CN101627255A - Illuminating apparatus - Google Patents
Illuminating apparatus Download PDFInfo
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- CN101627255A CN101627255A CN200880007439A CN200880007439A CN101627255A CN 101627255 A CN101627255 A CN 101627255A CN 200880007439 A CN200880007439 A CN 200880007439A CN 200880007439 A CN200880007439 A CN 200880007439A CN 101627255 A CN101627255 A CN 101627255A
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- light
- reflection part
- illuminating apparatus
- emitting component
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/18—Edge-illuminated signs
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0051—Diffusing sheet or layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0053—Prismatic sheet or layer; Brightness enhancement element, sheet or layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/06—Reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/062—Light conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Abstract
To provide an illuminating apparatus which is thinly configured and capable of efficiently guiding light emitted from a light emitting element to surrounding areas. [MEANS FOR SOLVING PROBLEMS] A recessed section (3) is formed on a substrate (2), a bare chip (4) of a light emitting diode is mounted in the recessed section (3); and the bare chip (4) and a conductive section on the substrate (2) are connected by conductive lines (5, 5). On the surface of the substrate (2), a second reflecting member (12), a supporting member (13), and a first reflecting member (11) are assembled, and a core layer (15) is formed by having a liquid synthetic resin flow and cure between the bare chip (4) and the first reflecting member (11). An interval between the bare chip (4) and the first reflecting member (11) is constantly kept fixed by the supporting member (13). Light emitted from the bare chip (4) enters a core layer (15), is reflected by reflecting surfaces (11a, 12a), and is guided to the surrounding areas.
Description
Technical field
The present invention relates to a kind of illuminating apparatus that illuminates various electronic equipment operating portions etc., relate in particular to the illuminating apparatus that can form thin type structure and can transmit light that light-emitting component sends effectively.
Background technology
On various electronic equipments such as stereo set and portable electric appts, be provided with and guide the light that light-emitting device sent such as LED on the operating surface light guide member.Utilization drawn light in the above-mentioned light guide member illuminate the action button that is located on the operating surface, by the fixedly literal of mint-mark on operating surface or the display part of numeral.
In the illuminating apparatus in the past shown in the following patent literature 1, in the rear side of electronic equipment operating surface the light guide member that forms with resin plates such as acrylic panels is installed, light-emitting device is mutually opposed in the side of this light guide member.The light that light-emitting device sent from the end face of light guide member to the incident of the inside of light guide member, bright action button of illumination in the infiltration light guide member and display part etc.And, as light-emitting device, adopted in the light conductivity housing, deposit have lighting function semiconductor bare chip after packed light-emitting device.
In the illuminating apparatus in the past shown in the following patent literature 2, the transparent bodies that forms with transparent plastic material overlaps on the light-emitting device that has encapsulated bare chip, and is provided with the surface of emission of inclined plane shape on transparent bodies with the opposed part of above-mentioned light-emitting device.In this illuminating apparatus, after the light that light-emitting device sent incides in the transparent bodies, in transparent bodies, propagate in surface of emission reflection.
Patent documentation 1:(Japan) spy opens the 2004-22381 communique
Patent documentation 2:(Japan) spy opens the 2006-148132 communique
In illuminating apparatus in the past, light guide member constitutes by transparent plastic plate or formed body, and light-emitting device has adopted the structure of depositing led chip in encapsulation.Therefore, the integral thickness size of illuminating apparatus just becomes big.And, because adopted the light that light-emitting device is sent to incide structure on the plastics system leaded light parts from the outside, so just very low to the utilization ratio of the light that chip sends in the light-emitting device.
Summary of the invention
The present invention proposes in order to solve above-mentioned problem in the past, and its purpose is, provides a kind of comparing with illuminating apparatus in the past can form thin type structure and the high illuminating apparatus of light utilization ratio.
Illuminating apparatus of the present invention is provided with: substrate; Light-emitting component is installed on the aforesaid substrate; And optical waveguide layer, be arranged on the aforesaid substrate and guiding from the light that above-mentioned light-emitting component sent,
This illuminating apparatus is characterised in that, be provided with reflection part and holding components, this reflection part and at least a portion of reflecting light that above-mentioned light-emitting component send mutually opposed with above-mentioned light-emitting component, this support unit is at the above-mentioned reflection part of position upper support of keeping at a distance with above-mentioned light-emitting component.
Illuminating apparatus of the present invention is provided with light-emitting component and reflection part, on substrate, be provided with this light-emitting component, this reflecting element is mutually opposed with this light-emitting component, and support unit supports this reflection part makes the reflection part can be mutually opposed across certain distance with light-emitting component.Therefore, can make whole illuminating apparatus form thin type structure, and, even external force acts on from the top, also can be under the state that guarantees reliably between light-emitting component and the reflection part at interval, with light that light-emitting component sent in the reflection part reflection and guide in the optical waveguide layer.Therefore, can form Lacquer finish device slim and that the light utilization ratio is good.
In the present invention, above-mentioned luminescent layer between above-mentioned light-emitting component and above-mentioned reflection part, and by above-mentioned reflection part with light that above-mentioned light-emitting component sent to above-mentioned optical waveguide layer internal reflection, be ideal.
As mentioned above, contact with light-emitting component if be arranged to optical waveguide layer, when guiding to the light that light-emitting component sent in the optical waveguide layer so, light loss will be lacked.
For example, above-mentioned support unit is the cylindrical part of erectting from aforesaid substrate, across being interval with a plurality of above-mentioned support units.In this case, the light that spreads in optical waveguide layer just passes between the support unit.
And the present invention can have, and forms many light paths by above-mentioned optical waveguide layer and above-mentioned support unit is configured in the locational structure that departs from above-mentioned light path on substrate.Because support unit is configured on the position of departing from light path, thus just the light that is diffused in the light path by support unit is incurred loss, but also can guarantee the interval between reflection part and the light-emitting component reliably.
In the present invention, on above-mentioned reflection part, be provided with reflecting surface, this reflecting surface tilts with respect to the face direction of the thickness direction of above-mentioned optical waveguide layer and above-mentioned optical waveguide layer and in the face of above-mentioned light-emitting component.For example, above-mentioned reflecting surface has cone shape or pyramid shape, and in the wide-angle scope that is almost 360 degree that with the light-emitting component is the center, the light that light-emitting component sent is introduced in the optical waveguide layer.
And, illuminating apparatus of the present invention makes the above-mentioned support unit of erectting from aforesaid substrate opposed to each other mutually across spaced and parallel of wall shape and the above-mentioned reflection part that connects between a pair of above-mentioned support unit integrally formed, and also can form reflecting surface in the opposite side of the aforesaid substrate of above-mentioned reflection part.
Above-mentioned support unit and reflection part can wait integrally formed roughly cube shaped with synthetic resin.
And, can also make above-mentioned reflecting surface form the concave curve surface shape that caves in to the direction that breaks away from above-mentioned light-emitting component.If reflecting surface is a concave curve surface shape, just the light that light-emitting component is sent have directionality and to concave curved surface towards direction guiding.
The present invention preferably, on the surface of aforesaid substrate, be provided be positioned at above-mentioned light-emitting component around and with opposed the 2nd reflecting surface of above-mentioned reflecting surface, and by the 2nd reflecting surface to above-mentioned optical waveguide layer reverberation.
The present invention makes above-mentioned optical waveguide layer have the covering that sandwich layer and refractive index are lower than this sandwich layer, and above-mentioned sandwich layer also can be sandwiched between covering up and down.
And the resin on the aforesaid substrate is poured into a mould in sclerosis, and forms above-mentioned optical waveguide layer, also can.In this structure, because light-emitting component is embedded in the optical waveguide layer, so can the light that light-emitting component was sent be introduced in the optical waveguide layer with the loss of minimum.
The present invention forms recess on aforesaid substrate, and the above-mentioned light-emitting component of installation is a bare chip in above-mentioned recess.
By in the recess of substrate, bare chip being installed, can form slim illuminating apparatus.And, also form boosting reflector around the above-mentioned bare chip in above-mentioned recess, also can.
In the present invention, reflection part is supported parts carry and can maintains a certain distance with light-emitting component.Therefore,, also can keep the stacked state between light-emitting component, optical waveguide layer and the reflection part, and can reflect the light that light-emitting component sent with reflection part and introduce in the optical waveguide layer reliably even form slim illuminating apparatus.And if use bare chip as light-emitting component, and cast and hardening resin form optical waveguide layer between this light-emitting component and reflection part, so just can form thinner illuminating apparatus.
Description of drawings
Fig. 1 is the cutaway view of the 1st embodiment illuminating apparatus of the present invention;
Fig. 2 is the vertical view of illuminating apparatus shown in Figure 1;
Fig. 3 is the cutaway view of the 2nd embodiment illuminating apparatus of the present invention;
Fig. 4 is the vertical view of illuminating apparatus shown in Figure 3;
Fig. 5 is the cutaway view of expression variation illuminating apparatus;
Fig. 6 is the part vertical view of illuminating apparatus shown in Figure 5;
Fig. 7 is the cutaway view of expression variation illuminating apparatus;
Fig. 8 is the cutaway view of expression variation illuminating apparatus;
Fig. 9 is the cutaway view of expression variation illuminating apparatus;
Figure 10 is the cutaway view of expression variation illuminating apparatus;
Figure 11 is the cutaway view of expression variation illuminating apparatus;
Figure 12 is the cutaway view of the 3rd embodiment illuminating apparatus of the present invention;
Figure 13 is the stereogram of the part-structure of expression illuminating apparatus shown in Figure 12;
Figure 14 is the stereogram of expression the 3rd embodiment illuminating apparatus variation of the present invention.
Mark among the figure
1,1A, 1B, 1C, 1D, 100,200 illuminating apparatus, 2 substrates, 3 recesses, 3a the 1st recess, 3b the 2nd recess, 4 bare chips, 5 leads, 11 the 1st reflection parts, the 11a reflecting surface, 12 the 2nd reflection parts, 12a reflecting surface, 13 support units, 15 sandwich layers, 16 times wraps, 17 upper clad layer, 12d, 18a boosting reflector, 40 optical structures, 41 reflection parts, 42 support units, 43 reflectings surface
The specific embodiment
Fig. 1 is the cutaway view of expression the 1st embodiment illuminating apparatus 1 of the present invention, and Fig. 2 is the vertical view of the above-mentioned illuminating apparatus 1 of expression.
Illuminating apparatus 1 illustrated in figures 1 and 2 is set on the operating surface of miniaturized electronics such as pocket telephone, and the light that is used for that radiated element is sent is guided on the press operating part and illuminated and is arranged on the press operating part or is located at irradiation portion around it.Perhaps be used for light is guided to local irradiation portion, this part irradiation portion shows literal, symbol or the numeral that is arranged on operating surface or the above-mentioned press operating part etc.Perhaps, thus illuminating apparatus 1 also can be exposed to operating surface of mini-plant etc. can be seen from the outside.
" leaded light " that is illustrated as " optical waveguide layer " or " light conductivity " refers to the function that can make light transmission in inside in this manual, its notion not only comprise light transmission near 100% transparent, also comprise light transmission less than 100% translucent." light scattering layer " refers to inner be milky or gonorrhoea look, portion's scattered light also within it when seeing through light, and illuminate the layer of this part.And in this manual " irradiation portion " refers to, when the light time that light source sent that supply constitutes with bare chip, and the part of radiating this light to the outside, it is brighter than other parts that irradiation portion seems.Above-mentioned " light scattering layer " has the function of " irradiation portion ".
As shown in Figure 1, on above-mentioned illuminating apparatus 1, be provided with substrate 2.This substrate 2 is the big material of rigidity, is stacked a plurality of multilager base plates of distinguishing layer 2a, 2b, and the surface of distinguishing layer 2a in the boundary face and the superiors of each differentiation layer forms conductive part.Many places on substrate 2 form recess 3.Recess 3 is with 2 layers of formation, has at downside to distinguish the 1st recess 3a that forms on the layer 2b and remove the 2nd recess 3b that upside is distinguished layer 2a.The 1st recess 3a is positioned at the inside of the 2nd recess 3b, and the aperture area of the 1st recess 3a is less than the aperture area of the 2nd recess 3b.As shown in Figure 2, the flat shape of the 1st recess 3a and the 2nd recess 3b all is circular.
It is light emitting diode bare chip 4 that light-emitting component (light source) is installed in the 1st recess 3a.At illuminating apparatus 1, form above-mentioned recess 3 in the many places of substrate 2, bare chip 4 is installed in the 1st recess 3a of each recess 3.Bare chip 4 is the PN binding element of compound semiconductor, for logical light emitting diode luminous when going up positive current, by selecting the layers of material of compound semiconductor, can send the light of different colours.Bare chip 4 is, do not have the semiconductor of packed light emitting diode itself, and bare chip 4 is fixed on the bottom surface of the 1st recess 3a by bonding agent.
Form pair of conductive portion from the both sides of the 1st recess 3a to the inside of the 2nd recess 3b that extend and be positioned at distinguishing on the layer 2b surface, and make both conductings between the electrode layer by lead 5,5 wire-bonded bare chips 4 and each conductive part for the downside of the substrate 2 of multilager base plate.
Be provided with the 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 on the substrate 2, this support unit 13 is 4 pillars between the 1st reflection part 11 and the 2nd reflection part 12.The 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 are formed by the resin material of transparent (light conductivity) or opaque (light-proofness), are for example formed by allyl resin.
As shown in Figure 2, the flat shape of the 1st reflection part 11 is circular.As shown in Figure 1, the upper surface 11b of the 1st reflection part 11 is the plane, forms reflecting surface 11a at lower surface.Reflecting surface 11a is a cone shape, and the summit of circular cone is positioned on the center of circle of the 1st reflection part 11, and the center of circle of the 1st reflection part 11 is positioned on the circle core shaft of the 1st recess 3a of identical circle.
The 2nd reflection part is circular, has formed through hole 12c in its center of circle.The diameter of the through hole 12c roughly diameter with above-mentioned the 2nd recess 3b is identical.The lower surface 12b of the 2nd reflection part 12 is the plane, forms reflecting surface 12a at upper surface.Reflecting surface 12a is the part on circular cone inclined-plane.The virtual vertex on this circular cone inclined-plane is arranged in above-mentioned through hole 12c in the heart.
The reflecting surface 12a of the reflecting surface 11a of the 1st reflection part 11 and the 2nd reflection part 12 is positioned on the circular cone inclined-plane, and tilts with respect to the thickness direction of illuminating apparatus 1 and the surface direction of illuminating apparatus 1.And, reflecting surface 11a and reflecting surface 12a with the center of bare chip 4 serve as axle and towards around all directions.
Between the reflecting surface 12a of the reflecting surface 11a of the 1st reflection part 11 and the 2nd reflecting surface 12, fix 4 support units 13.Each support unit 13 is cylinder or corner post, and an end of support unit 13 inserts in the aperture that is formed on the 1st reflection part 11 and with bonding agent and is fixed, and the other end inserts in the aperture that is formed on the 2nd reflection part 12 and with bonding agent and is fixed.But, can also make the 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 integrally formed with resin material.
Connect the 1st reflection part 11 and the 2nd reflection parts 12 by above-mentioned support unit 13, can be used as global facility to the 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 and use.And, can pass through above-mentioned support unit 13, make the distance between the reflecting surface 12a of the reflecting surface 11a of the 1st reflection part 11 and the 2nd reflection part 12 can keep certain.As shown in Figure 2, in the opposed zone of reflecting surface 12a of the reflecting surface 11a of the 1st reflection part 11 and the 2nd reflection part 12, the shared area occupation ratio of 4 support units 13 is very little, the light that bare chip 4 is sent can not be subjected to the big loss that support unit 13 is brought between the 1st reflection part 11 and the 2nd reflection part 12, to comprehensive guiding.
On the reflecting surface 12a of the reflecting surface 11a of the 1st reflection part 11 and the 2nd reflection part 12, form reflectance coating.Reflectance coating is, the metal film that forms with methods such as application, plating or coating by vaporizations.Perhaps, wait the mode that forms white films to constitute reflectance coating with application.And above-mentioned reflectance coating is the light conductivity resin bed of transparent grade, can form reflectance coating with the material that absolute index of refraction is lower than sandwich layer 15, and this sandwich layer 15 is the optical waveguide layer between reflecting surface 11a and reflecting surface 12a.Also can on reflecting surface 11a, 12a, coat liquid resin agent such as bonding agent and form this resin bed.
Form reflectance coating if be lower than the material of sandwich layer 15 with refractive index, be introduced in the sandwich layer 15 with the incidence angle that satisfies total reflection condition from bare chip 4 so and incide light on reflecting surface 11a, the 12a just to sandwich layer 15 internal reflections.For example, if the 1st reflection part 11 and the 2nd reflection part 12 are the light conductivity material, the light that satisfies total reflection condition so just reflexes in the sandwich layer, but the light that does not satisfy total reflection condition incides the penetration film in the 1st reflection part 11 and the 2nd reflection part 12.Utilize this principle, the part of the light that can be sent at reflecting surface 11a reflection bare chip 4, and other light are incided in the reflection part 11 illuminates the circumference of the 1st reflection part 11 etc. as irradiation portion.
As shown in Figure 1, optical waveguide layer between the 1st reflection part 11 and the 2nd reflection part 12 is that sandwich layer 15 is filled in the 1st recess 3a that is formed on the substrate 2 and the inside of the 2nd recess 3b, and bare chip 4 and be embedded in the above-mentioned sandwich layer 15 with the lead 5,5 that the mode of wire-bonded connects up.In the zone that the 2nd reflection part 12 is not set, between the surface of substrate 2 and sandwich layer 15, be provided with wrap 16 down.The upper surface 11b of the upper surface 15a of sandwich layer 15 and the 1st reflection part 11 is same, forms upper clad layer 17 on the upper surface 11b of the upper surface 15a of sandwich layer 15 and the 1st reflection part 11.The light conductivity synthetic resin material that is lower than sandwich layer 15 with absolute index of refraction forms down wrap 16 and upper clad layer 17.In the light in entering sandwich layer 15, only come the light of incident to be reflected in the boundary face of each covering 16,17 with the incidence angle that satisfies total reflection condition.
Liquid resin is circulated into down on the wrap 16 and by luminous energy such as heat treatment or ultraviolet rays hardens, thereby form sandwich layer 15.Following wrap 16 and upper clad layer 17 form to form the mode of hardening by heat treatment or ultraviolet ray irradiation after the liquid resin layer similarly.Perhaps, also can coat the resin material that pressure sensitive adhesive layer etc. has viscosity and form down wrap 16 and upper clad layer 17.When forming upper clad layer 17, on upper clad layer 17, light conductivity film of synthetic resin such as PET are set, by upper clad layer 17 bonding this cover body layer and sandwich layers 15 as bonding agent as the cover body layer with pressure sensitive adhesive layer.
Preferably use elastomer (elastomer) to form above-mentioned sandwich layer 15.The elastomer here is transparent or translucent light conductivity synthetic rubber.For example, this light conductivity synthetic rubber is a silicon rubber.Silicon rubber is to constitute main chain with siloxanes in conjunction with (Si-O-Si), and hold the wire polymer of organic substituents such as methyl, phenyl, vinyl on side chain.If form sandwich layer 15, when the strength from the outside affacts illuminating apparatus 1, just can on sandwich layer 15, not produce the equivalent damage that splits so with the light conductivity elastomer.And, can also protect bare chip 4 and lead 5,5, when power during, just be difficult to take place bare chip breakage or lead 5,5 wirings by problems such as broken strings from external action.
When making this illuminating apparatus 1, with the state that the 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 assembled, perhaps with the 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 with the synthetic resin material form one state, the 2nd reflection part 12 is located at substrate 2 surfaces goes up and fix with bonding agent.
Then, in the wrap 16, supply and sclerosis liquid resin form sandwich layer 15 on following wrap 16 and in the gap between the 1st reflection part 11 and the 2nd reflection part 12 under forming.In this manufacture method, because guarantee gap between the 1st reflection part 11 and the 2nd reflection part 12, so can pour into liquid resin in the gap between the 1st reflection part 11 and the 2nd reflection part 12 reliably with support unit 13.Therefore, can in above-mentioned gap, not produce and form sandwich layer 15 under the situation in space.
And; make soft sandwich layer 15 distortion even after making, apply external force from the outside; also can make between the 1st reflection part 11 and the 2nd reflection part 12 and between the 1st reflection part 11 and the bare chip 4 to maintain a certain distance, can protect bare chip 4 and lead 5,5 from external force.
At this illuminating apparatus 1, because bare chip 4 is embedded in the sandwich layer 15, so the light that bare chip 4 is sent is inciding in the sandwich layer 15 with less loss.The light that incides in the sandwich layer 15 is reflected at the reflecting surface 11a of the 1st reflection part 11, also the reflecting surface 12a at the 2nd reflection part is reflected, enter the sandwich layer 15 that is positioned at around it, by total reflection light is guided in the boundary face between sandwich layer 15 and the following wrap 16 and the boundary face between sandwich layer 15 and the upper clad layer 17 and be positioned at irradiation portion on every side.
In addition, under the situation that forms the 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 respectively, on substrate 2, install after the bare chip 4, the 2nd reflection part 12 is adhesively fixed on the surface of substrate 2, assembling support unit 13 also can be assembled reflection part 11 then on support unit 13 on the 2nd reflection part 12.In this case, formerly assemble after the 2nd reflection part 12 and the support unit 13, also can pour into the resin that forms following wrap 16 and sandwich layer 15, and before hardening of resin, assemble the 1st reflection part 11.
Fig. 3 is the cutaway view of expression the 2nd embodiment illuminating apparatus 100 of the present invention, and Fig. 4 is its vertical view.Fig. 3 is, the cutaway view when having cut off with the tangent line shown in the III-III in Fig. 4.At the illuminating apparatus of following each embodiment, it is elaborated to having enclosed same tag with the part of illuminating apparatus 1 same structure illustrated in figures 1 and 2, having omitted.
In Fig. 3 and illuminating apparatus 100 shown in Figure 4, bare chip 4 is installed in the 1st recess 3a on being formed at substrate 2.The 1st reflection part the 11, the 2nd reflection part 12 and support unit 13 assembled being arranged on the substrate 2 afterwards.As shown in Figure 3, filled sandwich layer 15 in the zone of clamping by the 1st recess 3a, the 2nd recess 3b and the 1st reflection part 11 of substrate 2.This sandwich layer 15 is the elastomer of high index of refraction, hardens after being filled with liquid condition.
As shown in Figure 4, the part of the periphery of the 2nd recess 3b, 4 directions are embedded in the zoning layer 16a, and the part of being clamped by zoning layer 16a and zoning layer 16a becomes light path 20.Light path 20 extends to 4 directions with the direction of mutually orthogonal.In each light path 20, be provided with sandwich layer 15, be provided with down wrap 16 and be provided with upside covering 17 at upside at the downside of sandwich layer 15 as optical waveguide layer.The light conductivity resin material that is lower than sandwich layer 15 with absolute index of refraction forms above-mentioned zoning layer 16a.
Send and incide the light of sandwich layer 15 from bare chip 4, be reflected and be introduced in the light path 20 in boundary face with the wall of opposed zoning layer 16a, in light path 20,, in light path 20, advance being reflected with the boundary face of following wrap 16 with the boundary face of above-mentioned covering 17.
The light that bare chip 4 is sent is reflected at the reflecting surface 11a of the 1st reflection part 11 and the reflecting surface 12a of the 2nd reflection part 12, is introduced in each light path 20.Therefore, light is admitted in the light path 20 efficiently, makes light be introduced to 4 directions and poly-to irradiation portion along light path 20.
As shown in Figure 4, the support unit 13 that connects between the 1st reflection part 11 and the 2nd reflection part 12 is positioned at zoning layer 16a, and reflection part 12 is not positioned at light path 20.Therefore, support unit 13 can not cover the light that advances in light path 20.
At this illuminating apparatus 100, assembling the 2nd reflection part 12 and support unit 13 on substrate 2.Form bottom covering 16 in the periphery of the 2nd reflection part 12 then, come zoning with the barrier layer in the above and form the wiring pattern of low refractive index resin layer and form zoning layer 16a.Then, on the zone of clamping, the 1st recess 3a and the 2nd recess 3b, pour into liquid resin and harden formation sandwich layer 15 by zoning layer 16a.At last, assemble the 1st reflection part 11, and then form upper clad layer 17.
Fig. 5 to Figure 11 represents the variation of the 1st embodiment illuminating apparatus 1.But, can similarly constitute the variation of the 2nd embodiment illuminating apparatus 100.
At illuminating apparatus 1A shown in Figure 5, be provided with auxiliary reflection part 18 in the inside that is formed at the 2nd recess 3b on the substrate 2.Should auxiliary reflection part 18 be to distinguish at the upper surface of distinguishing layer 2b as substrate 2 downsides of multilager base plate and upside and supply with refractive index between the inner face of layer 2a hole and be lower than the light conductivity material of sandwich layer 15 and harden and the parts that form.The surface of auxiliary reflection part 18 is boosting reflector 18a, and this boosting reflector 18a is positioned at the outer circumferential side of bare chip 4 and consistent with the part on circular cone inclined-plane.
Fig. 6 is the expansion vertical view of substrate 2 recesses 3 on the illuminating apparatus 1A shown in Figure 5.In the 2nd recess 3b, do not form auxiliary reflection part 18 in the left and right sides of Fig. 6, the upper surface of distinguishing layer 2b at substrate 2 downsides of its part forms conductive part 21,21.And, connected electrode layer and each conductive part 21,21 of bare chip 4 with lead 5,5.As mentioned above, because auxiliary reflection part 18 is not set on the wiring part of lead 5,5, so can guarantee the wire-bonded zone of lead 5,5.
At this illuminating apparatus 1A, in sandwich layer 15, send and be reflected and turn back to light in the 2nd recess 3b from bare chip 4 at the reflecting surface 11a of the 1st reflection part 11, can therefore can further improve light utilization efficiency at boosting reflector 18a to sandwich layer 15 internal reflections.
At illuminating apparatus 1B shown in Figure 7, identical with illuminating apparatus 1 shown in Figure 1, the 2nd reflection part 12 is set on substrate 2.On the upper surface of the 2nd reflection part 12, form reflecting surface 12a.The part of the 2nd reflection part 12 extend in the 2nd recess 3b that is formed on the substrate 2.The hole, center of the 2nd reflection part 12 becomes the part on circular cone inclined-plane, and the inner peripheral surface in this hole, center becomes boosting reflector 12d.The part of boosting reflector 12d is positioned at the inside of the 2nd recess 3b.
In illuminating apparatus 1B shown in Figure 7, also can be reflected and turn back to light in the 2nd recess 3b with the reflecting surface 11a that boosting reflector 12d is reflected in the 1st reflection part 11.
Illuminating apparatus 1C shown in Figure 8 is provided with light scattering layer 23 above the 1st reflection part 11, in the part of light scattering layer 23 upper clad layer 17 is not set.Light scattering layer 23 is that filler mixes in the light conductivity resin material and can be at the layer of inner irregular reflection light.Perhaps, also can form light scattering layer 23 with milky synthetic resin material.The 1st reflection part 11 is transparent, forms the reflectance coating of refractive index a shade below sandwich layer 15 on reflecting surface 11a.Perhaps, the refractive index resin material that is lower than sandwich layer 15 directly forms the 1st reflection part itself.
In the middle of the light that in sandwich layer 15, sends from bare chip 4, the composition that incides with the angle that satisfies total reflection condition on the reflecting surface 11a of the 1st reflection part 11 is returned in the sandwich layer 15 in reflecting surface 11a total reflection, but incides the inside of the 1st reflection part 11 after the light transmission reflecting surface 11a with the angle incident of not satisfying total reflection condition.Then, this light is provided in the light scattering layer 23, illuminates light scattering layer 23.By above-mentioned scattering layer 23 is set, can use being used as irradiation portion with bare chip 4 opposed zones.
In addition, can not constitute the 1st reflection part 11 and light scattering layer 23 with different parts yet, but integrally formed.
At illuminating apparatus 1D shown in Figure 9, between the 1st reflection part 11 and the upper clad layer on it 17, form reflectance coating 24.Mode with application, plating or coating by vaporization metal film on the upper surface 11b of the 1st reflection part 11 forms this reflectance coating 24.Perhaps, also can with refractive index ratio light conductivity the 1st reflection part 11 also will be low the light conductivity resin bed form reflectance coating 24, also can.
At illuminating apparatus 1D shown in Figure 9, in the middle of the light that in sandwich layer 15, sends from bare chip 4, with the angle that satisfies total reflection condition incide light on the reflecting surface 11a at reflecting surface 11a by total reflection, incide the inside that light on the reflecting surface 11a then enters the 1st reflection part 11 with the angle that does not satisfy total reflection condition.But the light that enters in the 1st reflection part 11 is reflected and turns back in the 1st reflection part 11 at reflectance coating 24, reenters to be mapped in the sandwich layer 15.
At illuminating apparatus 1D shown in Figure 9, sandwich layer 15 and upper clad layer 17 are transparent, even this part appears on the operating surface of device etc., also can prevent by bare chip 4 opposed positive can brightening by local extremes, around light can being guided to.
Illuminating apparatus 1E shown in Figure 10 is equivalent to remove the part of downside the 2nd reflection part 12 in the illuminating apparatus 1 of the 1st embodiment illustrated in figures 1 and 2.At illuminating apparatus 1E shown in Figure 10, the lower end of cylindrical support parts 13 is inserted in the aperture of substrate 2 surperficial upper sheds, and is fixed with bonding agent.In this case, the 1st reflection part 11 and support unit 13 also can be for making up the parts that different parts form, and also can be the integrally formed parts of the 1st reflection part 11 and support unit 13.By support unit 13, can make between the reflecting surface 11a of substrate 2 surface and the 1st reflection part 11 to maintain a certain distance, can also make between bare chip 4 and the reflecting surface 11a to maintain a certain distance.
And at illuminating apparatus 1E, on the part of fixed bearing parts 13 lower ends, wrap 16 is also passable under being provided with on the surperficial 2d of substrate 2.Under the situation of wrap 16, reflectance coating not being set on the 2d of this surface under being provided with on the 2d of this surface, is comparatively ideal.Similarly form this reflectance coating with the reflectance coating that is formed on the reflecting surface 11a.And, also can on surperficial 2d, form the electrode layer (metal level) that connects by lead 5, and this electrode layer is used as reflectance coating use with large tracts of land.
At illuminating apparatus 1F shown in Figure 11, form optical waveguide layer 115 and sandwich layer 15 with different media (medium), this optical waveguide layer 115 is configured between bare chip 4 and the 1st reflection part 11, and this sandwich layer 15 is for being arranged at this optical waveguide layer 115 optical waveguide layer on every side.In the embodiment of Figure 11, at the downside of the 1st reflection part 11 optical waveguide layer 115 is set, in zone in addition, forming the sandwich layer 15 identical down between wrap 16 and the upper clad layer 17 with the respective embodiments described above.Because the light that bare chip 4 is sent is introduced in the sandwich layer 15 from optical waveguide layer 115, so that the refractive index of optical waveguide layer 115 is lower than the refractive index of sandwich layer 15, be comparatively desirable.
And, also can make the part of above-mentioned optical waveguide layer 115 form the cavity, form this optical waveguide layer 115 with air.On the recess 3 of substrate 2, pour into the resin liquid body after the configuration mask and form wrap 16 and sandwich layer 15 down, after hardening of resin, remove mask and form blank part, just can finish said structure.In this case, though the top of bare chip 4 is the cavity, because with support unit 13 supportings the 1st reflection part 11, so, also can protect bare chip 4 by enough the 1st reflection parts 11 even external force acts on from the top.
In addition, in the respective embodiments described above, also can make the flat shape of the 1st reflection part 11 and the 2nd reflection part 12 have polygonals such as quadrangle, make reflecting surface 11a and reflecting surface 12a have pyramid shape.
Figure 12 is the cutaway view of expression the 3rd embodiment illuminating apparatus 200 of the present invention, and Figure 13 is the stereogram of the part-structure of expression illuminating apparatus 200.
At this illuminating apparatus 200, on substrate 2, form recess 3, with fixing and installation bare chip 4 this recess 3 in such as bonding agent.Though wrap 16 under the surface of substrate 2 forms, at recess 3 and wrap 16 under the shortcoming on every side thereof, and at wrap 16 formation hole 16b of portion down.Form conductive part 31,31 on substrate 2 surfaces in the 16b of this hole portion, connect between the electrode layer and each conductive part 31,31 of bare chip 4 with lead 5,5.
In the above-mentioned hole 16b of portion, substrate 2 is provided with optical structure 40.Form this optical structure 40 with light conductivity synthetic resin.At optical structure 40, reflection part 41 and support unit 42,42 are integrally formed, this reflection part 41 is in from bare chip 4 on the position of distance, and this support unit 42,42 forms smooth wall portion and mutually opposed in parallel to each other down from the both ends of this reflection part 41.By on substrate 2 with the lower end of method fixed bearing parts 42,42 such as bonding, bare chip 4 and reflection part 41 are maintained a certain distance.
The lower surface of reflection part 41 be formed among Fig. 1 towards about reflecting surface 43,43.This reflecting surface 43,43 is towards the concave curved surface of the direction depression that breaks away from bare chip 4, is the part of barrel surface.Form reflectance coating on this reflecting surface 43,43, this reflectance coating is the resin bed that metal film or refractive index are lower than sandwich layer 15.In addition, make with vertical wall be that support unit 42,42 opposed inner faces become sidepiece reflecting surface 42a, 42a, and similarly on this sidepiece reflecting surface 42a, 42a, form reflectance coating with above-mentioned reflecting surface 43,43, be comparatively desirable.
As shown in figure 12, forming sandwich layer 15 between recess 3 and the reflection part 41 and on following wrap 16, and form upper clad layer 17 on sandwich layer 15, this sandwich layer 15 is for pouring into the elastomer that liquid resin is hardened.
In this illuminating apparatus 200, also can make to keep between bare chip 4 and the reflection part 41 at interval and formation sandwich layer 15 in this interval.Above bare chip 4, the concave curve surface shape reflecting surface 43,43 that is roughly barrel surface is mutually opposed, so incide light in the sandwich layer 15 be reflected face 43,43 reflections and two sides reflection to the left and right effectively from bare chip 4.
Figure 14 represents the illuminating apparatus 200A of the 3rd embodiment variation of the present invention.At this illuminating apparatus 200A, a plurality of bare chips 4 are set in the square-shaped recess 113 on being formed at substrate 2, each bare chip 4 is beneath mutually opposed with reflecting surface 43,43 respectively.A plurality of bare chips 4 also can send the light of same color, also can send the light of the color that has nothing in common with each other.
In addition, in the inside of optical structure 40, be the space between reflecting surface 43,43 and the substrate 2, also above-mentioned sandwich layer 15 can be set at peripheral part of optical structure 40.In this case, as long as bare chip 4, conductive part 31 and lead 5 are set under reflecting surface 43,43, even exert pressure for from the top so optical structure 40, also can guardwire 5 and the connecting portion of conductive part 31.
In the respective embodiments described above, the thickness of following wrap 16, sandwich layer 15 and upper clad layer 17 adds up to below the 200 μ m, preferably is about 100 μ m.The height dimension of bare chip 4 is about 100～350 μ m.
Because above bare chip 4, make the reflection part that is supported parts carry mutually opposed, thus can guarantee the distance between bare chip and the reflection part, and can between bare chip and reflection part, form sandwich layer 15 reliably.And, even the external force effect in use occurs, bare chip 4 and reflecting surface are maintained a certain distance.
Claims (12)
1. an illuminating apparatus is provided with: substrate; Light-emitting component is installed on the aforesaid substrate; And optical waveguide layer, be arranged on the aforesaid substrate and guiding from the light that above-mentioned light-emitting component sent,
It is characterized in that,
Be provided with reflection part and support unit, this reflection part and at least a portion of reflecting light that above-mentioned light-emitting component send mutually opposed with above-mentioned light-emitting component, this support unit is at the above-mentioned reflection part of position upper support of keeping at a distance with above-mentioned light-emitting component.
2. illuminating apparatus according to claim 1 is characterized in that,
Above-mentioned optical waveguide layer is between above-mentioned light-emitting component and above-mentioned reflection part, and the light that above-mentioned light-emitting component sent is reflected in the above-mentioned optical waveguide layer by above-mentioned reflection part.
3. illuminating apparatus according to claim 1 is characterized in that,
Above-mentioned support unit is the cylindrical part that is erected on the aforesaid substrate, across being provided with a plurality of above-mentioned support units at interval.
4. illuminating apparatus according to claim 3 is characterized in that,
On substrate, form many light paths by above-mentioned optical waveguide layer, departing from the above-mentioned support unit of configuration on the position of above-mentioned light path.
5. illuminating apparatus according to claim 1 is characterized in that,
On above-mentioned reflection part reflecting surface is set, this reflecting surface tilts with respect to the face direction of the thickness direction of above-mentioned optical waveguide layer and above-mentioned optical waveguide layer and is mutually opposed with above-mentioned light-emitting component.
6. illuminating apparatus according to claim 1 is characterized in that,
Above-mentioned support unit and above-mentioned reflection part form as one, opposite side at the aforesaid substrate of above-mentioned reflection part forms reflecting surface, this support unit is the support unit of wall shape opposed across spaced and parallel and that erect from aforesaid substrate, and this reflection part connects between a pair of above-mentioned support unit.
7. illuminating apparatus according to claim 6 is characterized in that,
Above-mentioned reflecting surface has the concave curve surface shape to the direction depression of leaving above-mentioned light-emitting component.
8. illuminating apparatus according to claim 5 is characterized in that,
On the surface of aforesaid substrate, be provided be positioned at above-mentioned light-emitting component around and with opposed the 2nd reflection part of the above-mentioned surface of emission, by the 2nd reflection part towards above-mentioned optical waveguide layer reverberation.
9. illuminating apparatus according to claim 1 is characterized in that,
Above-mentioned optical waveguide layer has the covering that sandwich layer and refractive index are lower than this sandwich layer, and above-mentioned sandwich layer is sandwiched between covering up and down.
10. illuminating apparatus according to claim 1 is characterized in that,
Be cast in the hardening of resin on the aforesaid substrate and form above-mentioned optical waveguide layer.
11. illuminating apparatus according to claim 1 is characterized in that,
On aforesaid substrate, be formed with recess, be installed in the above-mentioned recess as the bare chip of above-mentioned light-emitting component.
12. illuminating apparatus according to claim 11 is characterized in that,
In above-mentioned recess, around above-mentioned bare chip, form boosting reflector.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP068782/2007 | 2007-03-16 | ||
| JP2007068782 | 2007-03-16 |
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|---|---|
| CN101627255A true CN101627255A (en) | 2010-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880007439A Pending CN101627255A (en) | 2007-03-16 | 2008-02-27 | Illuminating apparatus |
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| Country | Link |
|---|---|
| JP (1) | JPWO2008114581A1 (en) |
| CN (1) | CN101627255A (en) |
| WO (1) | WO2008114581A1 (en) |
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| CN104566208A (en) * | 2013-10-24 | 2015-04-29 | 鸿富锦精密工业（深圳）有限公司 | Lens and light source module with same |
| CN104676494A (en) * | 2013-11-29 | 2015-06-03 | 鸿富锦精密工业（深圳）有限公司 | Light source module |
| CN106287334A (en) * | 2015-06-05 | 2017-01-04 | 泰金宝电通股份有限公司 | Light source module and full-period light bulb lamp |
| CN111128582A (en) * | 2018-10-31 | 2020-05-08 | 阿尔卑斯阿尔派株式会社 | Illuminating key switch |
| CN111490040A (en) * | 2019-08-22 | 2020-08-04 | 友达光电股份有限公司 | Light emitting unit and method of manufacturing the same |
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| WO2015076592A1 (en) * | 2013-11-22 | 2015-05-28 | 주식회사 루멘스 | Backlight unit, double cone-shaped reflector, double cone-shaped reflector strip, lighting device, and method for manufacturing double cone-shaped reflector |
| KR101563643B1 (en) * | 2013-12-09 | 2015-10-29 | 주식회사 루멘스 | Backlight unit and lighting device |
| KR102498211B1 (en) * | 2018-01-02 | 2023-02-09 | 엘지전자 주식회사 | Car lamp using semiconductor light emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE19700472A1 (en) * | 1997-01-09 | 1998-07-23 | Bosch Gmbh Robert | Lighting unit |
| JP3982174B2 (en) * | 1999-12-09 | 2007-09-26 | 松下電工株式会社 | Light irradiation device |
| JP3539563B2 (en) * | 2001-07-06 | 2004-07-07 | 日立エーアイシー株式会社 | Light-emitting element laminate and display using the same |
| JP2005135815A (en) * | 2003-10-31 | 2005-05-26 | Mitsubishi Electric Corp | Planar light source device and display device using the same |
| JP4081057B2 (en) * | 2004-08-30 | 2008-04-23 | ローム株式会社 | Linear light source device, light guide member used therefor, and image reading device including a linear light source using the light guide member |
| KR100692742B1 (en) * | 2005-05-13 | 2007-03-09 | 삼성전자주식회사 | Keypad having light guide layer and keypad assembly |
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2008
- 2008-02-27 CN CN200880007439A patent/CN101627255A/en active Pending
- 2008-02-27 JP JP2009505108A patent/JPWO2008114581A1/en not_active Withdrawn
- 2008-02-27 WO PCT/JP2008/053364 patent/WO2008114581A1/en active Application Filing
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104566208A (en) * | 2013-10-24 | 2015-04-29 | 鸿富锦精密工业（深圳）有限公司 | Lens and light source module with same |
| CN104676494A (en) * | 2013-11-29 | 2015-06-03 | 鸿富锦精密工业（深圳）有限公司 | Light source module |
| CN106287334A (en) * | 2015-06-05 | 2017-01-04 | 泰金宝电通股份有限公司 | Light source module and full-period light bulb lamp |
| CN111128582A (en) * | 2018-10-31 | 2020-05-08 | 阿尔卑斯阿尔派株式会社 | Illuminating key switch |
| US11710608B2 (en) | 2018-10-31 | 2023-07-25 | Alps Alpine Co., Ltd. | Illuminated push-button switch device |
| CN111490040A (en) * | 2019-08-22 | 2020-08-04 | 友达光电股份有限公司 | Light emitting unit and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008114581A1 (en) | 2008-09-25 |
| JPWO2008114581A1 (en) | 2010-07-01 |
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