JP6253949B2 - LED light emitting device - Google Patents

Description

  The present invention relates to an LED light emitting device using an LED element as a light source, and more specifically, a phosphor layer is mounted on a light emitting surface of an LED element that is flip-chip mounted on a circuit board, and a side surface of the LED element. And the side surface of the phosphor layer are filled and sealed with a reflective white resin, and the range including the upper surface of the phosphor layer is covered with a diffusible resin layer, so that the light emission of the LED element is efficiently upward It is related with the LED light-emitting device which made it the structure made to perform and improved the outgoing light rate further upwards by devising the shape of the reflective surface by white resin.

  In recent years, since LED elements are semiconductor elements, they have long life and excellent driving characteristics, and are small, have good luminous efficiency, and have a bright emission color, so they are widely used in backlights and lighting of color display devices. It has come to be used.

  Particularly in recent years, white resin-coated LED light emission that efficiently emits light in the upward direction by coating the periphery of the LED element with a reflective white resin and reflecting the light emitted to the side of the LED element upward. A device configuration has been proposed. (For example, Patent Document 1, Patent Document 2, Patent Document 3)

  A conventional white resin-coated LED light emitting device will be described below. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and component names are also included in the present application. FIG. 9 is a cross-sectional view showing a manufacturing process of the LED light emitting device 100 in Patent Document 1. FIG. 9A shows a frame 109 around the LED element 101 flip-chip mounted on the substrate 107 by the conductive members 106a and 106b. Is used to fill and coat the light-reflective first white resin 104. (B) is a step of applying a transparent adhesive 103 on the upper surface of the LED element 101 and bonding a translucent member 102 (transparent member or fluorescent member) that emits light emitted from the LED element 101 and emits it to the outside. Show. (C) has shown the state by which the translucent member 102 was adhere | attached by the process of (b). FIG. 6D shows a white resin-coated LED light emitting device by dropping the second white resin 105 by the dropping device 108 and covering the entire surface including the side surface of the translucent member 102 with the second white resin 105. 100 is completed.

FIG. 10 shows a cross-sectional view of the LED light emitting device 200 in Patent Document 2.
In FIG. 10, the case 203 having an opening on the light extraction side, and the case around the LED element 201 flip-chip mounted on the wiring electrode 205a provided on the LED mounting surface in the case 203 by the conductive members 206a and 206b. 203 is used to fill and coat a light-reflective white resin 204, and in this state, a sheet-like phosphor layer 202 is stuck on the light extraction surface of the LED element 201.

FIG. 11 shows a cross-sectional view of the LED light emitting device 300 in Patent Document 3.
In the LED light emitting device 300 shown in FIG. 11, an LED element 301 is flip-chip mounted on the center of a substrate 307 having wiring conductors 305 a and 305 b, and a horn-shaped reflector 304 having a wide opening at the top is provided around the LED element 301. It is formed and fixed by a white resin or the like.
Further, the periphery of the reflector 304 is sealed with a sealing resin 303 made of black resin or the like, and the phosphor layer 302 and the lens 333 are fixed to the opening of the reflector 304 by the sealing resin 303. Since the LED device 300 in the above configuration is arranged so that the central axis of the lens 333 and the central axis of the LED element 301 are aligned, light directed vertically upward from the LED element 301 and emitted from the LED element 301 to the side. The light reflected upward on the reflecting surface of the reflector 304 is well collected by the lens 333 and emitted upward.

  In Patent Document 1, Patent Document 2, and Patent Document 3, the function of the white resin is to reflect the emitted light emitted from the side surface side of the LED and return it to the output surface side to increase the emission efficiency. The composition is made by mixing particles such as titanium oxide, silicon dioxide, zirconium dioxide, alumina, boron nitride as a reflective filler in a coating material such as silicone resin, epoxy resin, acrylyl resin, etc. As a forming method, resin molding is used, and as a filling method, a dropping device or an injection device is used.

JP 2010-192629 A JP 2007-19096 A JP 2004-11862 A

However, since the LED light emitting devices described in Patent Document 1 and Patent Document 2 are not provided with a diffusive member, color unevenness occurs in the emitted light, and as will be described later as an effect of the present invention, the emission direction with respect to the emitted light Since there is no restriction member, there is a problem that the emitted light is too wide.
Further, in the LED light emitting device described in Patent Document 3, by providing an emission direction restricting member such as the horn reflector 304 or the lens 333, it is possible to obtain emission light with good directivity while suppressing the spread of the emission light. However, since complicated and expensive members such as the reflector 304 and the lens 333 are required, there is a problem that the price is increased and the thickness is increased.

  Accordingly, an object of the present invention is to solve the above-described problems. In a white resin-coated LED light-emitting device, the color of the emitted light is obtained by covering the upper surface side of the phosphor layer with a diffusible resin layer. An LED that eliminates unevenness and prevents the outgoing light from spreading too much by providing an outgoing direction restricting member for the outgoing light, and can expect an increase in the amount of outgoing light by making the outgoing face side an opening shape that does not provide resin. A light emitting device can be provided.

In order to achieve the above object, the LED light emitting device according to the present invention includes an LED element flip-chip mounted on a substrate, a phosphor layer placed on the light emitting surface of the LED element, and a side surface of the LED element. and the first white reflecting resin coated with the side surface of the phosphor layer, the phosphor layer and the first white placed on the upper surface of the reflective resin diffusing resin layer, top and side surfaces of the diffusion resin layer A second white reflective resin that covers the light emitting surface of the LED element, and an opening recess is formed on the light emitting surface of the LED element . It is characterized by reaching the middle .

According to the above configuration, by covering the range including the upper surface of the phosphor layer of the LED element flip-chip mounted on the substrate with the diffusible resin layer, the uneven color of the emitted light is eliminated, and the LED A first reflective resin covering a side surface of the element and a side surface of the phosphor layer; a diffusible resin layer placed on top of the phosphor layer and the first white reflective resin; and an upper surface of the diffusible resin layer; A second white reflective resin covering the side surface, and an opening recess is formed on the light emitting surface of the LED element, and the depth of the opening recess penetrates the second reflective resin and reaches the diffusible resin layer. Thus, the opening concave portion of the second white reflective resin functions as an emission direction restricting member, prevents the emission light from spreading too much, and becomes an LED light emitting device with good directivity.

  A lens may be disposed on the upper surface of the opening recess.

According to the said structure, it becomes an LED light-emitting device which was further excellent in directivity by condensing the emitted light controlled by the output direction control member with a lens.

  As described above, according to the present invention, the range including the upper surface of the phosphor layer of the LED element flip-chip mounted on the substrate is covered with the diffusible resin layer, thereby eliminating the uneven color of the emitted light and A first reflective resin covering a side surface of the LED element and a side surface of the phosphor layer; a second white reflective resin covering the upper surface and the side surface of the diffusible resin layer placed on the upper surface of the phosphor layer; An opening recess is formed on the light emitting surface of the LED element, and the opening of the second white reflection resin is formed by penetrating the depth of the opening recess through the second white reflection resin and reaching the diffusible resin layer. It is possible to provide an LED light emitting device in which the concave portion functions as an emission direction restricting member, prevents the emission light from spreading too much, and can improve directivity and increase the amount of emitted light.

It is sectional drawing of the LED light-emitting device in 1st Embodiment of this invention. It is a top view of the LED light-emitting device shown in FIG. It is process drawing which shows each cross section to (a)-(d) of the manufacturing method of the LED light-emitting device shown in FIG. It is process drawing which shows each cross section to (e)-(g) of the manufacturing method of the LED light-emitting device shown in FIG. It is sectional drawing which shows the light emission operation | movement in the LED light-emitting device shown in FIG. It is sectional drawing of the LED light-emitting device in 2nd Embodiment of this invention. FIG. 6 is a top view of the LED light emitting device shown in FIG. 5. It is sectional drawing of the LED light-emitting device in 3rd Embodiment of this invention. It is a top view of the LED light-emitting device shown in FIG. It is process drawing which shows each cross section of the manufacturing method of the conventional LED light-emitting device. It is sectional drawing of the conventional LED light-emitting device. It is sectional drawing of the conventional LED light-emitting device.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an LED light emitting device according to a first embodiment of the present invention, FIG. 1 is a cross-sectional view of the LED light emitting device 10 according to the first embodiment of the present invention, and FIG. 2 is an LED light emitting device 10 shown in FIG. FIG. 3 is a process diagram showing a manufacturing process of the LED light emitting device 10.

In the cross-sectional view of the LED light emitting device 10 shown in FIG. 1, a wiring electrode and a through-hole electrode (not shown) are provided on the upper surface of the circuit board 7, and the LED element 1 is FC-mounted on the wiring electrode by the conductive members 6a and 6b. Each wiring electrode is connected to a power supply electrode provided on the back surface of the circuit board 7 through a through-hole electrode.
On the light emitting surface of the LED element 1, the phosphor layer 2 having a shape slightly larger than the light emitting surface of the LED element 1 is placed by a technique such as bonding with a transparent adhesive.

Further, the side surface of the LED element 1 and the side surface of the phosphor layer 2 are filled and sealed with a reflective first white reflective resin 4 on the circuit board 7 using a molding die or the like, and the upper surface of the phosphor layer 2 is further sealed. The upper surface of the first white reflective resin 4 including is covered with a diffusible resin layer 8. Then, after covering the upper and side surfaces of the diffusible resin layer 8 and the side surfaces of the first white reflective resin 4a with the second white reflective resin 4b, an opening recess 9 is formed at a position corresponding to the light emitting surface of the LED element 1. The depth of the opening recess 9 penetrates through the second white reflective resin 4 b and reaches the diffusible resin layer 8.
As an example of the LED light emitting device 10, the LED element 1 is a blue LED, the phosphor layer 2 is a YAG fluorescent resin, and the diffusible resin layer 8 is mixed with a diffusing particle in a transparent resin material, or the surface of the transparent resin. Those having a fine lens shape can be used.

  Next, the operation of the LED light emitting device 10 will be described. Conductive members (bumps) 6 a and 6 b of the LED element 1 are flip-chip mounted on wiring electrodes (not shown) provided on the upper surface of the circuit board 7 in the LED light emitting device 10. This wiring electrode is connected to a power supply electrode provided on the back side of the circuit board 7 through a through hole. Therefore, the LED element 1 emits light by supplying a voltage to the power supply electrode.

  The light emitted from the blue LED element 1 in the present embodiment is mainly emitted upward, passes through the YAG phosphor layer 2, and a part of the light is converted into excitation light (yellow light) by colliding with YAG fluorescent particles. In addition, a part of the light passes through blue light, and the blue light and the yellow light of the excitation light are mixed and diffused inside the diffusible resin layer 8 to be emitted as white light. The light emitted from the LED element 1 in the lateral direction is reflected in the direction of the phosphor layer 2 by the first white reflective resin 4a, and is also emitted through the diffusible resin layer 8 as blue light and yellow light. .

As described above, in the LED light emitting device 10, the side surface of the diffusible resin layer 8 is covered with the second white reflective resin 4 b, and the opening recess 9 reaching the diffusible resin layer 8 is formed at the position corresponding to the light emitting surface of the LED element 1. Therefore, the emitted light that is about to leak from the side surface of the diffusible resin layer 8 is reflected back to the light emitting surface side, and is a top view of the LED light emitting device 10, with the center position covered with the second white reflective resin 4 b Opening recesses 9 are formed in the apertures, and emitted light is emitted upward through the diffusible resin layer 8.
That is, in the configuration of the LED light-emitting device 10, without using a large-shaped component such as a horn-shaped reflector in the cited document 3, using only a normal plate component and a molded resin member, there is no light leakage to the surroundings, And since the direction control member of an emitted light can be provided, it is thin and can provide the LED light-emitting device excellent in condensing property.

  Next, a method for manufacturing the LED light emitting device 10 will be described with reference to FIGS. 3A and 3B. FIG. 3A shows steps (a) to (d) of the manufacturing process of the LED light-emitting device 10, and (a) flip-chips the LED light-emitting element 1 to the wiring electrode (not shown) of the circuit board 7 by the conductive members 6 a and 6 b. It is a LED element mounting process which shows the mounted state. (B) is a phosphor layer mounting step showing a state in which the phosphor layer 2 having a size slightly larger than the upper surface of the LED element 1 is mounted on the upper surface (light emitting surface) of the LED element 1 with a transparent adhesive or the like. . (C) fills and covers the side surface of the LED element 1 mounted on the upper surface of the circuit board 7 and the side surface of the phosphor layer 2 mounted on the upper surface of the LED element 1 with the first white reflective resin 4a. 1 is a white reflective resin coating process. (D) is a diffusing resin layer mounting step in which the diffusing resin layer 8 is mounted on the phosphor layer 2 and the first white reflective resin 4a.

  FIG. 3B similarly shows (e) to (g) of the manufacturing process of the LED light emitting device 10, and FIG. 3 (e) shows a groove 4c formed on the first white reflective resin 4a on the side surface around the circuit board 7 by cutting or the like. Is a groove processing step of forming (F) is a second white reflective resin coating step of coating the formed groove 4c and the entire upper part of the diffusible resin layer 8 with the second white reflective resin 4b. This second white reflective resin coating step can be performed with high accuracy using, for example, a molding die. The second white reflective resin 4b can basically be made of the same material as the first white reflective resin 4a, but may be made of a different material in consideration of moldability. (G) is the opening recessed part formation process which forms the opening recessed part 9 on the light emission surface of the LED element 1 of the filled 2nd white reflective resin 4b. In the opening recess forming step, a circular opening recess 9 is formed by cutting or the like, and the depth of the opening recess 9 needs to reach at least the diffusing resin layer 8 through the second white reflective resin 4b. As a result, light emitted from the LED element 1 passes through the phosphor layer 2 and the diffusing resin layer 8 and is radiated to the outside.

Next, the light emitting operation of the LED light emitting device 10 will be described with reference to FIG.
By supplying power to the LED element 10 described in FIG. 1, the LED element 1 emits blue light, and a part of this blue light emission collides with YAG fluorescent particles of the phosphor layer 2 to emit yellow light as excitation light. . The blue light is indicated by a solid line Pb, and the excited yellow light is indicated by a dotted line Py.

  Part of the blue light Pb emitted from the LED element 1 passes directly through the fluorescent plate layer 2 and the diffusing resin layer 8 and is emitted as blue light Pb, and part of the blue light Pb is a first white reflective resin 4a and a second white light. The light is reflected by the reflective resin 4 b and emitted from the opening recess 9. Further, part of the blue light Pb is converted into yellow light Py in the phosphor layer 2 and is emitted through the diffusible resin layer 8. Further, the light reflected by the first white reflective resin 4a and the second white reflective resin 4b in the diffusible resin layer 8 of the blue light Pb and the yellow light Py is also second in the end portion 8a of the diffusible resin layer 8. By being reflected by the white reflective resin 4b, all light is emitted as effective light from the opening recess 9 without leaking light to the surroundings. Further, since the wall surface portion 9a of the opening concave portion 9 formed by the second white reflective resin 4b serves as a direction restricting member for the emitted light, the light is effectively collected as white light Pw due to the color mixture of the blue light Pb and the yellow light Py. It is emitted as light.

(Second Embodiment)
Next, the structure of the LED light-emitting device in 2nd Embodiment of this invention is demonstrated with FIG. 5, FIG. 5 is a cross-sectional view of the LED light emitting device 20 in the second embodiment, FIG. 6 is a top view of the LED light emitting device 20 shown in FIG. 5, and the basic configuration is the same as the LED light emitting device 10 shown in FIGS. The same elements are denoted by the same reference numerals, and redundant description is omitted. The LED light emitting device 20 in the second embodiment is different from the LED light emitting device 10 in the first embodiment in the shape of the opening concave portion 29 that emits the emitted light. In the LED light emitting device 10, the depth of the opening concave portion 9 is the first. The LED light emitting device 20 has a depth of the opening recess 29 that penetrates the second white reflective resin 4b while penetrating through the two white reflective resins 4b and reaching the surface of the diffusible resin layer 8. That is, the middle position is reached.

  According to the configuration of the LED light emitting device 20, since the depth of the opening recess 29 can be arbitrarily determined, the diffusion rate can be controlled by changing the depth of the diffusible resin layer 8 with respect to the emitted light, There is an effect that the cutting process for creating the opening recess 29 is facilitated. The top view of the LED light emitting device 20 shown in FIG. 6 has the same configuration as the LED light emitting device 10 shown in FIG.

(Third embodiment)
Next, the configuration of the LED light emitting device according to the third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view of the LED light emitting device 30 according to the third embodiment. The basic configuration of the LED light-emitting device 30 of the third embodiment is the same as that of the LED light-emitting device 20 shown in FIG. 5, and the same elements are denoted by the same reference numerals and redundant description is omitted. The LED light emitting device 30 in the third embodiment is different from the LED light emitting device 20 in the second embodiment in that a circular lens 33 is attached to the opening recess 29 that emits the emitted light.

  In the configuration of the LED light emitting device 30, by attaching the circular lens 33 to the opening concave portion 29 in the LED light emitting device 20, in addition to the effect of restricting the direction of the opening concave portion 29, the light collecting effect of the lens 33 is extremely high. LED light emitting device with good quality can be provided. FIG. 8 is a top view of the LED light emitting device 30 and shows the second white reflective resin 4 b constituting the LED light emitting device 30 and the lens holding portion 33 a for holding the lens 33 on the upper surface of the opening recess 29.

  As described above, the LED light-emitting device of the present invention is thin and has no side leakage of light by simply forming a white reflective resin layer on the phosphor layer and the diffusible resin layer placed on the LED element, and It is possible to provide an LED light emitting device having excellent light collecting properties. Moreover, it becomes possible to combine with the circular lens with a good optical characteristic by making the shape of the opening recessed part provided in 2nd white reflective resin which comprises the direction control member with respect to an emitted light circular.

1, 101, 201, 301 LED element 2, 102, 202, 302 Phosphor layer 4a, 4b, first and second white reflective resins 104, 105, 204 White resin 6a, 6b, 106a, 106b Conductive members 206a, 206b Conductive member 7, 107, 307 Circuit board 8, Diffusing resin layer 8a, 8b, 8c Groove 10, 20, 30, 100, 200, 300 LED light emitting device 109 Frame 203 Case

Claims (3)

An LED element flip-chip mounted on a substrate; a phosphor layer placed on a light emitting surface of the LED element; a first white reflective resin covering a side surface of the LED element and a side surface of the phosphor layer; The phosphor layer, a diffusible resin layer placed on the top surface of the first white reflective resin, and a second white reflective resin covering the top surface and side surfaces of the diffusible resin layer, and the LED element The LED light emitting device is characterized in that an opening recess is formed on the light emitting surface, and the depth of the opening recess penetrates the second white reflective resin and reaches the middle of the diffusible resin layer.   The LED light-emitting device according to claim 1, wherein a lens is disposed on an upper surface of the opening recess.   The LED light-emitting device according to claim 1, wherein an opening shape of the opening recess is a circle.

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