JP2013026327A5 - - Google Patents

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Publication number
JP2013026327A5
JP2013026327A5 JP2011157955A JP2011157955A JP2013026327A5 JP 2013026327 A5 JP2013026327 A5 JP 2013026327A5 JP 2011157955 A JP2011157955 A JP 2011157955A JP 2011157955 A JP2011157955 A JP 2011157955A JP 2013026327 A5 JP2013026327 A5 JP 2013026327A5
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JP
Japan
Prior art keywords
cleaning
chamber
irradiating
gas cluster
processed
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JP2011157955A
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English (en)
Japanese (ja)
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JP2013026327A (ja
JP5776397B2 (ja
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Priority claimed from JP2011157955A external-priority patent/JP5776397B2/ja
Priority to JP2011157955A priority Critical patent/JP5776397B2/ja
Priority to PCT/JP2012/004521 priority patent/WO2013011673A1/ja
Priority to KR1020147004113A priority patent/KR101672833B1/ko
Priority to US14/232,989 priority patent/US9837260B2/en
Priority to CN201280033416.2A priority patent/CN103650117B/zh
Priority to TW101125649A priority patent/TWI540658B/zh
Publication of JP2013026327A publication Critical patent/JP2013026327A/ja
Publication of JP2013026327A5 publication Critical patent/JP2013026327A5/ja
Publication of JP5776397B2 publication Critical patent/JP5776397B2/ja
Application granted granted Critical
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JP2011157955A 2011-07-19 2011-07-19 洗浄方法、処理装置及び記憶媒体 Active JP5776397B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011157955A JP5776397B2 (ja) 2011-07-19 2011-07-19 洗浄方法、処理装置及び記憶媒体
CN201280033416.2A CN103650117B (zh) 2011-07-19 2012-07-12 清洗方法和处理装置
KR1020147004113A KR101672833B1 (ko) 2011-07-19 2012-07-12 세정 방법, 처리 장치 및 기억 매체
US14/232,989 US9837260B2 (en) 2011-07-19 2012-07-12 Cleaning method, processing apparatus, and storage medium
PCT/JP2012/004521 WO2013011673A1 (ja) 2011-07-19 2012-07-12 洗浄方法、処理装置及び記憶媒体
TW101125649A TWI540658B (zh) 2011-07-19 2012-07-17 Cleaning methods, handling devices and memory media

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011157955A JP5776397B2 (ja) 2011-07-19 2011-07-19 洗浄方法、処理装置及び記憶媒体

Publications (3)

Publication Number Publication Date
JP2013026327A JP2013026327A (ja) 2013-02-04
JP2013026327A5 true JP2013026327A5 (enExample) 2014-04-17
JP5776397B2 JP5776397B2 (ja) 2015-09-09

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ID=47557874

Family Applications (1)

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JP2011157955A Active JP5776397B2 (ja) 2011-07-19 2011-07-19 洗浄方法、処理装置及び記憶媒体

Country Status (6)

Country Link
US (1) US9837260B2 (enExample)
JP (1) JP5776397B2 (enExample)
KR (1) KR101672833B1 (enExample)
CN (1) CN103650117B (enExample)
TW (1) TWI540658B (enExample)
WO (1) WO2013011673A1 (enExample)

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JP6566683B2 (ja) * 2014-07-02 2019-08-28 東京エレクトロン株式会社 基板洗浄方法および基板洗浄装置
EP3189540A4 (en) * 2014-09-05 2018-08-08 Tel Epion Inc. Process gas enhancement for beam treatment of a substrate
US10014191B2 (en) 2014-10-06 2018-07-03 Tel Fsi, Inc. Systems and methods for treating substrates with cryogenic fluid mixtures
KR102476040B1 (ko) * 2014-10-06 2022-12-08 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. 극저온 유체 혼합물로 기판을 처리하는 시스템 및 방법
US10625280B2 (en) 2014-10-06 2020-04-21 Tel Fsi, Inc. Apparatus for spraying cryogenic fluids
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JP6881922B2 (ja) * 2016-09-12 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN109923659B (zh) 2016-11-09 2024-03-12 东京毅力科创Fsi公司 用于在处理室中处理微电子衬底的磁悬浮且旋转的卡盘
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
WO2018140789A1 (en) 2017-01-27 2018-08-02 Tel Fsi, Inc. Systems and methods for rotating and translating a substrate in a process chamber
US10890843B2 (en) * 2017-07-28 2021-01-12 Tokyo Electron Limited Fast imprint lithography
CN111937128A (zh) 2018-02-19 2020-11-13 东京毅力科创美国制造与工程公司 具有可控射束大小的处理喷雾的微电子处理系统
CN110189994A (zh) * 2018-02-23 2019-08-30 东莞新科技术研究开发有限公司 半导体表面微颗粒的处理方法
TWI776026B (zh) * 2018-06-04 2022-09-01 美商帕斯馬舍門有限責任公司 切割晶粒附接膜的方法
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber
CN109545710A (zh) * 2018-09-29 2019-03-29 东方日升新能源股份有限公司 一种降低折射率的镀膜方法
US11177150B2 (en) * 2019-03-14 2021-11-16 Taiwan Semiconductor Manufacturing Co., Ltd. Cluster tool and method using the same
CN112447496B (zh) * 2019-08-28 2024-10-18 东莞新科技术研究开发有限公司 半导体离子刻蚀清洗方法
WO2021085213A1 (ja) * 2019-11-01 2021-05-06 東京エレクトロン株式会社 基板洗浄装置および基板洗浄方法
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JP7712132B2 (ja) * 2021-07-29 2025-07-23 株式会社ディスコ 加工装置
CN116013804B (zh) * 2021-10-22 2025-08-29 长鑫存储技术有限公司 清洗装置及其清洗方法

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US8440578B2 (en) * 2011-03-28 2013-05-14 Tel Epion Inc. GCIB process for reducing interfacial roughness following pre-amorphization
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