JP6216272B2 - LED light emitting device - Google Patents

Description

  The present invention relates to an LED light emitting device using an LED element as a light source, and more specifically, a phosphor layer is mounted on a light emitting surface of an LED element that is flip-chip mounted on a circuit board, and a side surface of the LED element. And a side wall of the phosphor layer are filled and sealed with a reflective resin, and the LED light emitting device further includes a reflection frame having an opening on the upper surface of the phosphor layer, preventing light leakage in the side surface direction, and further manufacturing The present invention relates to an LED light emitting device having a structure that can be easily processed.

  In recent years, since LED elements are semiconductor elements, they have long life and excellent driving characteristics, and are small in size, have high luminous efficiency, and have a bright emission color. Etc. have come to be widely used.

  Particularly in recent years, the LED element is covered with a reflective resin such as a white resin, and the light emitted from the side of the LED element is reflected upward, so that the light can be efficiently emitted upward and the upper surface is opened. A reflective frame type LED light-emitting device has been proposed in which a reflective frame having the above is combined to enhance the upward light collecting property. (For example, Patent Document 1 and Patent Document 2)

  A conventional reflection frame type LED light emitting device will be described below. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and component names are also included in the present application. FIG. 13 is a cross-sectional view showing the configuration of the LED light emitting device 100 in Patent Document 1. The LED light emitting device 100 has a circuit board 107 having wiring electrodes 105a and 105b on the upper surface side, and the wiring electrodes 105a and 105b are It is connected to the power supply electrode 105d on the back side through the side electrode 105c of the circuit board 107.

  The LED element 101 is die-bonded to the wiring electrode 105 a on the upper surface of the circuit board 107, and the upper electrode of the LED element 101 is connected to the wiring electrode 105 b by a wire 104. The wiping LED element 101 and the wire 104 are covered with a translucent sealing resin 103 (transparent resin or fluorescent resin), and the LED element 101 on the circuit board 107 is mounted around the LED element 101 mounting area. A reflection frame (reflector) 109 for reflecting and condensing the light is fixed by means such as adhesion.

FIG. 14 is a cross-sectional view of the LED light emitting device 200 in Patent Document 2.
In the LED light emitting device 200 shown in FIG. 14, an LED element 201 is flip-chip mounted on the center of a circuit board 207 having wiring electrodes 205a and 205b, and a reflection frame 209 (horn A mold reflector is formed and fixed with a reflective white resin or the like.
Further, the periphery of the reflection frame 209 is sealed with a sealing resin 206 made of black resin or the like, and the phosphor layer 202 and the lens 233 are fixed to the opening of the reflection frame 209 by the sealing resin 206. Since the LED device 200 in the above configuration is arranged so that the central axis of the lens 233 and the central axis of the LED element 201 are aligned with each other, light directed vertically upward from the LED element 201 and emitted from the LED element 201 to the side. Then, the light reflected upward on the reflective surface of the reflective frame 209 is well condensed by the lens 233 and emitted upward.

  In Patent Document 1 and Patent Document 2, the role of the white resin having reflectivity is to reflect the emitted light emitted from the side surface side of the LED and return it to the emission surface side to increase the emission efficiency. As its configuration, a coating material such as a silicone resin, an epoxy resin, an acrylic resin, etc., in which particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, boron nitride are mixed as a reflective filler is used. As a forming method, resin molding is used, and as a filling method, a dropping device or an injection device is used.

JP 2009-28388 A JP 2004-11862 A

  However, the LED light-emitting devices described in Patent Document 1 and Patent Document 2 have a large number of manufacturing steps because the reflecting frame is directly fixed on a circuit board having projections and depressions such as wiring electrodes by a method such as adhesion. At the same time, a gap is generated due to irregularities such as wiring electrodes on the circuit board, and light emitted from the LED element in the lateral direction leaks from the gap below the reflection frame, or is emitted from the bottom side of the reflection frame. As a result of the disturbance, there is a problem that the light is not emitted in a sufficiently focused state due to the reflection frame.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems. In a reflective frame type LED light-emitting device, the side surface of the LED element and the side surface of the phosphor layer are covered with a reflective resin in the lateral direction. By completely fixing the reflective frame to the reflective resin by fixing the concave and convex shapes provided on the reflective frame and the reflective resin, it is easy to assemble and change the shape of the reflective frame. It can be freely selected.

  In order to achieve the above object, the LED light emitting device according to the present invention includes an LED element flip-chip mounted on a substrate, a phosphor layer placed on the light emitting surface of the LED element, and a side surface of the LED element. And a reflecting resin that covers the side surface of the phosphor layer, and a reflecting frame having an opening on the upper surface of the phosphor layer, a protrusion is provided on the lower surface of the reflecting frame, and the reflecting resin A concave portion is provided on the upper surface, and the protruding portion of the reflective frame is engaged and fixed to the concave portion of the reflective resin.

  According to the above configuration, the side face of the LED element and the side face of the phosphor layer are covered with the reflective resin to completely prevent light leakage in the side face direction, and the reflective frame is fixed to the reflective resin. And fixing by assembling the concavo-convex shape provided on the reflective resin, the ease of assembly and the change in the shape of the reflective frame can be freely selected.

  The reflection frame may have a circular curved opening on the upper surface of the phosphor layer.

  A diffusion resin layer is further laminated on the phosphor layer and the upper surface of the reflective resin, and the diffusion resin layer is provided with a through hole at a position corresponding to the concave portion of the reflective resin, and the protrusion of the reflective frame However, it is preferable that the resin is engaged and fixed to the concave portion of the reflective resin through the through hole of the diffusion resin layer.

  According to the above configuration, by providing the diffusion resin layer, it is possible to improve color rendering by eliminating color unevenness as an LED light emitting device.

  As described above, according to the present invention, in the LED light emitting device of the reflective frame type, the entire configuration is configured by the resin plate member and the filling resin, and the side surface of the LED element and the side surface of the phosphor layer are the reflective resin. It is possible to completely prevent light leakage in the lateral direction by filling and covering with, and fixing the reflective frame to the reflective resin by fixing the reflective frame and the reflective resin by assembling the concave and convex shapes. The ease and the change in the shape of the reflection frame can be freely selected.

It is sectional drawing of the LED light-emitting device in 1st Embodiment of this invention. It is a top view of the LED light-emitting device shown in FIG. It is sectional drawing which shows the state which removed the reflective frame of the LED light-emitting device shown in FIG. It is a top view which shows the state which removed the reflective frame of the LED light-emitting device shown in FIG. It is sectional drawing of the reflective frame which comprises the LED light-emitting device shown in FIG. It is a top view of the reflective frame which comprises the LED light-emitting device shown in FIG. It is sectional drawing of each process which shows the manufacturing method of the LED light-emitting device shown in FIG. It is sectional drawing of the LED light-emitting device in 2nd Embodiment of this invention. It is a top view of the LED light-emitting device in 2nd Embodiment shown in FIG. It is sectional drawing of each process which shows the manufacturing method of the LED light-emitting device shown in FIG. It is sectional drawing of the LED light-emitting device in 3rd Embodiment of this invention. It is a top view of the LED light-emitting device in 3rd Embodiment shown in FIG. It is sectional drawing of the conventional LED light-emitting device. It is sectional drawing of the conventional LED light-emitting device.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. 1 to 7 show an LED light emitting device according to a first embodiment of the present invention, FIG. 1 is a cross-sectional view of the LED light emitting device 10 according to the first embodiment of the present invention, and FIG. 2 is an LED light emitting device 10 shown in FIG. 3 is a cross-sectional view of the LED light-emitting device 10 with the reflection frame removed, FIG. 4 is a top view of the LED light-emitting device 10 with the reflection frame shown in FIG. 3 removed, FIG. 5 is a cross-sectional view of the reflection frame, and FIG. FIG. 7 is a top view of the reflecting frame shown in FIG. 5, and FIG. 7 is a process diagram showing a manufacturing process of the LED light emitting device 10.

In the cross-sectional view of the LED light emitting device 10 shown in FIG. 1, wiring electrodes 5a and 5b and through-hole electrodes 5c are provided on the upper surface of the circuit board 7, and the LED element 1 is connected to the conductive members 6a on the wiring electrodes 5a and 5b. 6b, and the wiring electrodes 5a and 5b are connected to the power supply electrode 5d provided on the back surface of the circuit board 7 through the through-hole electrode 5c.
On the light emitting surface of the LED element 1, the phosphor layer 2 having a shape slightly larger than the light emitting surface of the LED element 1 is placed by a technique such as bonding with a transparent adhesive.

  Further, the side surface of the LED element 1 and the side surface of the phosphor layer 2 are filled and sealed with the reflective resin 3 on the circuit board 7 using a molding die or the like. A reflective frame 9 is attached to the upper part of the reflective resin 3, and the reflective resin 3 and the reflective frame 9 are attached to the protrusion 9 a provided on the lower surface of the reflective frame 9 and the reflective resin 3. It is fixed by engagement with a recess 3a provided on the upper surface.

  2 is a top view of the LED light emitting device 10 shown in FIG. 1. An opening 9b is provided at the center position of the reflection frame 9, and the phosphor layer 2 is exposed in the opening 9b. A reflective surface 9c is formed from the opening 9b of the reflective frame 9 upward.

  3 and 4 are a cross-sectional view and a top view of the LED light emitting device 10 with the reflection frame 9 removed. The same elements as those of the LED light emitting device 10 in FIGS. Description is omitted. 3 and 4 show the shape of the recess 3a for attaching the reflection frame 9 provided on the reflective resin 3, and the recess 3a is formed concentrically with the phosphor layer 2 as shown in FIG. The depth is T1 as shown in FIG.

5 and 6 are a sectional view and a top view of the reflecting frame 9 shown in FIG. 1. As shown in FIG. 5, there is an opening 9b where the phosphor layer 2 is exposed at the center position, and a circular curved opening around the opening 9b. The reflective surface 9c having A circular projection 9a is formed on the lower surface 9d of the reflection frame 9, and this projection 9a is indicated by a dotted line in FIG.
In the present embodiment, an example in which the opening 9b and the protrusion 9b are circular as an example of the shape of the reflection frame 9 is shown, but the present invention is not limited to this, and the shape of the opening 9b and the protrusion 9b may be a square or Naturally, it is possible to adopt a shape such as a polygon or an ellipse.

  Next, a method for manufacturing the LED light emitting device 10 will be described with reference to FIG. 7A to 7D are cross-sectional views in the manufacturing process of the LED light-emitting device 10, where FIG. 7A is a state in which the LED element 1 is flip-chip mounted on the circuit board 7, and FIG. (C) shows a state in which the side surface of the LED element 1 and the side surface of the phosphor layer 2 are filled and sealed with the reflective resin 3. A concave portion 3a is formed on the upper surface, but as this forming method, it may be formed at the time of injection of the reflective resin 3 by a molding die, or the upper surface of the reflective resin 3 filled in a planar shape is cut. It may be formed by, for example.

  FIG. 1D shows that the LED light emitting device 10 shown in FIG. 1 is completed by fitting and fixing the protruding portion 9a of the reflective frame 9 to the concave portion 3a provided on the upper surface of the reflective resin 3. The reflection frame 9 may be fixed to the reflective resin 3 by simply pressing the projection 9a of the reflection frame 9 into the concave portion 3a of the reflective resin 3 or may be fixed using a small amount of adhesive. May be.

Next, the operation of the LED light emitting device 10 having the above configuration will be described.
When a driving voltage is supplied to the power supply electrode 5d provided on the back surface of the circuit board 7, the LED element 1 emits blue light, and yellow light and blue light excited by the phosphor layer 2 are mixed and white. Emits light. The blue light emitted from the LED element 1 and the yellow light excited by the phosphor layer 2 are all reflected upward by being reflected by the reflective resin 3, and the reflecting surface having the curved opening of the reflecting frame 9. Radiated light with excellent directivity is emitted by being condensed by 9c. In the conventional example shown in FIGS. 13 and 14, light leakage occurs to the side surface through a gap formed between the surface of the circuit board and the reflection frame. Since the concave portion 3a and the protruding portion 9a are provided and fixed to the adhesive surface of the adhesive 9, light leakage due to the gap between the adhesive surfaces does not occur.

(Second Embodiment)
Next, the LED light-emitting device in 2nd Embodiment of this invention is demonstrated with FIG.8, FIG.9, FIG.10. The basic configuration of the LED light-emitting device 20 in the second embodiment is the same as that of the LED light-emitting device 10 in the first embodiment shown in FIGS. 1 and 2, and the same or corresponding elements are assigned the same reference numerals and overlapped. Is omitted.

The LED light-emitting device 20 in the second embodiment is different from the LED light-emitting device 10 in the first embodiment, whereas the LED light-emitting device 10 has the reflective frame 9 placed directly on the reflective resin 3. In the LED light emitting device 20, the reflection frame 9 is placed on the phosphor layer 2 and the reflective resin 3 via a diffusion resin layer 8 (hereinafter abbreviated as a diffusion plate 8).
A through hole 8 a having the same shape as the recess 3 a is provided at a position corresponding to the recess 3 a of the reflective resin 3 in the diffusion plate 8. The protrusion 9 a of the reflection frame 9 is inserted and fixed in the recess 3 a of the reflective resin 3 through the through hole 8 a of the diffusion plate 8. As a result, the length of the projection 9 a of the reflection frame 9 is a length obtained by adding the depth of the through hole 8 a of the diffusion plate 8 and the depth of the recess 3 a of the reflective resin 3.
In the top view of the LED light emitting device 20 shown in FIG. 9, the diffusion plate 8 is exposed in the opening 9 b provided at the center position of the reflection frame 9.

  Next, a method for manufacturing the LED light emitting device 20 will be described with reference to FIG. Since the manufacturing steps (a) and (b) are the same as (a) and (b) shown in FIG. 7 in the first embodiment, the illustration is omitted. Accordingly, from (c), (c) shows a state in which the diffusion plate 8 is disposed on the upper surfaces of the phosphor layer 2 and the reflective resin 3. (D) shows the state in which the through-hole 8a of the diffusion plate 8 and the recess 3a of the reflective resin 3 are formed simultaneously. As this formation method, it can provide in the same position by cutting. (E) shows a state in which the reflection frame 9 is incorporated by fitting the projection 9a of the reflection frame 9 into the recess 3a of the reflective resin 3 through the through-hole 8a of the diffusion plate 8. FIG. The LED light emitting device 20 shown in FIG. 8 is completed.

  Next, the operation of the LED light emitting device 20 will be described. The operation until the LED light emitting device 20 emits light by supplying a driving voltage to the power supply electrode 5d is the same as that of the LED light emitting device 10, but the LED light emitting device 20 is excited by the blue light of the LED element 1 and the phosphor layer 2. The white light mixed with the yellow light is diffused through the diffusing plate 8, so that the radiant light having good color rendering properties is condensed and emitted by the reflection frame 9. Further, in addition to the side light leakage preventing effect described in the LED light emitting device 10, side light leakage by the diffusion plate 8 can also be prevented by the protrusion 9 a of the reflection frame 9.

(Third embodiment)
Next, the LED light-emitting device in 3rd Embodiment of this invention is demonstrated using FIG. 11, FIG. The basic configuration of the LED light emitting device 30 in the third embodiment is the same as that of the LED light emitting device 10 in the first embodiment shown in FIGS. 1 and 2, and the same or corresponding elements are given the same reference numerals and overlapped. Is omitted.

  The LED light emitting device 30 according to the third embodiment is different from the LED light emitting device 10 according to the first embodiment in that the LED light emitting device 30 includes a circular lens 33 at the opening portion of the reflecting surface 9c having the curved opening of the reflecting frame 9. It is to place. The lens 33 is attached to the reflection frame 9 in such a manner that the lens portion 33a (convex lens or concave lens) is fitted into the opening of the reflection surface 9c of the reflection frame 9 and the attachment portion 33b is bonded to the upper portion of the reflection frame 9. What is necessary is just to fix using materials.

  Next, the operation of the LED light emitting device 30 will be described. The operation until the LED light emitting device 30 emits light by supplying a driving voltage to the power supply electrode 5d is the same as that of the LED light emitting device 10, but the LED light emitting device 30 is excited by the blue light of the LED element 1 and the phosphor layer 2. Since the white light mixed with the yellow light is condensed by the reflecting frame 9 and then further condensed by the lens 33, emitted light having good color rendering properties is emitted in addition to excellent light condensing performance. .

As described above, the LED light-emitting device of the present invention can constitute a light-emitting portion that does not cause lateral light leakage only by injection of a plate-shaped resin such as a phosphor layer or a diffusion plate and a reflective resin. Furthermore, since the reflection frame is assembled by a fitting structure including a protrusion and a recess, an LED light emitting device that can be easily manufactured can be provided.
In addition, since the reflection frame is attached by a combination of the protrusion and the recess, if the protrusion shape and the position of the recess are made common, a reflection frame of various shapes and characteristics can be created and used as necessary. Can be replaced.

1, 101, 201 LED
2, 202 Phosphor layer 3, Reflective resin 3a Recess 5a, 105a, 205a Wiring electrode 5b, 105b, 205b Wiring electrode 5d, 105d, 205d Power supply electrode 6a, 6b Conductive member 7, 207 Circuit board 8, Diffusion plate 8a Through Hole 9, 109, 209 Reflection frame 9a Protrusion 9b Opening 9c Reflection surface 10, 20, 30, 100, 200 LED light emitting device 33,233 Lens 33a Lens part 33b Attachment part

Claims (3)

  An LED element flip-chip mounted on a substrate; a phosphor layer placed on a light emitting surface of the LED element; a reflective resin covering a side surface of the LED element and a side surface of the phosphor layer; A reflection frame having an opening on the upper surface of the phosphor layer, and a protrusion on the lower surface of the reflection frame, a recess on the upper surface of the reflective resin, and a protrusion on the reflection frame, An LED light-emitting device, wherein the LED light-emitting device is fixedly engaged with a concave portion of the reflective resin.   The LED light emitting device according to claim 1, wherein the reflection frame has a circular curved opening on an upper surface of the phosphor layer. A diffusion resin layer is further laminated on the phosphor layer and the upper surface of the reflective resin, and the diffusion resin layer is provided with a through hole at a position corresponding to the concave portion of the reflective resin, and the protrusion of the reflective frame The LED light-emitting device according to claim 1, wherein the LED light-emitting device is fixedly engaged with the concave portion of the reflective resin through a through-hole of the diffusion resin layer.

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