting member, and thus a duplicate description is omitted.

次に図５によりＬＥＤ発光装置３０の発光動作を説明する。図５は図４に示すＬＥＤ発光装置３０の発光状態を示す断面図であり、構成については反射部材４６の構成以外は図１のＬＥＤ発光装置１０と同じであり、重複する説明は省略する。また、本実施形態においてもＬＥＤ１として青色ＬＥＤ、蛍光樹脂７としてＬＥＤ１の青色発光を黄色光に変換するＹＡＧ蛍光樹脂を用い、ＬＥＤ発光装置３０として白色光を出射する事例について説明する。   Next, the light emitting operation of the LED light emitting device 30 will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a light emission state of the LED light emitting device 30 shown in FIG. 4, and the configuration is the same as that of the LED light emitting device 10 of FIG. Also, in this embodiment, a case where a blue LED is used as the LED 1, a YAG fluorescent resin that converts blue light emitted from the LED 1 into yellow light is used as the fluorescent resin 7, and white light is emitted as the LED light emitting device 30 will be described.

ＬＥＤ発光装置３０では駆動電極３ｃに駆動電流が供給されることによってＬＥＤ１が青色光Ｐｂを発する。その青色光Ｐｂの一部は矢印付き実線で示すように反射部材４６の微細開口４６ａを透過して出射し、別の一部は反射部材４６や回路基板２で反射し透明樹脂５を通過してＬＥＤ発光装置３０の側面方向に出射する。また、ＬＥＤ１の青色出射光が蛍光樹脂７のＹＡＧ粒子によって波長変換された矢印付き点線で示す黄色光Ｐｙの一部は、反射部材４６の微細開口４６ａを通過して出射し、別の黄色光Ｐｙの一部は反射部材６や回路基板２等で反射し、透明樹脂５を通過してＬＥＤ発光装置３０の側面方向に出射する。この結果ＬＥＤ発光装置４０の上面から側面方向を含む広い範囲に青色光Ｐｂと黄色光Ｐｙが配光し、その合成光によって広い範囲に白色光を出射する。   In the LED light emitting device 30, the drive current is supplied to the drive electrode 3c, so that the LED 1 emits blue light Pb. A part of the blue light Pb is transmitted through the fine opening 46a of the reflecting member 46 as shown by a solid line with an arrow, and another part is reflected by the reflecting member 46 or the circuit board 2 and passes through the transparent resin 5. Then, the light is emitted in the side surface direction of the LED light emitting device 30. In addition, a part of the yellow light Py indicated by the dotted line with an arrow obtained by converting the wavelength of the blue emitted light of the LED 1 by the YAG particles of the fluorescent resin 7 passes through the fine opening 46a of the reflecting member 46 to be emitted, and another yellow light. A part of Py is reflected by the reflecting member 6, the circuit board 2, etc., passes through the transparent resin 5, and is emitted in the side surface direction of the LED light emitting device 30. As a result, the blue light Pb and the yellow light Py are distributed over a wide range including the side surface direction from the upper surface of the LED light emitting device 40, and white light is emitted over a wide range by the combined light.

上記ＬＥＤ発光装置３０の構成として反射部材４６に１０個の微細開口４６ａを設けた事例を示したが、実際にはもっと多数の微細開口４６ａを設け、透過率と反射率の調整を行うものである。反射部材４６として金属板に微細開口を形成しても良いし、また細かい網の目状の金属層を形成しても良い。   As an example of the configuration of the LED light emitting device 30, an example in which ten fine openings 46 a are provided in the reflecting member 46 is shown. In practice, however, a larger number of fine openings 46 a are provided to adjust transmittance and reflectance. is there. As the reflecting member 46, a fine opening may be formed in the metal plate, or a fine mesh metal layer may be formed.

第１〜３実施形態では青色ＬＥＤとＹＡＧ蛍光樹脂の事例を示したが、これに限定されるものではなく、各種の半導体発光素子及び各種の蛍光樹脂に対応できることは当然である。また第１〜３実施形態では反射部材６，４６として板状のものを使用していたが、反射部材は板材に限られず、例えば反射性部粒子を混練した樹脂を蛍光樹脂及び透明樹脂に塗布したものや、メッキで形成した金属膜であっても良い。ＬＥＤの実装方法もＦＣ実装に限定されず、電極面を上側にしてワイヤボンディングを使うフェイスアップ実装でも良い。   In the first to third embodiments, examples of the blue LED and the YAG fluorescent resin have been described. However, the present invention is not limited to this, and it is natural that the present invention can be applied to various semiconductor light emitting elements and various fluorescent resins. In the first to third embodiments, plate-like members are used as the reflecting members 6 and 46. However, the reflecting member is not limited to a plate material, and for example, a resin kneaded with reflective particles is applied to a fluorescent resin and a transparent resin. Or a metal film formed by plating. The LED mounting method is not limited to FC mounting, but may be face-up mounting using wire bonding with the electrode surface facing upward.

（参考例）
第１〜３実施形態は剛性のある回路基板２上にＬＥＤ１をフリップチップ実装し、接着力の弱まった蛍光樹脂７を透明樹脂５で補強していた。次に図６により、回路基板２を持たない参考例について説明する。図６は参考例におけるＬＥＤ発光装置４０を示し、（ａ）はＬＥＤ発光装置４０の断面図、（ｂ）は（ａ）に示すＬＥＤ発光装置４０の上面図、（ｃ）は側面図、（ｄ）は下面図を示している。 (Reference example)
In the first to third embodiments, the LED 1 is flip-chip mounted on the rigid circuit board 2, and the fluorescent resin 7 whose adhesion is weakened is reinforced with the transparent resin 5. Next, a reference example without the circuit board 2 will be described with reference to FIG. 6 shows an LED light emitting device 40 in a reference example, (a) is a cross-sectional view of the LED light emitting device 40, (b) is a top view of the LED light emitting device 40 shown in (a), (c) is a side view, d) shows a bottom view.

図６（ａ）に示すＬＥＤ発光装置４０の断面図おいて、図１（ａ）に示す第１実施形態のＬＥＤ発光装置１０と大きく異なるところは、ＬＥＤ発光装置１０における回路基板２の代わりに、ＬＥＤ発光装置４０において２個の電極２３を反射性樹脂層２２に埋設しながら底面のみ露出させている点である。最近ではＬＥＤ２１のダイサイズが大型化し、ＬＥＤ２１の底面に形成した電極２３のピッチでもマザー基板（実装基板）に直接実装できるようになってきた。電極２３はＬＥＤ２１の突起電極であり、電極２３を下にしてＬＥＤ２１は上面及び側面が蛍光樹脂７で被覆されている。蛍光樹脂７は蛍光樹脂上面７ａで反射部材６と接着している。さらに蛍光樹脂７の周囲であって反射部材７と反射性樹脂層２２が形成する間隙に透明樹脂５が充填されている。この場合、反射部材６は剛性を備えていることが好ましく、反射部材６と反射性樹脂層２２を透明部材５に接着することにより、蛍光体を含有して接着力及び弾性が低下した蛍光樹脂７を補強している。   In the cross-sectional view of the LED light-emitting device 40 shown in FIG. 6A, a point that is greatly different from the LED light-emitting device 10 of the first embodiment shown in FIG. In the LED light emitting device 40, only the bottom surface is exposed while the two electrodes 23 are embedded in the reflective resin layer 22. Recently, the die size of the LED 21 has been increased, and the pitch of the electrodes 23 formed on the bottom surface of the LED 21 can be directly mounted on the mother board (mounting board). The electrode 23 is a protruding electrode of the LED 21, and the upper surface and the side surface of the LED 21 are covered with the fluorescent resin 7 with the electrode 23 facing down. The fluorescent resin 7 is bonded to the reflecting member 6 on the fluorescent resin upper surface 7a. Further, the transparent resin 5 is filled in the gap around the fluorescent resin 7 and formed by the reflective member 7 and the reflective resin layer 22. In this case, it is preferable that the reflecting member 6 has rigidity, and a fluorescent resin containing a phosphor and having reduced adhesive force and elasticity by bonding the reflecting member 6 and the reflective resin layer 22 to the transparent member 5. 7 is reinforced.

次にＬＥＤ発光装置４０の全体構成を図６（ｂ）〜（ｄ）により説明する。
図６(ｂ)はＬＥＤ発光装置４０の上面図であり、（ａ）は（ｂ）のＡ−Ａ断面図に該当し、図６（ｂ）（ｃ）は基本的に第１実施形態における図１（ｂ）（ｃ）と同じであり重複する説明は省略する。 Next, the overall configuration of the LED light emitting device 40 will be described with reference to FIGS.
FIG. 6B is a top view of the LED light emitting device 40, FIG. 6A corresponds to the AA cross-sectional view of FIG. 6B, and FIGS. 6B and 6C are basically in the first embodiment. The same description as in FIGS. 1B and 1C is omitted.

図６（ｄ）はＬＥＤ発光装置４０の下面図であり、反射性樹脂層２２の内側の領域に電極２３の露出部がある。反射性樹脂層２２はＬＥＤ２１から出射する光や、蛍光粒子の発する光を反射する。ＬＥＤ発光装置４０は第１〜３実施形態におけるＬＥＤ発光装置１０，２０，３０に比べて、回路基板２と反射性樹脂層２２の厚さの差分だけ薄型化が可能になること、及び回路基板２がない分だけ構成部品が少ないことが利点となる。   FIG. 6D is a bottom view of the LED light emitting device 40, and the exposed portion of the electrode 23 is in the region inside the reflective resin layer 22. The reflective resin layer 22 reflects light emitted from the LED 21 and light emitted from the fluorescent particles. Compared with the LED light-emitting devices 10, 20, and 30 in the first to third embodiments, the LED light-emitting device 40 can be thinned by a difference in thickness between the circuit board 2 and the reflective resin layer 22, and the circuit board. It is an advantage that there are few components because there is no 2.

１，２１，１０１，２０１ ＬＥＤ（半導体発光素子）
２，１０２，２０２ 回路基板
２ｄ 段差部
３ａ，１０３ａ，１０３ｂ 配線電極
３ｂ スルーホール電極
３ｃ、１０３ｃ 駆動電極
５ 透明樹脂
６，４６，１０６，２０６ 反射部材
６ａ 溝
７ 蛍光樹脂（蛍光部材）
７ａ 蛍光樹脂上面
１０，２０，３０，４０，１００，２００ ＬＥＤ発光装置（半導体発光装置）
２２ 反射性樹脂層
２３ 電極
４６ａ 微細開口
１０５，２０５ 透光性樹脂
１０５ａ 透光樹脂上面
Ｐｂ 青色光
Ｐｙ 黄色光


1, 21, 101, 201 LED (semiconductor light emitting device)
2, 102, 202 Circuit board 2d Stepped portion 3a, 103a, 103b Wiring electrode 3b Through-hole electrode 3c, 103c Drive electrode 5 Transparent resin 6, 46, 106, 206 Reflective member 6a Groove 7 Fluorescent resin (fluorescent member)
7a Fluorescent resin upper surface 10, 20, 30, 40, 100, 200 LED light emitting device (semiconductor light emitting device)
22 Reflective resin layer 23 Electrode 46a Micro opening 105, 205 Translucent resin 105a Translucent resin upper surface Pb Blue light Py Yellow light


Claims (6)

蛍光部材で少なくとも側面及び上面を被覆した半導体発光素子と、該半導体発光素子を搭載する回路基板と、前記蛍光部材の上面に反射部材とを備える半導体発光装置において、前記蛍光部材の周囲であって前記回路基板と前記反射部材によって挟まれる領域に透明部材を備えることを特徴とする半導体発光装置。   In a semiconductor light emitting device comprising a semiconductor light emitting device having at least a side surface and an upper surface covered with a fluorescent member, a circuit board on which the semiconductor light emitting device is mounted, and a reflective member on the upper surface of the fluorescent member, A semiconductor light emitting device comprising a transparent member in a region sandwiched between the circuit board and the reflecting member. 前記回路基板の周囲に段差部を設け、該段差部と前記透明部材が係合していることを特徴とする請求項１に記載の半導体発光装置。   The semiconductor light emitting device according to claim 1, wherein a step portion is provided around the circuit board, and the step portion and the transparent member are engaged with each other. 前記反射部材が前記蛍光部材に比べ硬質の材料からなり、前記反射部材が前記蛍光部材に貼りついていることを特徴とする請求項１又は２に記載の半導体発光装置。   3. The semiconductor light emitting device according to claim 1, wherein the reflective member is made of a material harder than the fluorescent member, and the reflective member is attached to the fluorescent member. 前記反射部材の上面に溝を有することを特徴とする請求項３に記載の半導体発光装置。   The semiconductor light emitting device according to claim 3, further comprising a groove on an upper surface of the reflection member. 前記反射部材が透過性を有することを特徴とする請求項１から４のいずれか一項に記載の半導体発光装置。   The semiconductor light emitting device according to claim 1, wherein the reflecting member has transparency. 前記反射部材が透過性の微細開口を有することを特徴とする請求項５に記載の半導体発光装置。

The semiconductor light emitting device according to claim 5, wherein the reflecting member has a transmissive minute opening.

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