TWI743540B - Light-emitting unit and manufacturing method thereof - Google Patents

Abstract

A light-emitting unit includes a substrate, a reflective layer, a light-emitting chip, an encapsulation layer, a reflective cap layer and a plurality of structure-strengthened parts. The reflective layer is disposed on the substrate and is provided with an accommodating area. The light-emitting chip is disposed in the accommodating area and the encapsulation layer covers the light-emitting chip. The reflective cap layer is disposed on the encapsulation layer and the encapsulation layer is disposed between the reflective layer and the reflective cap layer. The plurality of structure-strengthened parts are disposed on the lateral side of the encapsulation layer. The plurality of structure-strengthened parts extend from one of the reflective layer and the reflective cap layer to the other of the reflective cap layer and the reflective layer.

Description

Light-emitting unit and manufacturing method thereof

The invention relates to a light-emitting unit with a reflective cover plate and a manufacturing method thereof.

Since light-emitting diodes have advantages such as small size, low power consumption, and high reliability, light-emitting diodes are widely used. Generally speaking, a light-emitting diode has a light-emitting surface, that is, a single-sided light-emitting source. When the light-emitting diode is used as a backlight source of a display panel, it is easy to cause uneven brightness of the display screen.

In summary, the inventor of the present invention considered and designed a light-emitting unit and a manufacturing method thereof, with a view to improving the deficiency of the conventional technology, and thereby enhancing the application and utilization in the industry.

In view of the above-mentioned conventional problems, the purpose of the present invention is to provide a light-emitting unit and a manufacturing method thereof to solve the problems faced by the conventional technology.

Based on the above objective, the present invention provides a light-emitting unit, which includes a substrate, a reflective layer, a light-emitting chip, an encapsulant layer, a reflective cover plate, and a plurality of structural reinforcements. The reflective layer is arranged on the substrate and has an accommodating area. The light-emitting chip is arranged in the accommodating area, and the packaging glue layer covers the light-emitting chip. The reflective cover plate is arranged on the packaging glue layer, and the packaging glue layer is between the reflective layer and the reflective cover plate. A plurality of structural reinforcements are arranged on the outside of the encapsulation adhesive layer, and the plurality of structural reinforcements extend from one of the reflective layer and the reflective cover plate And extend toward the other of the reflective layer and the reflective cover plate. Through the arrangement of a plurality of structural reinforcements, the reflective cover plate is not easy to fall off, so that the light-emitting unit can maintain stable lateral light emission and avoid uneven brightness.

Based on the above objective, the present invention provides a method for manufacturing a light-emitting unit, which includes: (1) providing a reflective layer on a substrate, and the reflective layer has a plurality of accommodating areas. (2) A plurality of light-emitting chips are provided, and the plurality of light-emitting chips are respectively arranged in a plurality of accommodating areas. (3) Provide a packaging glue layer to cover a plurality of light-emitting chips. (4) Provide a reflective cover plate on the reflective layer. Wherein, a plurality of structural reinforcement parts extend from one of the reflective layer and the reflective cover plate, and extend toward the other of the reflective layer and the reflective cover plate, the encapsulating glue layer is between the reflective layer and the reflective cover plate, and the plurality of structures The reinforcing part is embedded in the packaging adhesive layer. Through the arrangement of a plurality of structural reinforcements, the reflective cover plate is not easy to fall off, so that the light-emitting unit can maintain stable lateral light emission and avoid uneven brightness.

As mentioned above, the light-emitting unit and its manufacturing method of the present invention can prevent the reflective cover from falling off easily and enhance its stability through the arrangement of a plurality of structural reinforcements, so that each light-emitting unit can maintain stable lateral light emission and avoid Uneven brightness occurs.

1: Light-emitting unit

10: substrate

20: reflective layer

21: containment area

30: Light-emitting chip

40: Encapsulation adhesive layer

41, 51: side

50: reflective cover

60: Structural Strengthening Department

61: First plane

C: Corner

S11~S15, S21~S25: steps

Figure 1 is a structural diagram of the light-emitting unit.

Figure 2A is an exploded view of the first embodiment of the light-emitting unit of the present invention.

Fig. 2B is a structural diagram of the first embodiment of the light-emitting unit of the present invention.

Fig. 3A is an exploded view of the second embodiment of the light-emitting unit of the present invention.

FIG. 3B is a structural diagram of the second embodiment of the light-emitting unit of the present invention.

Figure 4 is an exploded view of the third embodiment of the light-emitting unit of the present invention.

Figure 5 is an exploded view of the fourth embodiment of the light-emitting unit of the present invention.

Figure 6 is an exploded view of the fifth embodiment of the light-emitting unit of the present invention.

FIG. 7 is a flowchart of the first embodiment of the method of manufacturing the light-emitting unit of the present invention.

FIG. 8 is a flowchart of the second embodiment of the method of manufacturing the light-emitting unit of the present invention.

The advantages, features, and technical methods of the present invention will be described in more detail with reference to exemplary embodiments and the accompanying drawings to make it easier to understand, and the present invention can be implemented in different forms, so it should not be understood to be limited to what is here. The stated embodiments, on the contrary, for those with ordinary knowledge in the technical field, the provided embodiments will make this disclosure more thorough, comprehensive and complete to convey the scope of the present invention, and the present invention will only be additional Defined by the scope of the patent application.

It should be understood that although the terms "first", "second", etc. may be used in the present invention to describe various elements, components, regions, layers and/or parts, these elements, components, regions, layers and/or parts Should not be restricted by these terms. These terms are only used to distinguish one element, component, region, layer and/or section from another element, component, region, layer and/or section. Therefore, the "first element", "first part", "first area", "first layer" and/or "first part" discussed below can be referred to as "second element", "second part" , "Second Area", "Second Layer" and/or "Second Part" without departing from the spirit and teachings of the present invention.

In addition, the terms "including" and/or "including" refer to the existence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more other features, regions, wholes, steps, operations , The presence or addition of elements, components, and/or combinations thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present invention have the same meanings as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having definitions consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or overly formal Unless explicitly defined as such in this article.

Please refer to Figure 1, which is a structural diagram of the light-emitting unit, in which the reflective cover has fallen off. As shown in Figure 1, the light-emitting unit has a substrate 10, a reflective layer 20, a light-emitting chip (located in the encapsulant layer 40 but not shown), an encapsulant layer 40, and a reflective cover 50, through the reflective layer 20 and the reflective cover The combination of 50 enables the light-emitting unit to emit light laterally, avoiding uneven brightness; however, the reflective cover 50 is easy to fall off, which increases the amount of light emitted by the light-emitting unit in the forward direction, and produces obvious bright spots.

Please refer to FIG. 2A and FIG. 2B, which are the exploded view of the first embodiment of the light-emitting unit of the present invention and the structural view of the first embodiment of the light-emitting unit of the present invention. As shown in FIGS. 2A and 2B, the light-emitting unit 1 of the present invention includes a substrate 10, a reflective layer 20, a light-emitting chip 30, an encapsulant layer 40, a reflective cover 50, and a plurality of structural reinforcements 60. The reflective layer 20 is disposed on the substrate 10 and has an accommodating area 21. The light-emitting chip 30 is disposed in the accommodating area 21, and the encapsulant layer 40 covers the light-emitting chip 30. The reflective cover 50 is disposed on the packaging glue layer 40, and the packaging glue layer 40 is between the reflective layer 20 and the reflective cover 50. The plurality of structural reinforcements 60 are disposed on the outer side of the encapsulant layer 40, and the plurality of structural reinforcements 60 extend from one of the reflective layer 20 and the reflective cover 50 and face the reflective layer 20 and the reflective cover 50 One of the other extensions. The arrangement of the plurality of structural reinforcement parts 60 prevents the reflective cover 50 from falling off and enhances its stability, so that the light-emitting unit 1 can maintain stable lateral light emission and avoid uneven brightness. In some embodiments, the structural reinforcement portion 60 may extend from the reflective cover 50 and extend toward the reflective layer 20, for example. In addition, in some embodiments, the structural reinforcement 60 may be located at the corner C of the encapsulation adhesive layer 40 and the structural reinforcement 60 may be, for example, a square pillar, wherein the structural reinforcement 60 is located at the corner C of the encapsulation adhesive layer 40 to avoid affecting The light emitting unit 1 emits light from the side.

It should be noted that, according to actual requirements, the plurality of structural reinforcement portions 60 may, for example, only contact the reflective layer 20, only the reflective cover plate 50, or contact the reflective layer 20 and the reflective cover plate 50 at the same time. Specifically, in one embodiment, the reflective cover plate 50 extends a plurality of structural reinforcement portions 60, and each structural reinforcement portion 60 extends toward the reflective layer 20 and extends into the encapsulant layer 40, and the structural reinforcement portion 60 extends to form When contacting the reflective layer 20, the structural reinforcement 60 can provide better supporting force to reduce the chance of the reflective cover plate 50 peeling off. In addition, since the plurality of structural reinforcement portions 60 abut the reflective layer 20, the skew of the reflective cover plate 50 can be avoided when the reflective cover plate 50 is arranged, and the reflective cover plate 50 and the substrate 10 can be ensured to be substantially parallel. In another embodiment, the reflective layer 20 extends with a plurality of structural reinforcements 60, and when the structural reinforcements 60 extend to contact the reflective cover 50, the skew of the reflective cover 50 can be avoided when the reflective cover 50 is configured, and the reflective cover 50 can be ensured. It is approximately parallel to the substrate 10.

In addition, the substrate 10 can be selected from a silicon substrate, a gallium arsenide (GaAs) substrate, a glass substrate, a quartz substrate, a gallium phosphide (GaP) substrate, a gallium arsenide (GaAsP) substrate, and an aluminum gallium arsenide (AlGaAs) substrate. , Zinc oxide (ZnO) substrate, sapphire substrate, indium phosphide (InP) substrate and silicon carbide (SiC) substrate, but it is not limited to this; the material of the light-emitting chip 30 may include red light material, blue light material, green light The material or its combination is not limited to this; the encapsulant layer 40 may include phosphor, phosphor, quantum dot material or diffusion particles, and be combined with encapsulation materials for encapsulation. The encapsulation materials may include organic materials and inorganic materials. Organic materials can include silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiON), silicon carbonitride (SiCN), silicon oxycarbide (SiOC), titanium oxide (TiOx), zirconium oxide (ZrOx) , Magnesium oxide (MgO), hafnium oxide (HfOx), tantalum pentoxide (Ta2O5), indium tin oxide (ITO) or aluminum oxide (AlOx) and combinations thereof, organic materials may include benzocyclobutene, Polyimide, polyamide, acrylic resin or phenolic resin and combinations thereof, but are not limited thereto; the material of the structural reinforcement part 60 includes Reply polyphthalamide (PPA, Polyphthalamide), polyterephthalic acid The hexamethylene dimethanol ester (PCT) and the thermosetting epoxy resin (EMC) are not limited to these, of course, they can also be other preferred material combinations, and are not limited to the scope of the present invention.

Please refer to FIGS. 3A and 3B, which are an exploded view of the second embodiment of the light-emitting unit of the present invention and a structural view of the second embodiment of the light-emitting unit of the present invention. The configuration of the components with the same component symbols is similar to that described above, and the similarities are not repeated here.

As shown in FIG. 3A and FIG. 3B, the main difference between the second embodiment of the present invention and the first embodiment is that each structural reinforcement portion 60 can extend from the reflective layer 20 and extend toward the reflective cover 50. The structural reinforcement portion 60 is, for example, a 1/4 cylindrical structure and its surface embedded in the packaging adhesive layer 40 is a curved surface. Each structural reinforcement portion 60 is located outside the packaging adhesive layer 40 and located at the four corners C of the packaging adhesive layer 40. Of course, the position of the structural reinforcement 60 can also be other conditions according to requirements, and is not limited to the scope of the present invention.

Please refer to FIG. 4, which is an exploded view of the third embodiment of the light-emitting unit of the present invention. The configuration of the components with the same component symbols is similar to that described above, and the similarities are not repeated here. As shown in Figure 4, the third embodiment of the present invention differs from the first embodiment in that the position of each structural reinforcement 60 is located on the side surface 41 of the packaging adhesive layer 40 and located at the two corners of the packaging adhesive layer 40 Between C. In this implementation In an example, the structural reinforcement portion 60 may be, for example, a square pillar, but it is not limited to this, and the surface of the structural reinforcement portion 60 embedded in the encapsulant layer 40 may also be, for example, a curved surface.

Please refer to FIG. 2A, FIG. 2B, FIG. 3A, and FIG. 3B. In some embodiments, the side of each structural reinforcement portion 60 facing away from the light-emitting chip 30 is the first plane 61, and the first plane 61 and the encapsulant The sides 41 of the layer 40 are flush. In addition, as shown in Figure 4, the first plane 61 can be flush with the side surface 22 of the reflective layer 20 and the side surface 51 of the reflective cover 50, respectively, and the plurality of structural reinforcement portions 60 can be surrounded by the light-emitting chip 30 as a reference, for example. Luminescent chip 30.

The reflective cover plate 50 has reflectivity so that the light emitting unit 1 can emit light laterally toward the side surface 41 of the encapsulant layer 40, and the reflective cover plate 50 can also have slightly transmissive properties to avoid the formation of obvious light in the center of the light emitting unit 1 Black spots, that is, the reflective cover plate 50 is highly reflective but also needs a little light transmittance. In other words, the reflectivity of the reflective cover plate 50 is greater than the light transmittance of the reflective cover plate 50, and the transmissivity of the reflective cover plate 50 The light rate is greater than zero. Furthermore, the reflective cover plate 50 can control the ratio of reflectance to light transmittance through the selection of material and thickness. For example, the reflective cover plate 50 is made of white plastic which is reflective but not 100% reflective and will transmit light slightly. Increasing the light transmittance of the reflective cover 50 can reduce the thickness of the reflective cover 50.

Please refer to FIG. 5, which is an exploded view of the fourth embodiment of the light-emitting unit of the present invention. The configuration of the components with the same component symbols is similar to that described above, and the similarities are not repeated here. As shown in Figure 5, the difference between the fourth embodiment of the present invention and the first embodiment is that each structural reinforcement 60 is, for example, a one-eighth spherical structure, so that each structural reinforcement 60 is embedded in the side surface of the encapsulant layer 40 For the arc surface.

Please refer to FIG. 6, which is an exploded view of the fifth embodiment of the light-emitting unit of the present invention. The configuration of the components with the same component symbols is similar to that described above, and the similarities are not repeated here. like As shown in FIG. 6, the difference between the fifth embodiment of the present invention and the first embodiment is that each structural reinforcement portion 60 is a triangular pyramid structure, and the side surface of each structural reinforcement portion 60 embedded in the packaging adhesive layer 40 is a triangle.

Regardless of the fourth embodiment or the fifth embodiment, a plurality of structural reinforcements 60 extend from the reflective cover plate 50, for example, and the plurality of structural reinforcements 60 can respectively extend toward the reflective layer 20 with a narrower top; in different embodiments The plurality of structural reinforcements 60 can be extended from the reflective layer 20, and the plurality of structural reinforcements 60 respectively extend toward the reflective cover plate 50 with a narrower top. In other words, the structural reinforcement part 60 extends from one of the reflective layer 20 and the reflective cover plate 50, and the structural reinforcement part 60 extends toward the other of the reflective layer 20 and the reflective cover plate 50 with a narrower top to facilitate the manufacturing process. When the light-emitting unit is light-emitting, the structural reinforcement part 60 is embedded in the encapsulant layer 40 more quickly or smoothly.

Please refer to FIG. 7, which is a flowchart of the first embodiment of the light-emitting unit manufacturing method of the present invention. As shown in FIG. 7, the manufacturing method of the light-emitting unit of the present invention is described as follows: (1) Step S11: providing a reflective layer 20 on the substrate 10, and the reflective layer 20 has a plurality of accommodating areas 21. (2) Step S12: Provide a plurality of light-emitting chips 30, and the plurality of light-emitting chips 30 are respectively arranged in the plurality of accommodating areas 21. (3) Step S13: providing an encapsulating glue layer 40 to cover the plurality of light-emitting chips 30 and the reflective layer 20. (4) Step S14: A plurality of structural reinforcements 60 are extended from the reflective cover 50, indicating that the reflective cover 50 and the multiple structural reinforcements 60 can be the same material or different materials, so that each structural reinforcement 60 is formed on the reflective The cover plate 50 is successively covered with the reflective cover plate 50, so that the structural reinforcement portions 60 extend into the encapsulation adhesive layer 40 and extend toward the reflective layer 20, and the structural reinforcement portions 60 can contact the reflective layer 20, and the encapsulation adhesive layer 40 is located on the reflective layer. Between 20 and the reflective cover plate 50, a plurality of structural reinforcement parts 60 are embedded in the encapsulation adhesive layer 40. Since each structural reinforcement portion 60 extends toward the reflective layer 20 and extends into the encapsulant layer 40, and when the structural reinforcement portion 60 can contact the reflective layer 20, it can be known that the depth of each structural reinforcement portion 60 is sufficient to support the reflective cover. 50. It has a positioning effect and can be avoided The depth of the non-structural reinforcement 60 embedded in the encapsulant layer 40 is not enough. In addition, since the multiple structural reinforcements 60 abut the reflective layer 20, the skew of the reflective cover 50 can be avoided when the reflective cover 50 is disposed, and the reflective cover 50 and the substrate 10 can be substantially parallel. . (5) Step S15: cutting the substrate 10, the reflective layer 20, the encapsulating glue layer 40, the reflective cover plate 50 and the plurality of structural reinforcement parts 60. (6) Step S16: forming a plurality of separated light-emitting units 1, each light-emitting unit 1 has one of a plurality of light-emitting chips 30, and a plurality of structural reinforcement portions 60 in each light-emitting unit 1 are arranged outside the encapsulation adhesive layer 40. For clear description, only one light-emitting unit 1 is shown in step S16. Through the arrangement of a plurality of structural reinforcement parts 60, the reflective cover plate 50 is not easy to fall off, so that each light-emitting unit 1 can maintain stable lateral light emission and avoid uneven brightness.

In addition, the cutting path cuts the structural reinforcement 60 into a plurality of equal parts. For example, the cutting path cuts the structural reinforcement 60 into 4 equal parts. Assuming that the structural reinforcement 60 extending from the reflective cover plate 50 is a rectangular column structure, After cutting, it will become a smaller rectangular column structure; assuming that the structural reinforcement 60 extending from the reflective cover 50 is a cylindrical structure, the side of the structural reinforcement 60 embedded in the packaging adhesive layer 40 after cutting is a curved surface, and the back of the structural reinforcement 60 The side facing the light-emitting wafer 30 is a flat surface. In addition, after cutting, the side of each structural reinforcement 60 in the light-emitting unit 1 facing away from the light-emitting chip is a first plane 61, and the first plane 61 is flush with a side surface 41 of the encapsulant layer 40, and the first plane 61 can be respectively aligned with The side surface of the reflective layer 20 is flush with the side surface of the reflective cover 50.

Please refer to FIG. 8, which is a flowchart of the second embodiment of the method for manufacturing a light-emitting unit of the present invention. As shown in FIG. 8, the manufacturing method of the light-emitting unit of the present invention is described as follows: (1) Step S21: providing a reflective layer 20 on the substrate 10, and the reflective layer 20 has a plurality of accommodating areas 21. (2) Step S22: Provide a plurality of light-emitting chips 30, and the plurality of light-emitting chips 30 are respectively arranged in the plurality of accommodating areas 21. (3) Step S23: A plurality of structural reinforcements 60 can be extended from the reflective cover plate 50, indicating that the reflective cover plate 50 and the plural number The structural reinforcements 60 can be made of the same material or different materials, so that each structural reinforcement 60 is formed on the reflective cover 50, and is continuously covered with the reflective cover 50, wherein the structural reinforcement 60 extending from the reflective cover 50 can contact the reflective Layer 20. In addition, in other embodiments, a plurality of structural reinforcements 60 may extend from the reflective layer 20, which means that the reflective layer 20 and the plurality of structural reinforcements 60 may be the same material or different materials, so that each structural reinforcement 60 is formed on the reflective layer. The layer 20 is continuously covered with a reflective cover 50, wherein the structural reinforcement 60 extending from the reflective layer 20 can contact the reflective cover 50. (4) Step S24: Fill the encapsulant layer 40 between the reflective layer 20 and the reflective cover 50, and the encapsulant layer 40 is filled between the structural reinforcement 60, so that the encapsulant layer 40 is between the reflective layer 20 and the reflective cover Between the boards 50, a plurality of structural reinforcements 60 are embedded in the packaging glue layer 40. (5) Step S25: cutting the substrate 10, the reflective layer 20, the encapsulating glue layer 40, the reflective cover plate 50 and the plurality of structural reinforcement parts 60. (6) Step S26: forming a plurality of separated light-emitting units 1, each light-emitting unit 1 has one of a plurality of light-emitting chips 30, and a plurality of structural reinforcement parts 60 in each light-emitting unit 1 are arranged outside the encapsulation adhesive layer 40. For clear description, only one light-emitting unit 1 is shown in step S26. Through the arrangement of a plurality of structural reinforcement parts 60, the reflective cover plate 50 is not easy to fall off, so that each light-emitting unit 1 can maintain stable lateral light emission and avoid uneven brightness.

That is, in the first embodiment, before the step of providing the reflective cover 50 on the reflective layer 20, the encapsulant layer 40 is first disposed on the reflective layer 20. In the second embodiment, after the step of providing the reflective cover plate 50 on the reflective layer 20, an encapsulant layer 40 is filled between the reflective layer 20 and the reflective cover plate 50, and the encapsulant layer 40 is filled in each structural reinforcement 60 between.

Regardless of the light-emitting unit manufacturing methods described in the first and second embodiments, the side of each structural reinforcement 60 facing away from the light-emitting chip 30 is the first plane 61, and the first plane 61 can be aligned with the side surface of the encapsulant layer 40 Flat; wherein, the first plane 61 can be respectively connected with the side of the reflective layer 20 and the side of the reflective cover 50 They are flush, and a plurality of structural reinforcement parts 60 surround the light-emitting chip 30 with the light-emitting chip 30 as a reference, respectively. Furthermore, the plurality of structural reinforcements 60 can only contact the reflective layer 20, only the reflective cover 50, or contact the reflective layer 20 and the reflective cover 50 at the same time according to actual needs. Of course, other contact situations are also possible, and are not limited to The scope of the present invention. In addition, in one embodiment, when a plurality of structural reinforcements 60 can extend from the reflective layer 20, and the structural reinforcements 60 can contact the reflective cover 50, the skew of the reflective cover 50 can be avoided when the reflective cover 50 is disposed, and the reflective cover can be ensured The plate 50 is substantially parallel to the substrate 10.

In summary, the light-emitting unit and the manufacturing method of the present invention, through the arrangement of a plurality of structural reinforcements 60, make the reflective cover 50 not easy to fall off, so that each light-emitting unit can maintain stable lateral light emission, and avoid uneven brightness. . In conclusion, the light-emitting unit and the manufacturing method thereof of the present invention have the above-mentioned advantages, thereby enhancing the stability of the reflective cover.

The above descriptions are merely illustrative and not restrictive. Any equivalent modifications or alterations that do not depart from the spirit and scope of the present invention should be included in the scope of the appended patent application.

10: substrate

20: reflective layer

21: containment area

30: Light-emitting chip

40: Encapsulation adhesive layer

41: side

50: reflective cover

60: Structural Strengthening Department

61: First plane

C: Corner

Claims (15)

A light-emitting unit, comprising: a substrate; a reflective layer arranged on the substrate and having an accommodating area; a light-emitting chip arranged in the accommodating area; an encapsulant layer covering the light-emitting chip; A cover plate is arranged on the encapsulation adhesive layer, the encapsulation adhesive layer is between the reflective layer and the reflective cover plate, and the encapsulation adhesive layer connects the reflective layer and the reflective cover plate; and a plurality of structural reinforcement parts, configured On the outside of the encapsulating glue layer and exposing one side of the encapsulating glue layer, and the exposed side of the encapsulating glue layer is connected to the reflective layer and the reflective cover plate, the structural reinforcements are formed by the reflective layer and the reflective cover. One of the reflective cover plates extends and extends toward the other of the reflective layer and the reflective cover plate; wherein the reflectivity of the reflective cover plate is greater than the light transmittance of the reflective cover plate, and the light transmittance of the reflective cover plate The rate must be greater than 0. According to the light-emitting unit described in item 1 of the scope of patent application, one of the structural reinforcement portions is located at a corner of the encapsulant layer. According to the light-emitting unit described in claim 1, wherein one of the structural reinforcement portions is located on a side surface of the encapsulation adhesive layer and between two corners of the encapsulation adhesive layer. According to the light-emitting unit described in claim 1, wherein the side of each structural reinforcement portion facing away from the light-emitting chip is a first plane, and the first plane is flush with the side surface of the encapsulant layer. For the light-emitting unit described in item 4 of the scope of patent application, the first plane and the reflective One side of the layer is flush with one side of the reflective cover plate. As for the light-emitting unit described in item 1 of the scope of patent application, the surface of each structural reinforcement part embedded in the encapsulant layer is an arc surface. For the light-emitting unit described in item 1 of the scope of patent application, each structural reinforcement part is a square pillar. According to the light-emitting unit described in item 1 of the scope of patent application, one of the structural reinforcement portions simultaneously contacts the reflective layer and the reflective cover plate. According to the light-emitting unit described in claim 1, wherein the structural reinforcement portions extend from one of the reflective layer and the reflective cover plate, and each of the structural reinforcement portions faces the reflective layer and the reflective layer with a narrower top. Another extension of the reflective cover plate. According to the light-emitting unit described in item 1 of the scope of patent application, the structural reinforcement portions extend from the reflective cover plate and extend toward the reflective layer. A method for manufacturing a light-emitting unit includes: providing a reflective layer on a substrate, and the reflective layer has a plurality of accommodating areas; providing a plurality of light-emitting chips, the light-emitting chips are respectively arranged in the accommodating areas; Provide an encapsulant layer to cover the light-emitting chips; and provide a reflective cover on the reflective layer; wherein, a plurality of structural reinforcements extend from one of the reflective layer and the reflective cover and face the reflective The other extension of the reflective cover and the reflective cover, the encapsulant layer is between the reflective layer and the reflective cover, and the structural reinforcements are embedded in the encapsulant to provide the reflective cover on the reflective After the step of layering, the encapsulation adhesive layer is filled between the reflective layer and the reflective cover plate, and the encapsulation adhesive layer is filled between the structural reinforcement parts. The method of manufacturing a light-emitting unit as described in item 11 of the scope of patent application, wherein the In the step of placing the reflective cover plate on the reflective layer, the reflective cover plate extends out of the structural reinforcement portions and contacts the reflective layer. According to the method for manufacturing the light-emitting unit described in item 11 of the scope of patent application, the reflective layer extends out of the structural reinforcement portions and contacts the reflective cover plate. The method for manufacturing the light-emitting unit described in claim 11, wherein after the step of embedding the structural reinforcement parts in the encapsulation layer, the substrate, the reflective layer, the encapsulation layer, and the reflective cover are cut And the structural reinforcement parts to form a plurality of separated light-emitting units, each of the light-emitting units has one of the light-emitting chips, and the structural reinforcement parts in each of the light-emitting units are disposed on the outside of the encapsulant layer. The method for manufacturing a light-emitting unit as described in claim 14, wherein after the steps of cutting the substrate, the reflective layer, the encapsulant layer, the reflective cover and the structural reinforcements, each light-emitting unit The side of each structural reinforcement portion facing away from the light-emitting chip is a first plane, and the first plane is flush with a side surface of the encapsulant layer.

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