JP2010045248A - Light-emitting diode - Google Patents

Light-emitting diode Download PDF

Info

Publication number
JP2010045248A
JP2010045248A JP2008209054A JP2008209054A JP2010045248A JP 2010045248 A JP2010045248 A JP 2010045248A JP 2008209054 A JP2008209054 A JP 2008209054A JP 2008209054 A JP2008209054 A JP 2008209054A JP 2010045248 A JP2010045248 A JP 2010045248A
Authority
JP
Japan
Prior art keywords
light
resin
led chip
led
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008209054A
Other languages
Japanese (ja)
Inventor
Teppei Takano
鉄平 高野
Original Assignee
Citizen Electronics Co Ltd
シチズン電子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Electronics Co Ltd, シチズン電子株式会社 filed Critical Citizen Electronics Co Ltd
Priority to JP2008209054A priority Critical patent/JP2010045248A/en
Publication of JP2010045248A publication Critical patent/JP2010045248A/en
Application status is Pending legal-status Critical

Links

Images

Abstract

PROBLEM TO BE SOLVED: To emit visible light only from a side surface of an LED.
A metal pad (not shown) is provided on the upper surface of a circuit board 2 such as an insulating BT resin that constitutes an LED 1 having a wide viewing angle, and an LED chip 3 that emits ultraviolet light is provided on the pad. Die bonded. There is a pair of wiring circuits (not shown) on the surface of the circuit board 2, and the wire bonding connection is made from the electrodes of the LED chip 3 to the wiring circuit by the gold wires 4. A frame 5 having a shape such as a rectangular tube or a cylinder is fixed on the circuit board 2 so as to surround the second bonding region. The frame 5 having an equal thickness L is formed of an epoxy resin or a silicone resin containing a three-color phosphor that is excited in the ultraviolet region. The inside of the frame 5 is filled with a sealing resin 6 made of a translucent resin such as an epoxy resin or a silicone resin.
[Selection] Figure 2

Description

  The present invention relates to a light emitting diode having a wide viewing angle used in a field such as key illumination of a cellular phone.

  An example of a conventional general light emitting diode (hereinafter abbreviated as LED) will be described. FIG. 5 is a plan view showing an example of a conventional LED, and FIG. 6 is a cross-sectional view showing the XX cross section of FIG. 5 and 6, the LED 51 is of a surface mount type in which an LED chip 53 is die-bonded on the circuit board 2 and wired with a gold wire 4 and sealed with a sealing resin 56 containing a phosphor. The distances A, B and C between the LED chip and the outer wall are generally different from each other.

In addition, since LED has high directivity and a narrow viewing angle, it has a drawback that visibility from the front is good but visibility from the side is poor. Therefore, an LED having a wide viewing angle is required for application to a field such as key illumination of a mobile phone. As an LED required in such a field, an LED chip is mounted on a circuit board and a reflective material layer is formed on the upper surface of the sealing resin so that the intensity of front emission is controlled and taken out in the lateral direction. (For example, refer to Patent Document 1).
JP 2004-304041 (FIGS. 1-5, pages 3-4)

  However, when a reflective surface is formed on the upper surface of a conventional general LED, the path length of the light transmitted through the phosphor layer (wavelength conversion layer) differs depending on the emission direction. There is a problem that the length varies depending on the emission direction. For example, when the LED chip 53 emits blue light and the sealing resin 56 includes a YAG phosphor and is adjusted to emit white light upward (C direction), the path The light emitted in the A direction whose length is shorter than the C direction is blue, and the light emitted in the B direction whose path length is longer than the C direction is yellow. Further, when the LED chip 53 emits ultraviolet light and the sealing resin 56 includes a three-color phosphor, the LED chip 53 is adjusted to emit white light upward (C direction). The white light emitted in the lateral direction is not a problem in the A direction, but the path length is darker in the B direction, which is longer than the C direction.

  The present invention has been made to solve such a conventional problem, and an object thereof is to provide an LED having a wide viewing angle from which uniform visible light can be efficiently extracted from the side surface.

  The means of the present invention for achieving the above-described object is a light emitting diode in which an LED chip is mounted on a circuit board and the LED chip is sealed with a light-transmitting resin having different vertical and horizontal lengths. The chip emits ultraviolet light, and a frame body of equal thickness formed of a resin containing a phosphor excited in the ultraviolet region is disposed on the circuit board so as to surround the translucent resin. It is characterized by.

  The phosphor is a three-color phosphor.

  Further, the upper surface of the translucent resin is covered with a reflection sheet.

  Another means of the present invention for achieving the above-described object is to provide a light-emitting diode in which an LED chip is mounted on a circuit board, and the LED chip is sealed with a translucent resin having different vertical and horizontal lengths. The LED chip emits blue light, and on the circuit board is disposed a frame body of equal thickness formed of a resin containing a YAG phosphor so as to surround the translucent resin. The upper surface of the translucent resin is covered with a reflection sheet.

  According to the present invention, an LED chip is mounted on a circuit board, and the LED chip is sealed with a light-transmitting resin having different outer and vertical lengths. The LED chip emits ultraviolet light. The chip is a chip, and a frame body of equal thickness formed of a resin containing a phosphor excited in the ultraviolet region is disposed on the circuit board so as to surround the translucent resin. Because it is out of the area, it is invisible to the human eye. On the other hand, the light emitted from the side surface is excited by the phosphor frame and becomes visible light, which becomes visible to human eyes. Therefore, when this LED is used in a scene such as key illumination of a cellular phone, the viewing angle is widened and the display visibility is improved.

  In addition, since the phosphor is a three-color phosphor, by changing the blending ratio of the phosphor, it is possible to produce not only white but also other colors with high color rendering properties. can get.

  In addition, since the upper surface of the translucent resin is covered with the reflection sheet, the light directed toward the upper surface is reflected and guided toward the side surface, and more efficiently emits light from the side surface to obtain an LED having a wide viewing angle. .

  Further, in a light emitting diode in which an LED chip is mounted on a circuit board and the LED chip is sealed with a light-transmitting resin having different external shapes in length and width, the LED chip emits ultraviolet light, On the circuit board, a frame with an equal thickness formed of a resin containing a phosphor excited in the ultraviolet region is disposed so as to surround the translucent resin, so that no light is emitted from the upper surface, and white is seen from the side. Light can be extracted. Therefore, an LED having a wide viewing angle can be obtained.

  Hereinafter, a wide viewing angle LED which is the best embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing a wide viewing angle LED according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the XX cross section of FIG.

  First, the configuration of the wide viewing angle LED according to the first embodiment of the present invention will be described. 1 and 2, a metal pad (not shown) is provided on the upper surface of a circuit board 2 such as an insulating BT resin that constitutes the LED 1 having a wide viewing angle, and an LED that emits ultraviolet light on the pad. Chip 3 is die-bonded. There is a pair of wiring circuits (not shown) on the surface of the circuit board 2, and the wires from the electrodes of the LED chip 3 to the wiring circuits are connected by wire bonding with gold wires 4. A frame 5 having a rectangular outer shape is fixed on the circuit board 2 so as to surround the second bonding region. The frame 5 having an equal thickness L is formed of an epoxy resin or a silicone resin containing a phosphor that is excited in the ultraviolet region. The inside of the frame 5 is filled with a sealing resin 6 made of a translucent resin such as an epoxy resin or a silicone resin having external shapes with different vertical and horizontal lengths.

  Here, the phosphor excited in the ultraviolet region includes, for example, a three-color phosphor, and is a phosphor that emits three colors of red, blue, and green by excitation of ultraviolet light. The three colors are mixed to emit white light. In addition to the three-color phosphor, the phosphor excited in the ultraviolet region may be a multicolor phosphor containing orange or yellow-green in addition to the three colors in order to improve color rendering. Further, pseudo white light can be emitted by phosphors emitting blue and yellow or red and green.

  Next, the operation of the first embodiment will be described. When a signal current is applied to the wiring circuit, it enters the LED chip 3 via the gold wire 4, and the LED chip 3 emits ultraviolet light. The light emitted toward the front of the LED 1 (upper side in FIG. 2) is ultraviolet light and is not visible to human eyes. On the other hand, the ultraviolet light emitted from the LED chip 3 toward the side surface of the LED 1 is converted into white light by exciting the phosphor when passing through the frame body 5 to be converted into white light. Emitted.

  Next, the effect of the first embodiment of the present invention will be described. The light emitted from the LED chip 3 is not visible because it is ultraviolet light in the front direction of the LED 1, and the light directed toward the side surface of the LED 1 passes through the frame 5 and becomes visible to the human eye. At this time, since the sealing resin 6 is translucent, the transmittance is better than that of the resin containing the phosphor and the light is brighter. Since both the light emitted from the short side of the frame 5 and the light emitted from the long side have the same thickness L, they become uniform visible light having the same chromaticity. Therefore, when the LED 1 is applied to key illumination of a mobile phone, the visibility is improved.

  Next, the configuration of the LED according to the second embodiment of the present invention will be described. FIG. 3 is a plan view of an LED according to a second embodiment of the present invention, and FIG. 4 is a cross-sectional view showing the XX cross section of FIG. In FIG. 3, a reflection sheet 7 made of an aluminum sheet or a sheet having silver deposited on the lower surface covers the upper surface of the translucent resin 6. Since other configurations are the same as those of the LED 1 according to the first embodiment, the same components are denoted by the same reference numerals and names, and detailed description thereof is omitted.

  Next, operations and effects of the second embodiment will be described. The ultraviolet light emitted from the LED chip 3 in the front direction of the LED 11 has a high reflectance on the lower surface of the reflecting sheet 7 and therefore does not travel toward the upper surface, but reflects on the lower surface of the sheet and travels toward the side surface of the LED 11. The ultraviolet light directed toward the side surface from the beginning is reflected and overlapped with the ultraviolet light directed toward the side surface to increase the amount of light, and when passing through the frame 5, the phosphor is excited to be converted into visible light and emitted. Therefore, visible light can be emitted from the side surface of the LED 11 more effectively than the LED 1. Therefore, the effect which stands out more than LED1 can be expected.

  In the first embodiment described above, mounting of the LED chip is not limited to wire bonding, but may be connection by bumps.

  In the second embodiment described above, the LED chip 3 can be replaced with one that emits blue light, and the frame 5 can be replaced with a resin containing a YAG phosphor. In this case, the same effect as that of the second embodiment can be expected.

It is a top view which shows the light emitting diode which is 1st embodiment of this invention. It is a longitudinal cross-sectional view which shows the XX cross section of FIG. It is a top view which shows the light emitting diode which is 2nd embodiment of this invention. It is a longitudinal cross-sectional view which shows the XX cross section of FIG. It is a top view which shows the conventional light emitting diode. It is a longitudinal cross-sectional view which shows the XX cross section of FIG.

Explanation of symbols

1,11 LED
2 Circuit board 3 LED chip 5 Frame 6 Sealing resin 7 Reflective sheet

Claims (4)

  1.   In a light-emitting diode in which an LED chip is mounted on a circuit board and the LED chip is sealed with a light-transmitting resin having different external shapes in length and width, the LED chip emits ultraviolet light, and the circuit board A light emitting diode characterized in that a frame body of equal thickness formed of a resin containing a phosphor excited in the ultraviolet region is disposed so as to surround the translucent resin.
  2.   2. The light emitting diode according to claim 1, wherein the phosphor is a three-color phosphor.
  3.   The light emitting diode according to claim 1 or 2, wherein an upper surface of the translucent resin is covered with a reflection sheet.
  4.   In a light emitting diode in which an LED chip is mounted on a circuit board and the LED chip is sealed with a light-transmitting resin having different external shapes in length and width, the LED chip emits blue light, and the circuit board A frame having an equal thickness formed of a resin containing a YAG phosphor is disposed on the top to surround the translucent resin, and the upper surface of the translucent resin is covered with a reflective sheet. Light emitting diode.
JP2008209054A 2008-08-14 2008-08-14 Light-emitting diode Pending JP2010045248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008209054A JP2010045248A (en) 2008-08-14 2008-08-14 Light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008209054A JP2010045248A (en) 2008-08-14 2008-08-14 Light-emitting diode

Publications (1)

Publication Number Publication Date
JP2010045248A true JP2010045248A (en) 2010-02-25

Family

ID=42016381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008209054A Pending JP2010045248A (en) 2008-08-14 2008-08-14 Light-emitting diode

Country Status (1)

Country Link
JP (1) JP2010045248A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013042095A (en) * 2011-08-19 2013-02-28 Citizen Electronics Co Ltd Semiconductor light emitting device
JP2013089645A (en) * 2011-10-13 2013-05-13 Citizen Electronics Co Ltd Semiconductor light-emitting device and manufacturing method of the same
JP2013143430A (en) * 2012-01-10 2013-07-22 Citizen Holdings Co Ltd Semiconductor light-emitting device, and illuminating device using the same
JP2013197369A (en) * 2012-03-21 2013-09-30 Rohm Co Ltd Light source device and led lamp
JP2013197335A (en) * 2012-03-21 2013-09-30 Kyocera Corp Light emitting device
JP2013251393A (en) * 2012-05-31 2013-12-12 Citizen Electronics Co Ltd Side face irradiation type led light-emitting device and side irradiation type led light-emitting device manufacturing method
US8659043B1 (en) 2013-02-19 2014-02-25 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8933478B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
JP2016527723A (en) * 2013-07-22 2016-09-08 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. Flip chip side-emitting LED
US10043954B2 (en) 2013-11-08 2018-08-07 Citizen Electronics Co., Ltd. Lighting device with a phosphor layer on a peripheral side surface of a light-emitting element and a reflecting layer on an upper surface of the light-emitting element and on an upper surface of the phosphor layer

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257381A (en) * 2000-03-13 2001-09-21 Sharp Corp Light-emitting diode, manufacturing method therefor and illumination device
JP2004304041A (en) * 2003-03-31 2004-10-28 Citizen Electronics Co Ltd Light emitting diode
JP2006339650A (en) * 2005-06-01 2006-12-14 Samsung Electro-Mechanics Co Ltd Side emission led package and its manufacturing process
JP2007180347A (en) * 2005-12-28 2007-07-12 Shinko Electric Ind Co Ltd Light-emitting device and manufacturing method therefor
JP2007201301A (en) * 2006-01-30 2007-08-09 Sumitomo Metal Electronics Devices Inc Light emitting device using white led
JP2008060542A (en) * 2006-08-03 2008-03-13 Toyoda Gosei Co Ltd Light-emitting device, method of manufacturing same, and light source device provided with the same
JP2009267289A (en) * 2008-04-30 2009-11-12 Citizen Electronics Co Ltd Light-emitting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257381A (en) * 2000-03-13 2001-09-21 Sharp Corp Light-emitting diode, manufacturing method therefor and illumination device
JP2004304041A (en) * 2003-03-31 2004-10-28 Citizen Electronics Co Ltd Light emitting diode
JP2006339650A (en) * 2005-06-01 2006-12-14 Samsung Electro-Mechanics Co Ltd Side emission led package and its manufacturing process
JP2007180347A (en) * 2005-12-28 2007-07-12 Shinko Electric Ind Co Ltd Light-emitting device and manufacturing method therefor
JP2007201301A (en) * 2006-01-30 2007-08-09 Sumitomo Metal Electronics Devices Inc Light emitting device using white led
JP2008060542A (en) * 2006-08-03 2008-03-13 Toyoda Gosei Co Ltd Light-emitting device, method of manufacturing same, and light source device provided with the same
JP2009267289A (en) * 2008-04-30 2009-11-12 Citizen Electronics Co Ltd Light-emitting device

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013042095A (en) * 2011-08-19 2013-02-28 Citizen Electronics Co Ltd Semiconductor light emitting device
JP2013089645A (en) * 2011-10-13 2013-05-13 Citizen Electronics Co Ltd Semiconductor light-emitting device and manufacturing method of the same
JP2013143430A (en) * 2012-01-10 2013-07-22 Citizen Holdings Co Ltd Semiconductor light-emitting device, and illuminating device using the same
JP2013197369A (en) * 2012-03-21 2013-09-30 Rohm Co Ltd Light source device and led lamp
JP2013197335A (en) * 2012-03-21 2013-09-30 Kyocera Corp Light emitting device
JP2013251393A (en) * 2012-05-31 2013-12-12 Citizen Electronics Co Ltd Side face irradiation type led light-emitting device and side irradiation type led light-emitting device manufacturing method
US9484509B2 (en) 2012-05-31 2016-11-01 Citizen Electronics Co., Ltd. Lighting device and method of manufacturing the same
US9196801B2 (en) 2012-05-31 2015-11-24 Citizen Electronics Co., Ltd. Lighting device and method of manufacturing the same
US8853729B2 (en) 2013-02-19 2014-10-07 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8754435B1 (en) 2013-02-19 2014-06-17 Cooledge Lighting Inc. Engineered-phosphor LED package and related methods
US8933479B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8933478B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US9142738B2 (en) 2013-02-19 2015-09-22 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US8722439B1 (en) 2013-02-19 2014-05-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
US9425368B2 (en) 2013-02-19 2016-08-23 Cooledge Lighting, Inc. Engineered-phosphor LED packages and related methods
US8659043B1 (en) 2013-02-19 2014-02-25 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
JP2016527723A (en) * 2013-07-22 2016-09-08 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. Flip chip side-emitting LED
US10043954B2 (en) 2013-11-08 2018-08-07 Citizen Electronics Co., Ltd. Lighting device with a phosphor layer on a peripheral side surface of a light-emitting element and a reflecting layer on an upper surface of the light-emitting element and on an upper surface of the phosphor layer

Similar Documents

Publication Publication Date Title
US8237350B2 (en) Light-emitting device
JP4172196B2 (en) Light emitting diode
DK2197053T3 (en) Light-emitting device and display
JP4571139B2 (en) Light emitting device and method for manufacturing light emitting device
KR100930171B1 (en) The white light emitting device and a white light source module using the same.
CN1291503C (en) Light emitting means
US7227190B2 (en) White light emitting device
US7365485B2 (en) White light emitting diode with first and second LED elements
US7511312B2 (en) Surface mounting device-type light emitting diode
JP2007317659A (en) Indirect lighting apparatus for illuminating optical waveguide
KR101316495B1 (en) Light emitting device
US9006761B2 (en) Light-emitting device
JP3065258B2 (en) Emitting device and display device using the same
US7855501B2 (en) LED with phosphor layer having different thickness or different phosphor concentration
JP4516337B2 (en) Semiconductor light emitting device
KR100891810B1 (en) White light emitting device
US20090311811A1 (en) High power light emitting diode package and method of producing the same
JP5416975B2 (en) Semiconductor light emitting device
JPWO2008105527A1 (en) LED device and lighting device
JP3934590B2 (en) White light emitting device and manufacturing method thereof
JP2007273562A (en) Semiconductor light-emitting device
US7491977B2 (en) Light emitting diode
US6982522B2 (en) LED device including phosphor layers on the reflecting surface
US9502617B2 (en) Light emitting diode package and method of manufacturing the same
JP4909450B2 (en) Light emitting device, backlight unit, liquid crystal display device, and illumination device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110610

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120718

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120807

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120904

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121113

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130402