JP2017183427A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-transmission device that prevents peeling of a light reflection member and is able to prevent damage during manufacturing.SOLUTION: On a surface of a mounting substrate 11, an LED chip 13 is mounted in a flip-chip manner. An outer peripheral side of a light-transmissive layer 15 has a recessed curved face part 15a and a vertical face part 15b. The recessed curved part 15a is a recessed curved face extending in a skirt form toward the underside 15d of the light-transmissive layer 15 from the upper side 15c side thereof. Therefore, the area of the upper side 15c of the light-transmissive layer 15 is smaller than the area of the underside 15d. A phosphor layer 16 is disposed on the entire underside 15d of the light-transmissive layer 15. The phosphor layer 16 is bonded and fixed to the upper side 13a of the LED chip 13 via an adhesive layer 17. A light reflection member 18 covers integrally the respective outer peripheral sides of the LED chip 13, light-transmissive layer 15, and phosphor layer 16.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device.

  In Patent Document 1, a substrate on which a conductive pattern is formed, a light emitting element mounted on the substrate via a conductive member, a phosphor layer disposed on the light emitting element, and a phosphor layer There is disclosed a light-emitting device having a light-transmitting body disposed thereon and having the phosphor layer formed thereon, the light-emitting element, and a reflecting resin disposed along a side surface of the phosphor layer and the light-transmitting body. .

Patent Document 2 discloses a light emitting element having an upper surface as a light extraction surface, a translucent member that emits light emitted from the light emitting element from the lower surface and emits the light to the outside through the upper surface, and the translucent member A light-emitting device comprising a light-reflective resin that covers at least a part of the outer peripheral side surface of the translucent member so that an inclined surface extending from the upper surface direction toward the lower surface is in contact with the lower surface, The area of the lower surface of the translucent member is formed larger than the area of the upper surface of the light emitting element, and the lower surface of the translucent member and the upper surface of the light emitting element are joined together, and the translucent member A light emitting device is disclosed in which a portion of the lower surface of the light emitting element that is not bonded to the light emitting element and the inclined surface are covered with the light reflecting resin, and the light transmitting member contains a phosphor. .
Patent Document 2 describes that the outer peripheral side surface of the translucent member is processed into an inclined surface by dicing.

JP, 2014-120722, A JP 2010-272847 A

Conventionally, as disclosed in Patent Documents 1 and 2, etc., in order to obtain a narrow light distribution characteristic, the outer peripheral side surface of the light emitting element is covered with a light reflecting member (reflective resin, light reflecting resin), and A light emitting device has been proposed in which light emitted from the outer peripheral side surface is reflected by a light reflecting member and emitted from the upper surface (light extraction surface) of the light emitting element.
Further, as disclosed in Patent Documents 1 and 2 and the like, a light emitting device in which a phosphor layer (a translucent member containing a phosphor) is arranged on a light emitting element has been proposed.

  In the technique of Patent Document 1, since the adhesiveness at the interface between the light transmitting body and the reflective resin is low, the light transmitting device is subjected to light transmission when each component of the light emitting device is thermally deformed due to a heat history during manufacture or a temperature increase during use. The reflective resin may peel off from the body, and if corrosive gas, dust, moisture, etc. in the air enters the light emitting device from the gap created between the translucent body and the reflective resin due to the peeling, light emission occurs. There is a problem that the internal deterioration of the apparatus progresses and causes problems.

In the technique of Patent Document 2, since the outer peripheral side surface of the translucent member is inclined, the translucent member can be locked with the light reflective resin. The resin can be prevented from peeling off.
However, since the translucent member containing the phosphor is fragile, there is a problem that the translucent member is likely to be damaged during manufacturing in which the outer peripheral side surface of the translucent member is processed into an inclined surface by dicing.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a light-emitting device capable of preventing the light reflecting member from peeling and preventing damage during manufacture. It is in.

  As a result of intensive studies in order to solve the above-mentioned problems, the present inventors have arrived at each aspect of the present invention as follows.

<First phase>
The first aspect is
A mounting board;
A light emitting device flip-chip mounted on the mounting substrate;
A phosphor layer disposed on the light emitting element;
A light-transmitting layer disposed on the phosphor layer;
A light reflecting member that integrally covers outer peripheral side surfaces of the light emitting element, the phosphor layer, and the light transmitting layer;
In the light-transmitting layer, the area of the upper surface located on the opposite side of the light emitting element is a light emitting element smaller than the area of the lower surface located on the light emitting element side.

In the first aspect, the light reflecting member integrally covers the outer peripheral side surfaces of the light emitting element, the phosphor layer, and the light transmitting layer, and the area of the upper surface of the light transmitting layer is smaller than the area of the lower surface.
Therefore, the phosphor layer and the light transmitting layer can be locked by the light reflecting member, and even when each component of the light emitting device is thermally deformed due to a heat history during manufacture or a temperature rise during use, the fluorescent layer It can prevent reliably that a light reflection member peels from a body layer and a translucent layer.
In the first aspect, the light-transmitting layer supports the phosphor layer and the layers are laminated and integrated, and the mechanical strength of the light-transmitting layer not containing the phosphor is higher than the mechanical strength of the phosphor layer. Therefore, it is possible to reliably prevent each layer from being damaged during the manufacture of the light emitting device.

<Second phase>
According to a second aspect, in the first aspect, an outer peripheral side surface of the translucent layer is a rough surface having fine irregularities.
In the second aspect, since the adhesion between the outer peripheral side surface of the light transmissive layer and the light reflecting member is enhanced, the phosphor layer and the light transmissive layer can be firmly locked by the light reflecting member. And it can prevent more reliably that a light reflection member peels from a fluorescent substance layer.

<Third phase>
According to a third aspect, in the first aspect or the second aspect, the refractive index of the light transmitting layer is lower than the refractive index of the phosphor layer.
In the third aspect, since the difference in refractive index between the light emitting device and air can be reduced as compared with the case where the light transmitting layer is not provided, the light emission efficiency of the light emitting device 10 can be improved.

<4th phase>
According to a fourth aspect, in the first to third aspects, both the phosphor layer and the light transmitting layer are made of an inorganic material.
In the fourth aspect, the phosphor layer and the light-transmitting layer are made of an inorganic material that has high mechanical strength and is not easily deteriorated. Therefore, the layers are more reliably prevented from being damaged during the manufacture of the light-emitting device, and the reliability of the light-emitting device is improved. To increase the service life.

<5th aspect>
A 5th aspect is equipped with the contact bonding layer which adhere | attaches and fixes the said light emitting element and the said fluorescent substance layer in the 1st-4th aspect.
In the fifth aspect, the light emitting element and the phosphor layer can be reliably fixed by the adhesive layer.

1 is a longitudinal sectional view of a light emitting device 10 according to a first embodiment embodying the present invention. FIG. 4 is a longitudinal sectional view for explaining a method for manufacturing the light-transmitting layer 15 and the phosphor layer 16 of the light emitting device 10 according to the first embodiment. FIG. 4 is a longitudinal sectional view for explaining a method for manufacturing the light-transmitting layer 15 and the phosphor layer 16 of the light emitting device 10 according to the first embodiment. The longitudinal cross-sectional view of the light-emitting device 20 of 2nd Embodiment which actualized this invention. The longitudinal cross-sectional view of the light-emitting device 30 of 3rd Embodiment which actualized this invention.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings. In each embodiment, the same constituent members and constituent elements are denoted by the same reference numerals, and redundant description of the same contents is omitted.
Moreover, in each drawing, in order to make the explanation easy to understand, the dimensional shape and arrangement location of the constituent members of each embodiment are schematically illustrated in an exaggerated manner, and the dimensional shape and arrangement location of each constituent member are the real thing. May not always match.

<First Embodiment>
As illustrated in FIG. 1, the light emitting device 10 according to the first embodiment includes a mounting substrate 11, wiring layers 12 a and 12 b, an LED (Light Emitting Diode) chip 13 (upper surface 13 a), connection members 14 a and 14 b, and a light transmitting layer 15. (Concave curved surface portion 15a, vertical surface portion 15b, upper surface 15c, lower surface 15d), phosphor layer 16 (exposed surface 16a), adhesive layer 17, light reflecting member 18, and the like.

On the surface of the mounting substrate (mounting substrate) 11, wiring layers 12 a and 12 b are arranged. An external wiring layer (not shown) is disposed on the back surface of the mounting substrate 11, and a via hole (not shown) is passed through the mounting substrate 11 in the thickness direction, and the external wiring layer and the wiring layer 12a, 12b may be connected.
A substantially rectangular parallelepiped LED chip 13 is flip-chip mounted on the surface of the mounting substrate 11.
On the lower surface side (back surface side) of the LED chip 13, two pad electrodes (not shown) on the N side and P side (minus side and plus side) are arranged. Members) are connected to the wiring layers 12a and 12b via 14a and 14b.
That is, the LED chip 13 is connected to the wiring layers 12a and 12b via the connection members 14a and 14b.
The upper surface 13a of the LED chip 13 is a light extraction surface.

The outer peripheral side surface of the translucent layer (transparent layer, translucent body, translucent member) 15 includes a concave curved surface portion 15a and a vertical surface portion 15b.
The concave curved surface portion 15a is a concave curved surface shape that spreads in a skirt shape from the upper surface 15c side to the lower surface 15d side of the translucent layer 15, and the upper end of the concave curved surface portion 15a is connected to the upper surface 15c of the translucent layer 15, The lower end of the curved surface portion 15a is connected to the vertical surface portion 15b.
The vertical surface portion 15 b is disposed perpendicular to the parallel upper and lower surfaces (front and back surfaces) of the light transmitting layer 15, and the lower end of the vertical surface portion 15 b is connected to the lower surface 15 d of the light transmitting layer 15.
For this reason, the area of the upper surface 15 c of the light transmitting layer 15 is smaller than the area of the lower surface 15 d of the light transmitting layer 15.
Further, the outer peripheral side surfaces (concave curved surface portion 15 a and vertical surface portion 15 b) of the light transmitting layer 15 are rough surfaces having fine irregularities as compared with the upper surface (surface) 15 c of the light transmitting layer 15.

The phosphor layer 16 is disposed on the entire lower surface (back surface) 15d of the light transmitting layer 15, and the light transmitting layer 15 supports the phosphor layer 16 and the layers 15 and 16 are laminated and integrated.
The phosphor layer 16 is bonded and fixed to the upper surface 13 a of the LED chip 13 through the adhesive layer 17.
The area of the lower surface of the phosphor layer 16 is larger than the area of the upper surface 13a of the LED chip 13, the layers 15 and 16 project in a bowl shape from the outer peripheral side surface of the LED chip 13, and the outer peripheral edge of the lower surface of the phosphor layer 16 is The exposed surface 16 a is exposed from the joint surface joined to the upper surface 13 a of the LED chip 13.

The light reflecting member 18 seals each member (the LED chip 13, the connecting members 14 a and 14 b, the light transmitting layer 15, the phosphor layer 16, and the adhesive layer 17) disposed on the mounting substrate 11. The upper surface 15 c of the light transmissive layer 15 is exposed from the light reflecting member 18.
That is, the light reflecting member 18 integrally integrates the outer peripheral side surface of the LED chip 13, the outer peripheral side surface (the concave curved surface portion 15 a and the vertical surface portion 15 b) of the translucent layer 15, and the outer peripheral side surface and the exposed surface 16 a of the phosphor layer 16. Is covered.

In the light emitting device 10, the light emitted from the upper surface 13 a of the LED chip 13 passes through the light transmitting layer 15 from the phosphor layer 16, and goes to the outside from the upper surface 15 c of the light transmitting layer 15 that is the light emitting surface of the light emitting device 10. Radiated.
At this time, the light emitted from the outer peripheral side surface of the LED chip 13 is reflected by the light reflecting member 18 covering the outer peripheral side surface of the LED chip 13 and is emitted from the upper surface 13a of the LED chip 13, so that the narrow light distribution characteristic is obtained. Can be obtained.
And the primary light (blue light) radiated | emitted from the upper surface 13a of the LED chip 13, and the secondary light (a part of the primary light was wavelength-converted by exciting the fluorescent substance contained in the fluorescent substance layer 16 ( Yellow light) is mixed, and white light generated by the color mixture is emitted from the upper surface 15 c of the light transmitting layer 15.

[Constituent Member of Light-Emitting Device 10]
[Mounting board 11]
The mounting substrate 11 is made of a plate material having sufficient insulation, and examples of the material for forming the mounting substrate 11 include various ceramic materials (such as aluminum oxide and aluminum nitride), glass epoxy, and polyimide.

[Wiring layers 12a, 12b, connecting members 14a, 14b]
The wiring layers 12a and 12b are made of a metal material having sufficient conductivity. Examples of the metal material include gold, tin, copper, and alloys of these metals.
The connection members 14a and 14b are made of a conductive material that can be reliably flip-chip mounted. Examples of the material for forming the connection members 14a and 14b include bumps, metal pastes, metal nano pastes, and anisotropic conductive adhesives. .

[Translucent layer 15]
The translucent layer 15 is made of a translucent material having sufficient translucency and mechanical strength, and the translucent material includes an organic material and an inorganic material.
The organic material for forming the light transmissive layer 15 includes various resin materials (for example, silicon resin, epoxy resin, phenol resin, and the like).
Examples of the inorganic material for forming the light-transmitting layer 15 include various ceramic materials (for example, single crystals of aluminum oxide and aluminum nitride) and various glass materials (for example, borosilicate glass, quartz glass, and the like).

The range of the film thickness of the light transmitting layer 15 is suitably 50 to 150 μm, desirably 75 to 125 μm, and particularly desirably 90 to 110 μm.
When the film thickness of the light-transmitting layer 15 is thinner than this range, mechanical strength in the manufacturing process to be described later is lowered and easily damaged, and it is difficult to reliably support the phosphor layer 16, so that the phosphor layer 16 is sufficient. In addition to the inability to provide sufficient mechanical strength, it may be difficult to ensure the necessary dimensions for the concave curved surface portion 15a.
When the thickness of the light transmissive layer 15 is larger than this range, the heat dissipation performance is lowered and the light emitting device 10 may be downsized.

If the phosphor concentration of the phosphor layer 16 is increased, color unevenness and luminance unevenness are likely to occur in the emitted light of the light emitting device 10, but a light diffusing material (for example, titanium oxide or barium titanate) is added to the light transmitting layer 14. , Aluminum oxide, silicon oxide, etc.) can suppress the occurrence of color unevenness and luminance unevenness.
Further, the upper surface 15c of the light transmissive layer 15 is not limited to a smooth surface, and may be a rough surface. If the upper surface 15c is roughened, light emitted from the upper surface 15c of the light transmissive layer 15 to the outside of the light emitting device 10 may be used. Scattering can be promoted, and the occurrence of uneven brightness and uneven color in the emitted light of the light emitting device 10 can be suppressed.

[Phosphor layer 16]
The phosphor layer 16 is formed by mixing and dispersing a phosphor material in a translucent material as a binder, and the translucent material includes an organic material and an inorganic material similar to the translucent layer 15.
Here, the materials of the layers 15 and 16 are selected so that the refractive index of the light transmitting layer 15 is lower than the refractive index of the phosphor layer 16.

The film thickness of the phosphor layer 16 may be appropriately set in accordance with the characteristics of the phosphor material, and the film thickness range is suitably 50 to 150 μm, desirably 75 to 125 μm, and particularly desirably 90 to 110 μm. .
If the thickness of the phosphor layer 16 is thinner than this range, it becomes difficult to sufficiently excite the primary light of the LED chip 13, and there is a possibility that desired white light cannot be obtained.
If the thickness of the phosphor layer 16 is larger than this range, the mechanical strength in the manufacturing process described later tends to be reduced and breakage tends to occur, and the heat dissipation may be reduced.
The phosphor layer 16 is not limited to a single-layer structure, and may have a multilayer structure, and may contain a light diffusing material in the same manner as the light-transmitting layer 15.

[Adhesive layer 17]
The adhesive layer 17 is made of an adhesive that can securely bond the upper surface 13a of the LED chip 13 and the phosphor layer 16 and can reliably guide the emitted light of the LED chip 13 to the phosphor layer 16, Examples of the adhesive include silicon resin, epoxy resin, phenol resin, and polyimide resin.
The thickness of the adhesive layer 17 is preferably as thin as a sufficient adhesive strength can be obtained. If the adhesive layer 17 is thinned, heat dissipation is improved, and light loss of light transmitted through the adhesive layer 17 is reduced. The luminous efficiency of 10 can be improved.
In addition, when various resin materials are used for the translucent material for forming the phosphor layer 16, the phosphor layer can be obtained by making the adhesive material of the adhesive layer 17 the same resin material as the phosphor layer 16. Since the refractive index difference between the adhesive layer 17 and the adhesive layer 17 can be reduced, the incident light from the adhesive layer 17 to the phosphor layer 16 can be increased, and the light emission efficiency of the light emitting device 10 can be improved.

[Light reflecting member 18]
The light reflecting member 18 includes fine particles of a material having a high light reflectance (for example, titanium oxide, aluminum oxide, boron nitride, aluminum nitride, barium sulfate, etc.) and a material having a high thermal conductivity (for example, aluminum, silver, copper, etc.). Are formed of a white synthetic resin material (for example, silicon resin, epoxy resin, phenol resin, acrylic resin, etc.) having a low coefficient of thermal expansion.

[Method for Manufacturing Light-Emitting Device 10]
Each process of the manufacturing method of the light-emitting device 10 is demonstrated.
Step 1 (see FIG. 2A): Using the following method or the like, the light transmitting layer 15 and the phosphor layer 16 are laminated and integrated to form a plate material P.

[Method 1] A green sheet containing a phosphor material for forming the phosphor layer 16 is attached to the entire surface of one side of the green sheet for forming the light transmitting layer 15, and both the green sheets are fired simultaneously ( The layers 15 and 16 are integrally formed by sintering.
The green sheet is prepared by mixing a raw material powder made of a sintering aid such as a ceramic material and glass, an organic binder, a plasticizer and a solvent to produce a slurry (liquid mixture), and the slurry is a doctor blade molding machine. Is processed into a flexible sheet material.

[Method 2] The phosphor layer 16 is formed by applying a paste material to be the phosphor layer 16 to the entire surface of one side of the flat plate material to be the light-transmitting layer 15 by using a printing method and curing the paste material. .
[Method 3] Using a compression molding method, the material of the phosphor layer 16 in which the phosphor is contained in the binder is molded on the entire surface of one side of the flat plate to be the light-transmitting layer 15 with a mold.
[Method 4] A phosphor layer 16 is formed by depositing a charged phosphor using electrophoresis on the entire surface of one surface of a conductive flat plate to be the light-transmitting layer 15 using a phosphor electrodeposition method. To do.
[Method 5] Using the phosphor sheet method, the phosphor layer 16 is formed by pressure-bonding and integrating a sheet material obtained by kneading phosphors with various resin materials on the entire surface of one side of the flat plate material to be the light transmitting layer 15. .

Step 2 (see FIGS. 2B to 2D): A groove having a U-shaped cross section by half-cutting the translucent layer 15 of the plate P using a thick dicing blade Ka with a U-shaped blade section. G is formed.
Step 3 (see FIGS. 3A to 3C): A plate material obtained by dividing the plate material P into pieces by cutting the bottom of the groove G of the light transmitting layer 15 using a thin dicing blade Kb. R is produced.
As a result, a concave curved surface portion 15a is formed by the inner surface of the groove G of the light transmitting layer 15 in the plate material R. Further, the vertical surface portion 15 b is formed by the cut surface of the light transmitting layer 15 in the plate material R.

Step 4 (see FIG. 1): An adhesive layer 17 is applied to the upper surface 13a of the LED chip 13 mounted on the mounting substrate 11.
Next, the board | plate material R (each layer 15, 16) separated in the process 3 is mounted on the LED chip 13, and the contact bonding layer 17 is hardened.
Subsequently, each member (the LED chip 13, the connecting members 14 a and 14 b, the light transmitting layer 15, the phosphor layer 16, and the adhesive layer 17) disposed on the mounting substrate 11 is sealed with the light reflecting member 18.
As a method for forming the light reflecting member 18, for example, the LED chip 13 and the layers 15 to 17 are formed in a state where the plate-like light reflecting member 18 is softened by using a dispensing (potting) method, a screen printing method, or a heating press method. There is a method of pressing.

[Operations and effects of the first embodiment]
According to the light emitting device 10 of the first embodiment, the following actions and effects can be obtained.

[1] In the light emitting device 10, the light reflecting member 18 integrally covers the outer peripheral side surfaces of the LED chip 13 (light emitting element), the phosphor layer 16, and the light transmissive layer 15, and the upper surface 15 c of the light transmissive layer 15. The area is smaller than the area of the lower surface 15d.
Therefore, the phosphor layer 16 and the translucent layer 15 can be locked by the light reflecting member 18, and when each component of the light emitting device 10 is thermally deformed due to a heat history during manufacture or a temperature rise during use. In addition, it is possible to reliably prevent the light reflecting member 18 from peeling from the phosphor layer 16 and the light transmitting layer 15.
Further, the light-transmitting layer 15 supports the phosphor layer 16 and the layers 15 and 16 are laminated and integrated. The mechanical strength of the light-transmitting layer 15 containing no phosphor is the mechanical strength of the phosphor layer 16. Since it is higher than the strength, it is possible to reliably prevent the layers 15 and 16 from being damaged when the light emitting device 10 is manufactured.

[2] The outer peripheral side surface (concave surface portion 15a, vertical surface portion 15b) of the light transmitting layer 15 is a rough surface having fine irregularities.
Therefore, the adhesion between the outer peripheral side surface of the translucent layer 15 and the light reflecting member 18 is enhanced, and the phosphor layer 16 and the translucent layer 15 can be firmly locked by the light reflecting member 18. It is possible to further reliably prevent the light reflecting member 18 from peeling from the layer 15 and the phosphor layer 16.

  [3] Since the refractive index of the light transmitting layer 15 is lower than the refractive index of the phosphor layer 16, it is possible to reduce the refractive index difference between the light emitting device 10 and air compared to the case where the light transmitting layer 15 is not provided. Therefore, the light emission efficiency of the light emitting device 10 can be improved.

  [4] Inorganic materials have higher mechanical strength than organic materials and are unlikely to deteriorate. Therefore, if the phosphor layer 16 and the light-transmitting layer 15 are made of an inorganic material, the layers 15 and 16 are more reliably prevented from being damaged during the manufacture of the light-emitting device 10, and the reliability of the light-emitting device 10 is improved. The service life can be increased to increase the service life.

  [5] Since the light emitting device 10 includes the adhesive layer 17 that adheres and fixes the upper surface 13a of the LED chip 13 and the phosphor layer 16, the LED chip 13 and the phosphor layer 16 can be reliably fixed.

[6] The area of the lower surface of the phosphor layer 16 is larger than the area of the upper surface 13 a of the LED chip 13, and the outer peripheral edge of the lower surface of the phosphor layer 16 is an exposed surface 16 a exposed from the LED chip 13.
Therefore, it is possible to make all the light radiated from the upper surface 13a which is the light emitting surface of the LED chip 13 enter the phosphor layer 16, and to improve the light emission efficiency of the light emitting device 10.
Further, in the step 4, even when some positional deviation occurs when the separated plate material R (the light transmitting layer 15 and the phosphor layer 16) is placed on the LED chip 13, The entire upper surface 13a can be covered with the layers 15 and 16, and the occurrence of uneven light emission in the light emitting device 10 due to the positional deviation can be prevented.

Second Embodiment
As shown in FIG. 4, the light emitting device 20 of the second embodiment includes a mounting substrate 11, wiring layers 12 a and 12 b, an LED chip 13 (upper surface 13 a), connection members 14 a and 14 b, and a light transmitting layer 15 (vertical surface portion 15 b, The upper surface 15c, the lower surface 15d, the inclined surface portion 15e), the phosphor layer 16 (exposed surface 16a), the adhesive layer 17, and the light reflecting member 18 are provided.

The light emitting device 20 of the second embodiment is different from the light emitting device 10 of the first embodiment in that the concave curved surface portion 15a of the light transmitting layer 15 is replaced with an inclined surface portion 15e.
The inclined surface portion 15e has an inclined surface shape that spreads from the upper surface 15c side to the lower surface 15d side of the translucent layer 15, the upper end of the inclined surface portion 15e is connected to the upper surface 15c of the translucent layer 15, and the lower end of the inclined surface portion 15e is It is connected to the vertical surface portion 15b.
Therefore, in the light emitting device 20, as in the light emitting device 10, the area of the upper surface 15 c of the light transmitting layer 15 is smaller than the area of the lower surface 15 d of the light transmitting layer 15.

Therefore, in the second embodiment, the same operation and effect as in the first embodiment can be obtained.
In addition, in order to form the inclined surface part 15e of the translucent layer 15, in the said process 2 (refer FIG.2 (B)-(D)) of 1st Embodiment, the cutting-edge cross-section dicing blade Ka is used. What is necessary is just to replace with the bevel cutting dicing blade.

<Third Embodiment>
As shown in FIG. 5, the light emitting device 30 of the third embodiment includes a mounting substrate 11, wiring layers 12a and 12b, an LED chip 13 (upper surface 13a), connection members 14a and 14b, and a light transmitting layer 15 (vertical surface portion 15b, An upper surface 15c, a lower surface 15d, a step surface portion 15f), a phosphor layer 16 (exposed surface 16a), an adhesive layer 17, a light reflecting member 18, and the like are provided.

The light emitting device 20 of the third embodiment is different from the light emitting device 10 of the first embodiment in that the concave curved surface portion 15a of the translucent layer 15 is replaced with a step surface portion 15f.
The step surface portion 15f has a step surface shape composed of one stepped step, and the upper end of the step surface portion 15f is connected to the upper surface 15c of the translucent layer 15, and the lower end of the step surface portion 15f is connected to the vertical surface portion 15b.
Therefore, also in the light emitting device 30, similarly to the light emitting device 10, the area of the upper surface 15 c of the light transmitting layer 15 is smaller than the area of the lower surface 15 d of the light transmitting layer 15.

Therefore, in the third embodiment, the same operation and effect as in the first embodiment can be obtained.
In order to form the stepped surface portion 15f of the translucent layer 15, a dicing blade Ka having a U-shaped cutting edge section is used in the step 2 of the first embodiment (see FIGS. 2B to 2D). A dicing blade for step cutting may be replaced.
Further, the step surface portion 15f is not limited to a single stepped step, and may be a step surface formed of a multi-stepped step.

<Another embodiment>
The present invention is not limited to the above-described embodiments, and may be embodied as follows. Even in this case, operations and effects equivalent to or higher than those of the above-described embodiments can be obtained.

  [A] The LED chip 13 may be replaced with any semiconductor light emitting element (for example, an EL (Electro Luminescence) chip, an LD (Laser Diode) chip, etc.).

[B] The outer peripheral side surface (concave surface portion 15a, vertical surface portion 15b, inclined surface portion 15e, step surface portion 15f) of the light transmitting layer 15 may be a smooth surface.
In this case, the function / effect of [2] cannot be obtained, but the light reflectivity of the outer peripheral side surface of the light transmitting layer 15 covered with the light reflecting member 18 can be increased. The light emitted from the outer peripheral side surface of the light layer 15 is reduced and the light emitted from the upper surface 13a of the LED chip 13 is increased, so that a narrow light distribution characteristic is obtained and the light emission efficiency of the light emitting device 10 is improved. Can do.

[C] The translucent layer 15 may be made of an organic material having a refractive index lower than that of the inorganic material.
In this case, although the function / effect of [4] cannot be obtained, the difference in refractive index between the light emitting device 10 and air can be reduced, so that the light emission efficiency of the light emitting device 10 can be improved. it can.

[D] The adhesive layer 17 may be omitted, and the upper surface 13a of the LED chip 13 and the phosphor layer 16 may be bonded directly.
In this case, the function / effect of [5] cannot be obtained, but the manufacturing cost of the light emitting device 10 can be reduced.

<Additional Notes Based on Description of Embodiment>
The technical ideas that can be grasped from each of the above-described embodiments and other embodiments will be described below.

[Appendix 1] The outer peripheral side surface of the translucent layer includes a concave curved surface portion, and the concave curved surface portion has a concave curved surface shape that spreads in a skirt shape from the upper surface side to the lower surface side of the translucent layer. The light-emitting device according to any one of the five aspects.
[Appendix 2] Any one of the first to fifth aspects, wherein the outer peripheral side surface of the translucent layer includes an inclined surface portion, and the inclined surface portion has an inclined surface shape that extends from the upper surface side to the lower surface side of the light transmitting layer. The light emitting device according to 1.
[Supplementary Note 3] The light emitting device according to any one of the first to fifth aspects, wherein an outer peripheral side surface of the light transmitting layer includes a stepped surface portion, and the stepped surface portion has a stepped surface shape including stepped steps.
According to Appendices 1 to 3, the area of the upper surface of the translucent layer can be easily made smaller than the area of the lower surface.

[Supplementary Note 4] The light-emitting device according to any one of the first, third to fifth aspects, or Supplementary notes 1 to 3, wherein an outer peripheral side surface of the translucent layer is a smooth surface.
In Supplementary Note 4, since it is possible to increase the light reflectivity of the outer peripheral side surface of the translucent layer covered with the light reflecting member, the light emitted from the outer peripheral side surface of the translucent layer is reduced, and the light emitting element Since light emitted from the upper surface increases, it is possible to obtain a narrow light distribution characteristic and to improve the light emission efficiency of the light emitting device.

[Supplementary Note 5] The light-emitting device according to any one of the first to third and fifth aspects or Supplementary notes 1 to 4, wherein the translucent layer is made of an organic material.
In Supplementary Note 5, since the refractive index of the organic material is smaller than that of the inorganic material, the refractive index of the light-transmitting layer can be reduced, and the light emission efficiency of the light emitting device can be improved.

[Appendix 6] The light-emitting device according to any one of the first to fourth aspects or appendices 1 to 5, wherein the upper surface of the light-emitting element and the phosphor layer are directly joined.
In Supplementary Note 6, it is possible to omit an adhesive layer for bonding and fixing the light emitting element and the phosphor layer, and the manufacturing cost of the light emitting device can be reduced.

[Appendix 7] A method for manufacturing a light-emitting device according to any one of the first to fifth aspects or appendices 1 to 6, wherein the light-transmitting layer and the phosphor layer are laminated and integrated to form a plate material. A method of manufacturing a light emitting device, comprising: a first step; a second step of dicing the plate material to form a groove; and a third step of cutting the bottom of the groove by dicing to separate the plate material.
In Appendix 7, the dicing blade used in the second step is appropriately selected, and the inner surface shape of the groove is changed to a desired shape (concave surface shape, inclined surface shape, stepped surface shape), so that the upper surface of the translucent layer is formed. The area can be easily made smaller than the area of the lower surface.

  The present invention is not limited to the description of each aspect, each embodiment, and the supplementary notes. Various modifications are also included in the present invention as long as those skilled in the art can easily conceive without departing from the description of each aspect, each embodiment, the appended claims, and the claims. The contents of publications and the like specified in the present specification are all incorporated by reference.

DESCRIPTION OF SYMBOLS 10, 20, 30 ... Light-emitting device 11 ... Mounting board 13 ... LED chip (light emitting element)
DESCRIPTION OF SYMBOLS 13a ... Upper surface 15 ... Translucent layer 15a ... Concave surface part 15b ... Vertical surface part 15c ... Upper surface 15d ... Lower surface 15e ... Inclined surface part 15f ... Step surface part 16 ... Phosphor layer 17 ... Adhesive layer 18 ... Light reflecting member

Claims (5)

A mounting board;
A light emitting device flip-chip mounted on the mounting substrate;
A phosphor layer disposed on the light emitting element;
A light-transmitting layer disposed on the phosphor layer;
A light reflecting member that integrally covers outer peripheral side surfaces of the light emitting element, the phosphor layer, and the light transmitting layer;
A light emitting element in which an area of an upper surface located on the opposite side of the light emitting element in the light transmitting layer is smaller than an area of a lower surface located on the light emitting element side. The outer peripheral side surface of the translucent layer is a rough surface having fine irregularities,
The light emitting device according to claim 1. The refractive index of the light transmitting layer is lower than the refractive index of the phosphor layer,
The light emitting device according to claim 1. Both the phosphor layer and the light transmitting layer are made of an inorganic material,
The light emitting element as described in any one of Claims 1-3. An adhesive layer for adhering and fixing the light emitting element and the phosphor layer;
The light emitting element as described in any one of Claims 1-5.

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