TW200629609A - Side-emission type LED package - Google Patents

Side-emission type LED package

Info

Publication number
TW200629609A
TW200629609A TW094146463A TW94146463A TW200629609A TW 200629609 A TW200629609 A TW 200629609A TW 094146463 A TW094146463 A TW 094146463A TW 94146463 A TW94146463 A TW 94146463A TW 200629609 A TW200629609 A TW 200629609A
Authority
TW
Taiwan
Prior art keywords
led chip
led package
emission type
lower structure
type led
Prior art date
Application number
TW094146463A
Other languages
Chinese (zh)
Other versions
TWI294696B (en
Inventor
Young-Sam Park
Hyung-Suk Kim
Jung-Kyu Park
Ho-Sik Ahn
Young-June Jeong
Hun Joo Hahm
Bum Jin Kim
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW200629609A publication Critical patent/TW200629609A/en
Application granted granted Critical
Publication of TWI294696B publication Critical patent/TWI294696B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
TW094146463A 2005-02-03 2005-12-26 Side-emission type led package related application TWI294696B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050010046 2005-02-03
KR1020050044649A KR100649640B1 (en) 2005-02-03 2005-05-26 Side emission type led package

Publications (2)

Publication Number Publication Date
TW200629609A true TW200629609A (en) 2006-08-16
TWI294696B TWI294696B (en) 2008-03-11

Family

ID=37571518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146463A TWI294696B (en) 2005-02-03 2005-12-26 Side-emission type led package related application

Country Status (4)

Country Link
JP (2) JP5419289B2 (en)
KR (1) KR100649640B1 (en)
NL (3) NL1030979C2 (en)
TW (1) TWI294696B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011088709A1 (en) * 2010-01-21 2011-07-28 财团法人工业技术研究院 Module of light influencing element, lighting devices and lighting system
CN111490040A (en) * 2019-08-22 2020-08-04 友达光电股份有限公司 Light emitting unit and method of manufacturing the same

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100757828B1 (en) * 2006-09-28 2007-09-11 서울반도체 주식회사 Whole side viewing led package
KR20100112978A (en) * 2009-04-10 2010-10-20 김덕용 Led lighting apparatus and method for surface emitting of the led lighting apparatus
JP5749555B2 (en) * 2011-04-26 2015-07-15 株式会社エンプラス Luminous flux control member, light emitting device including the luminous flux control member, and surface light source device including the light emitting device
KR101149201B1 (en) * 2011-12-20 2012-05-25 한윤희 Advertisement led module manufacture method and that's goods
KR101398186B1 (en) 2012-11-05 2014-05-23 (주)애니캐스팅 Side emitting light emitting diode lens, back light unit and display device including the same
WO2014069973A1 (en) * 2012-11-05 2014-05-08 주식회사 애니캐스팅 Side emitting led lens, and back light unit and display device having same
CN103335249B (en) * 2013-07-02 2016-04-06 中节能晶和照明有限公司 LED China Landscape Lamp
US10416356B2 (en) * 2014-01-23 2019-09-17 Lumileds, LLC Light emitting device with self-aligning preformed lens
JP7483474B2 (en) 2020-04-15 2024-05-15 株式会社ジャパンディスプレイ Lighting equipment
CN114578614A (en) * 2020-11-30 2022-06-03 华为技术有限公司 Backlight module and display screen

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5977249U (en) * 1982-11-16 1984-05-25 日本電気株式会社 Lateral output light emitting diode device
JPH073154U (en) * 1993-06-01 1995-01-17 株式会社アドビック Light emitting diode, light reflecting member, and warning light
JPH0918058A (en) * 1995-06-29 1997-01-17 Sharp Corp Semiconductor light-emitting device
JP2001076513A (en) * 1999-09-07 2001-03-23 Stanley Electric Co Ltd Vehicular lighting fixture
JP4082544B2 (en) * 1999-12-24 2008-04-30 ローム株式会社 Back-mounted chip light-emitting device
JP2001185752A (en) * 1999-12-24 2001-07-06 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device and optical signal input/output device using the same
KR20020080834A (en) * 2001-04-18 2002-10-26 (주)옵토니카 L.E.D. light projecting apparatus and method of fabricating the same
JP4239565B2 (en) * 2002-03-20 2009-03-18 豊田合成株式会社 Light emitters and lights
US6679621B2 (en) * 2002-06-24 2004-01-20 Lumileds Lighting U.S., Llc Side emitting LED and lens
JP3715635B2 (en) * 2002-08-21 2005-11-09 日本ライツ株式会社 Light source, light guide and flat light emitting device
KR20040024747A (en) * 2002-09-16 2004-03-22 주식회사 티씨오 A High brightness light emitting diode and its method of making
JP4182784B2 (en) * 2003-03-14 2008-11-19 豊田合成株式会社 Light emitting device and manufacturing method thereof
JP2005026503A (en) * 2003-07-03 2005-01-27 Matsushita Electric Ind Co Ltd Semiconductor light emitting device and its manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011088709A1 (en) * 2010-01-21 2011-07-28 财团法人工业技术研究院 Module of light influencing element, lighting devices and lighting system
CN111490040A (en) * 2019-08-22 2020-08-04 友达光电股份有限公司 Light emitting unit and method of manufacturing the same
TWI743540B (en) * 2019-08-22 2021-10-21 友達光電股份有限公司 Light-emitting unit and manufacturing method thereof
CN111490040B (en) * 2019-08-22 2022-04-19 友达光电股份有限公司 Light emitting unit and method of manufacturing the same

Also Published As

Publication number Publication date
NL2007703C2 (en) 2013-02-27
NL2007703A (en) 2012-01-16
NL2007700A (en) 2012-01-16
KR100649640B1 (en) 2006-11-27
TWI294696B (en) 2008-03-11
JP2010251785A (en) 2010-11-04
KR20060090149A (en) 2006-08-10
NL1030979A1 (en) 2006-08-07
JP2012009889A (en) 2012-01-12
JP5419289B2 (en) 2014-02-19
JP5467584B2 (en) 2014-04-09
NL1030979C2 (en) 2011-11-09
NL2007700C2 (en) 2013-01-31

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