JP2011082285A - Light emitting diode and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode that sufficiently secures heat dissipation effect and can be mounted directly on the surface of a mounting substrate such as a mother board even when a high luminance type light emitting element is mounted. <P>SOLUTION: The light emitting diode 21 includes a body substrate 22 made of a metal member, a light emission part 23 formed on the body substrate 22, and a terminal electrode part 24 formed at one end of the body substrate 22, and the terminal electrode part 24 includes an upper substrate 28 and a lower substrate 30 provided on the upper surface and the lower surface of the body substrate 22 each at one end and having conductive films 28a and 30a on surfaces, an insulating layer 31 sandwiched between the upper substrate 28 and lower substrate 30 and covering the side face of the body substrate 22, and a conductive layer 32 covered such that the conductive films 28a and 30a conduct to each other via the insulating layer 31. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a surface-mount type light emitting diode configured with a metal member as a base and a method for manufacturing the same.

  As shown in FIG. 10 (a), a conventional general surface mount type light emitting diode 1 is mounted on a main body substrate 2 on which a pair of terminal electrode portions 4 are formed, and on the main body substrate 2, and is bonded to a bonding wire. The light emitting element 3 is connected to the pair of terminal electrode portions 4 via 5, and the light transmitting resin body 6 that seals the light emitting element 3 is provided. As shown in FIG. 10B, the terminal electrode portion 4 is formed on the upper surface electrode 4a and the lower surface electrode 4b formed on a part of the upper surface and the lower surface of the main body substrate 2, and on the side surface of the recessed main body substrate 2. This is a through-hole electrode in communication with the formed side electrode 4c. By forming such a through-hole electrode, the lower surface electrode 4b can be conductively connected in a state where it is directly placed on a mounting board such as a mother board.

  The light-emitting diode 1 has a problem that heat resistance and heat dissipation are poor, although the through hole electrode can be formed because the main body substrate 2 is formed of an insulating resin material. In recent years, light-emitting diodes have come to be used as light sources for illumination instead of fluorescent lamps and incandescent lamps due to the stable light-emitting characteristics and low power consumption of light-emitting diodes.

  When used for such illumination, since a high-power type light emitting element is used, a large amount of current flows when it emits light, thereby generating heat. With conventional resin substrates, heat resistance There was a problem.

  Therefore, in light-emitting diodes configured using high-power-type light-emitting elements, a substrate formed of a metal member such as aluminum that is lightweight and has excellent heat resistance has been widely used (Patent Documents 1 to 3). ). FIG. 11 shows an example of the light-emitting diode 11 configured with a metal member as a base. The light emitting diode 11 includes a main body substrate 12 formed of a metal member, a pair of terminal electrode portions 14 formed on an end portion of the upper surface of the main body substrate 12 via an insulating upper substrate 12a, and the main body substrate. The light-emitting element 13 is mounted at a substantially central portion 12 and is electrically connected to the terminal electrode portion 14 via a bonding wire 15, and a translucent resin body 16 that seals the light-emitting element 13. Has been.

  12A is provided with an insulating upper substrate 12a and a lower substrate 12b on the upper surface and the lower surface of the main substrate 12, and the upper substrate 12a and the lower substrate 12b are connected to the main substrate 12. A pair of terminal electrode portions 14 communicating along the side surface are provided.

  As shown in FIG. 12B, the terminal electrode portion 14 is applied to the upper surface electrode 14a and the lower surface electrode 14b formed on the surfaces of the upper substrate 12a and the lower substrate 12b, and the side surface of the recessed main substrate 12. This is a through-hole electrode in communication with the side electrode 14c formed through the insulating layer 17 formed. By forming such a through-hole electrode, it is possible to conduct conduction in a state where the lower surface electrode 14b is directly placed on a mounting substrate such as a mother board (Patent Document 3).

JP 2000-309292 A JP 2006-295085 A Japanese Patent Laid-Open No. 10-012982

  In the light emitting diode 11 shown in FIG. 11, the main body substrate 12 is formed of a metal member, so that it is strong and has an excellent heat dissipation effect. However, since the terminal electrode portion 14 is provided on the upper surface of the main body substrate 12, it cannot be surface-mounted on a mounting substrate such as a mother board.

  On the other hand, in the light emitting diode 11a having the structure as shown in FIG. 12, in order to form the terminal electrode 14 as a through-hole electrode on the main body substrate 12 made of a metal member, the entire upper and lower surfaces of the main body substrate 12 are formed. Is covered with an insulating upper substrate 12a and lower substrate 12b. Therefore, there is a problem that the portion where the light emitting element 13 is mounted and the exposed surface of the metal on the lower surface of the main body substrate 12 are lost, and the heat dissipation action from the main body substrate 12 cannot be obtained sufficiently. In addition, there is a problem that it takes a lot of manufacturing steps and costs to dispose the upper substrate 12a and the lower substrate 12b with respect to the main body substrate 12.

  Accordingly, an object of the present invention is to provide a light-emitting diode that can sufficiently mount a heat dissipation effect and can be directly surface-mounted on a mounting board such as a mother board, even when a high-luminance type light-emitting element is mounted. The manufacturing method is provided.

  In order to solve the above problems, a light emitting diode of the present invention includes a main body substrate made of a metal member, a light emitting portion formed on the main body substrate, and a terminal electrode portion formed on one end of the main body substrate. In the light emitting diode, the terminal electrode portion is provided at one end of the upper surface and the lower surface of the main body substrate, and has a pair of insulating substrates having a conductive film on the surface, and a side surface of the main substrate sandwiched between the pair of insulating substrates. And a plating layer coated so that the conductive film formed on the pair of insulating substrates is conducted through the insulating layer.

  Further, the method for manufacturing a light emitting diode according to the present invention includes forming a metal collective main body substrate having a planar size capable of forming a plurality of light emitting diodes, and forming a circle on a part of an upper surface and a lower surface of a predetermined portion of the collective main substrate. A hole having a shape and an insulating substrate having a conductive film formed around the hole are joined to form a through-hole penetrating the aggregate body substrate in the thickness direction along the hole, and the through-hole is formed in the through-hole. After filling and curing the insulating resist material, the resist material is attached to the inner peripheral surface of the through hole by removing the central portion of the resist material, and from the surface of the resist material to the upper surface of the collective body substrate In addition, by plating the insulating substrate bonded to the lower surface, a terminal electrode as a through hole that conducts from the upper surface to the lower surface of the collective main body substrate is formed.

  According to the light emitting diode according to the present invention, the terminal electrode portion as the through-hole electrode formed through the insulating layer can be easily formed even if the light emitting diode is formed of a metal main body substrate. . For this reason, it becomes possible to surface-mount as it is also on mounting boards, such as a motherboard. In addition, in the light emitting part, the light emitting element can be directly arranged on the part where the metal surface of the main body substrate is exposed, and the metal surface on the lower surface of the main body substrate excluding the terminal electrode part is widely exposed. The heat dissipation effect during light emission can be enhanced.

  Further, according to the method for manufacturing a light emitting diode according to the present invention, an insulating substrate is disposed on the upper surface and the lower surface of a single collective body substrate made of metal, and a through hole is formed in a portion where the substrate is disposed. By forming an insulating layer made of a resist material on the inner peripheral surface of the through hole, terminal electrode portions as through-hole electrodes communicating from the upper surface to the lower surface of the collective main body substrate can be collectively formed.

It is the perspective view seen from the upper surface direction of the light emitting diode of 1st Embodiment which concerns on this invention. It is the perspective view seen from the lower surface side of the said light emitting diode. It is sectional drawing of the said light emitting diode. It is a perspective view of the terminal electrode part of the said light emitting diode. It is sectional drawing of the light emitting diode of 2nd Embodiment which concerns on this invention. It is a perspective view of the terminal electrode part of the said light emitting diode. It is process drawing which shows the 1st manufacturing method of the light emitting diode of 1st Embodiment. It is process drawing which shows the 2nd manufacturing method of the light emitting diode of 1st Embodiment. It is process drawing which shows the manufacturing method of the light emitting diode of 2nd Embodiment. It is sectional drawing (a) and the partial perspective view (b) of the conventional light emitting diode comprised by the resin substrate. It is sectional drawing of the light emitting diode comprised by the conventional metal substrate. It is sectional drawing (a) and the partial perspective view (b) of the other light emitting diode comprised with the conventional metal substrate.

  Hereinafter, embodiments of a light emitting diode according to the present invention will be described in detail with reference to the accompanying drawings. As shown in FIGS. 1 and 2, the light emitting diode 21 according to the first embodiment of the present invention includes a flat plate-like main body substrate 22 made of a metal member, and a light emitting portion 23 provided at a substantially central portion of the main body substrate 22. And a plurality of terminal electrode portions 24 provided at the end of the main body substrate 22.

  For example, the main body substrate 22 is made of a rectangular aluminum material having a thickness of about 0.7 mm and excellent heat resistance. An insulating ring-shaped wall portion 25 is provided at a substantially central portion of the upper surface of the main body substrate 22, and a light emitting portion 23 is formed in the wall portion 25. A plurality of semicircular concave portions are formed in the thickness direction of the opposite side surfaces of the main body substrate 22. The recessed portion serves as a terminal electrode portion 24 as a through-hole electrode for communicating from the upper surface to the lower surface of the main body substrate.

  As shown in FIG. 3, the light emitting portion 23 includes a light emitting element 26 and a transparent or translucent resin body 27 having translucency for sealing the light emitting element 26 in the wall portion 25. Yes. The resin body 27 is filled and molded so as to be substantially parallel to the height of the wall portion 25 so that the light emitting element 26 is completely buried. An upper substrate 28 on which an electrode pattern is formed is provided on the upper surface of the main body substrate 22 except for a portion where the light emitting element 26 is mounted. The light emitting element 26 is directly disposed on the upper surface of the central portion of the main body substrate 22 and is solder-connected to the upper substrate 28 via bonding wires 29. In the present embodiment, the light emitting unit 23 is composed of a single light emitting element 26. However, when increasing the amount of light, two or more light emitting elements are used, and the main substrate 22 with the metal surface exposed. It can arrange | position directly on the upper surface 22a.

  As shown in FIG. 4, the terminal electrode portion 24 is a through-hole electrode that leads from the upper surface to the lower surface of the main body substrate 22. The terminal electrode portion 24 includes a part of the upper substrate 28 that covers the upper surface of the recessed portion that is recessed in a semi-cylindrical shape, the lower substrate 30 that is provided on the lower surface of the recessed portion, the upper substrate 28, and the lower substrate 28. Conductive films 28a, 30a formed on the surface of the substrate 30, an insulating layer 31 formed by applying an insulating resist material to the inner peripheral surface of the recessed portion, the conductive films 28a, 30a, and the insulating layer And a plating layer 32 covering 31.

  The upper substrate 28 and the lower substrate 30 are formed of an insulating material such as an epoxy resin or a BT resin, and have a thickness of about 0.1 mm, for example, and are attached to the upper surface 22a and the lower surface 22b of the main body substrate 22 by an adhesive or the like. Affixed. As described above, the upper substrate 28 is disposed on the upper surface 22a of the main body substrate 22 excluding the portion where the light emitting element 26 is disposed, and is connected to the connection electrode of the bonding wire 29 extending from the light emitting element 26 or the connection electrode. A wiring pattern connected to each terminal electrode portion 24 is formed. In addition, the lower surface 22b of the main body substrate 22 is formed in a planar size that can be placed on an electrode portion formed on a mounting substrate such as a mother board.

  The insulating layer 31 is applied with a certain thickness so as to overlap one end of the upper substrate 28 and the lower substrate 30 and along the inner surface of the recessed portion. By providing the insulating layer 31, the metal surface of the main substrate 22 exposed between the upper substrate 28 and the lower substrate 30 can be used as an insulating surface.

  The plating layer 32 is formed of a copper foil film having high conductivity, and is covered so that the conductive films 28a and 30a and the insulating layer 31 are in communication. The plating layer 32 can be formed by means such as vapor deposition or sputtering.

  5 and 6 show the light emitting diode 41 of the second embodiment. The terminal electrode portion 44 of the light emitting diode 41 is insulated so that the lower substrate for insulation is not provided on the lower surface of the main body substrate 22 and the resist material applied to the side surface of the main body substrate 22 wraps around the end portion of the lower surface 22b. A layer 31 is formed, and a plated layer 32 made of a copper foil film is formed on the surface of the insulating layer 31. Since the configuration of the light emitting unit 23 formed on the upper surface of the main body substrate 22 is the same as that of the light emitting diode 21 of the first embodiment, the same configuration is denoted by the same reference numeral and is described in detail. Is omitted.

  According to the light emitting diodes 21 and 41 of the above embodiment, the main body substrate 22 made of a metal member is used as a base, but the insulating layer 31 is formed on the outer peripheral portion of the main body substrate 22 to be formed of a resin material. A terminal electrode portion as a through-hole electrode as provided on the main body substrate can be easily formed. For this reason, it becomes possible to surface-mount as it is also on mounting boards, such as a motherboard. Further, in the light emitting portion 23, the light emitting element 26 can be directly disposed on the exposed portion of the metal surface of the main body substrate 22, and the metal surface on the lower surface of the main body substrate 22 excluding the terminal electrode portions 24 and 44 is provided. Since it is widely exposed, the heat dissipation effect can be improved.

  Next, based on FIG. 7, the 1st manufacturing method of the light emitting diode 21 which concerns on the said 1st Embodiment centering on a terminal electrode part is demonstrated. First, a collective body substrate 52 made of an aluminum plate having a planar size capable of simultaneously forming a plurality of light emitting diodes 21 is formed, and conductive films 28a, 30a are formed on the upper and lower surfaces of portions of the collective main body substrate 52 to be terminal electrode portions 24. The upper substrate 28 and the lower substrate 30 on which are formed are mounted (step a). In the upper substrate 28 and the lower substrate 30, a circular hole 53 is formed in the center in advance, and conductive layers 28 a and 30 a are formed by depositing a copper foil film on the surface excluding the hole 53.

  Next, a cylindrical through hole 54 is formed in the collective main body substrate 52 exposed from the hole 53 provided in the upper substrate 28 and the lower substrate 30 (step b), and the resist material 55 is filled in the through hole 54. (Step c). The resist material 55 is filled in the through hole 54 and from the inner peripheral surface of the hole 53 of the upper substrate 28 and the lower substrate 30 protruding from the through hole 54 to a height at which the conductive layer 32 is provided.

  After the resist material 55 is cured, an opening 56 is provided so as to penetrate the central portion of the resist material 55 (step d). Since the opening 56 is set to be smaller than the inner diameter of the through hole 54, a resist material 55 having a certain thickness adheres from the inner surface of the collective main body substrate 52 to the inner surfaces of the holes 53 of the upper substrate 28 and the lower substrate 30. It will be in the state.

  Next, the surface of the resist material 55 formed in the through hole 54 is covered with the conductive films 28a, 30a formed on the surfaces of the upper substrate 28 and the lower substrate 30 by vapor deposition or sputtering. A conductive layer made of a copper foil film is formed by performing a plating process (step e).

  After the terminal electrode portion 24 is formed by the above process, a light emitting portion 23 (not shown) surrounded by a ring-shaped wall portion is formed on the upper surface of the collective main body substrate 52. As shown in FIG. 3, the light-emitting portion 23 has a light-emitting element disposed on the upper surface of the collective main body substrate 52 and is connected to the upper substrate with a bonding wire. It is formed by filling the resin body. Finally, the collective main body substrate 52 is diced into a rectangular shape centering on the location where the through hole 54 is provided, whereby each light emitting diode 21 is completed.

  FIG. 8 shows a second manufacturing method of the light emitting diode 21 with the terminal electrode portion 24 as the center. In this manufacturing method, first, an aggregate main body substrate 52 made of an aluminum plate having a planar size capable of simultaneously forming a plurality of light emitting diodes 21 is formed, and a through hole 54 is previously formed at a location to be the terminal electrode portion 24 of the aggregate main body substrate 52. Is established (step a).

  Next, a substrate material (prepreg) 60 having a copper foil film 60a attached to the surface is mounted so as to sandwich each through hole 54 from the upper surface and the lower surface (step b). The prepreg 60 is a substrate material in which a glass cloth is impregnated with a thermosetting resin, and the substrate material is heated by heating a portion where the prepreg 60 is mounted at a predetermined temperature and pressurizing at a predetermined pressure. The semi-cured resin impregnated in the resin melts and fills the through hole 54 (step c).

  After the resin material 61 that has melted into the through hole 54 is cured, the prepreg 60 from the upper surface to the lower surface is placed so that the resin material 61 is attached to the inner peripheral surface of the through hole 54 with a predetermined thickness. Then, an opening 62 penetrating the central portion of the resin material 61 in a cylindrical shape is formed (step d).

  Finally, the conductive layer 63 is plated by covering the copper foil film 60a formed on the surface of the prepreg 60 on the upper surface and the lower surface and the inner peripheral surface of the through hole 54 sandwiched between the prepregs 60. Is formed (step e).

  FIG. 9 shows a method for manufacturing the light emitting diode 41 of the second embodiment with the terminal electrode portion as the center. In this manufacturing method, first, a collective main body 52 made of an aluminum plate having a planar size capable of simultaneously forming a plurality of light emitting diodes 41 is formed, and a conductive film is formed on the upper surface of the collective main substrate 52 where the terminal electrode portion 24 is to be formed. The upper substrate 28 on which 28a is formed is disposed (step a).

  Next, a through hole 54 penetrating the collective main body substrate 52 from the central portion of the upper substrate 28 is opened (step b), and the through hole 54 is filled with a resist material 55 (step c). The resist material 55 is filled so as to go from the through hole 54 to the lower surface of the collective main body substrate 52.

  A cylindrical opening 56 is provided through the center of the resist material 55 filled and cured in the through hole 54 (step d). By this opening 56, an insulating layer made of a resist material 55 having a predetermined thickness is formed on the inner peripheral surface of the through hole 54.

  Finally, the conductive film 28a exposed around the upper surface of the through hole 54 and the surface of the resist material 55 attached so as to go from the inner peripheral surface of the through hole 54 to the lower surface are plated. Conductive layer 32 is formed (step e).

  As described above, in the light emitting diode according to the present invention, the main body substrate on which the light emitting element is mounted is made of a conductive metal member in order to provide heat resistance. A terminal electrode portion as a through hole is formed on the outer peripheral surface of the conductive layer through an insulating layer. For this reason, the main body substrate can be surface-mounted on a mounting substrate such as a mother board in the same manner as a light emitting diode formed of resin.

DESCRIPTION OF SYMBOLS 1, 11, 11a Light emitting diode 2, 12 Main body board 3, 13 Light emitting element 4, 14 Terminal electrode part 4a, 14a Upper surface electrode 4b, 14b Lower surface electrode 4c, 14c Side electrode 5, 15 Bonding wire 6, 16 Resin body 12a On Substrate 12b Lower substrate 21 Light emitting diode 22 Main substrate 22a Upper surface 22b Lower surface 23 Light emitting portion 24 Terminal electrode portion 25 Wall portion 26 Light emitting element 27 Resin body 28 Upper substrate 28a Conductive film 29 Bonding wire 30 Lower substrate 30a Conductive film 31 Insulating layer 32 Conductive Layer 41 Light-emitting diode 44 Terminal electrode portion 52 Assembly body substrate 53 Hole portion 54 Through hole 55 Resist material 56 Opening 60 Prepreg 60a Copper foil film 61 Resin material 62 Opening 63 Conductive layer

Claims (7)

In a light emitting diode comprising a main body substrate made of a metal member, a light emitting portion formed on the main body substrate, and a terminal electrode portion formed on one end of the main body substrate,
The terminal electrode portion is provided at one end of the upper surface and the lower surface of the main substrate, and has a pair of insulating substrates having a conductive film on the surface, and an insulating layer covering a side surface of the main substrate sandwiched between the pair of insulating substrates. A light emitting diode comprising: a plating layer which is coated so as to be electrically connected to the conductive film formed on the pair of insulating substrates through the insulating layer. In a light emitting diode comprising a main body substrate made of a metal member, a light emitting portion formed on the main body substrate, and a terminal electrode portion formed on one end of the main body substrate,
The terminal electrode portion is provided at one end of the upper surface of the main body substrate, has an insulating substrate having a conductive film on the surface, an insulating layer formed from one end of the insulating substrate to the side surface and the lower surface of the main substrate, and the insulating layer A light-emitting diode comprising a plating layer coated so that the surface of the conductive film and the conductive film are electrically connected.   The light emitting diode according to claim 1, wherein the terminal electrode portion is provided at a location where one end of the main body substrate is recessed.   The light emitting diode according to claim 1, wherein the insulating layer is formed of a resist material and is attached to a surface of the main body substrate.   The light-emitting diode according to claim 1, wherein the insulating substrate is formed by impregnating a glass material with a semi-cured thermosetting resin.   The light emitting unit includes a ring-shaped wall provided at the center of the upper surface of the main body substrate, one or more light emitting elements disposed in the wall, and seals the light emitting element in the wall. The light emitting diode according to claim 1 or 2, comprising a resin body having translucency. Forming a metal aggregate body substrate having a planar size capable of forming a plurality of light emitting diodes;
Bonding a circular hole and an insulating substrate in which a conductive film is formed around the hole to a part of the upper surface and the lower surface of a predetermined portion of the collective body substrate,
Forming a through-hole penetrating the aggregate body substrate in the thickness direction along the hole,
After filling and curing an insulating resist material in the through hole, by removing the central portion of the resist material, the resist material is attached to the inner peripheral surface of the through hole,
By plating the insulating substrate bonded to the upper and lower surfaces of the collective main body substrate from the surface of the resist material, terminal electrodes are formed as through holes that conduct from the upper surface to the lower surface of the collective main substrate. A method for manufacturing a light emitting diode.

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