JP2013021215A5 - - Google Patents

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Publication number
JP2013021215A5
JP2013021215A5 JP2011154766A JP2011154766A JP2013021215A5 JP 2013021215 A5 JP2013021215 A5 JP 2013021215A5 JP 2011154766 A JP2011154766 A JP 2011154766A JP 2011154766 A JP2011154766 A JP 2011154766A JP 2013021215 A5 JP2013021215 A5 JP 2013021215A5
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JP
Japan
Prior art keywords
edge
shape
intensity distribution
control unit
relative movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011154766A
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English (en)
Japanese (ja)
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JP2013021215A (ja
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Publication date
Application filed filed Critical
Priority to JP2011154766A priority Critical patent/JP2013021215A/ja
Priority claimed from JP2011154766A external-priority patent/JP2013021215A/ja
Priority to US13/547,390 priority patent/US8927949B2/en
Publication of JP2013021215A publication Critical patent/JP2013021215A/ja
Publication of JP2013021215A5 publication Critical patent/JP2013021215A5/ja
Pending legal-status Critical Current

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JP2011154766A 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法 Pending JP2013021215A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011154766A JP2013021215A (ja) 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法
US13/547,390 US8927949B2 (en) 2011-07-13 2012-07-12 Measuring apparatus, drawing apparatus, and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011154766A JP2013021215A (ja) 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
JP2013021215A JP2013021215A (ja) 2013-01-31
JP2013021215A5 true JP2013021215A5 (enExample) 2014-08-28

Family

ID=47519087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011154766A Pending JP2013021215A (ja) 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法

Country Status (2)

Country Link
US (1) US8927949B2 (enExample)
JP (1) JP2013021215A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116518A (ja) * 2012-12-11 2014-06-26 Canon Inc 描画装置及び物品の製造方法
JP6215061B2 (ja) * 2014-01-14 2017-10-18 株式会社アドバンテスト 電子ビーム露光装置
NL2013411B1 (en) * 2014-09-04 2016-09-27 Univ Delft Tech Multi electron beam inspection apparatus.
WO2019185230A1 (en) * 2018-03-29 2019-10-03 Asml Netherlands B.V. Control method for a scanning exposure apparatus
EP3547029A1 (en) * 2018-03-29 2019-10-02 ASML Netherlands B.V. Control method for a scanning exposure apparatus

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151064A (en) * 1978-05-18 1979-11-27 Cho Lsi Gijutsu Kenkyu Kumiai Method of measuring diameter of electron beam
JPS5569076A (en) * 1978-11-21 1980-05-24 Fujitsu Ltd Measurement system for charge beam shape
JPS59120406U (ja) * 1983-02-03 1984-08-14 日本電子株式会社 電子ビ−ム露光装置における電子ビ−ム測定装置
US4827436A (en) * 1987-04-22 1989-05-02 Micro Component Technology, Inc. Non-contact high resolution displacement measurement technique
JP2692839B2 (ja) * 1988-03-10 1997-12-17 キヤノン株式会社 撮像装置
US5012270A (en) * 1988-03-10 1991-04-30 Canon Kabushiki Kaisha Image shake detecting device
JPH0428155A (ja) * 1990-02-28 1992-01-30 Jeol Ltd 集束荷電粒子ビームのビーム径測定方法
US5120976A (en) * 1990-07-25 1992-06-09 The Boeing Company Strip lay-up verification system with width and centerline skew determination
JP3513219B2 (ja) * 1994-07-12 2004-03-31 キヤノン株式会社 対応点マッチング方法および装置
JP3647128B2 (ja) * 1996-03-04 2005-05-11 キヤノン株式会社 電子ビーム露光装置とその露光方法
JP3335845B2 (ja) 1996-08-26 2002-10-21 株式会社東芝 荷電ビーム描画装置及び描画方法
JPH10106931A (ja) 1996-10-03 1998-04-24 Hitachi Ltd 電子ビーム露光方法およびそれを用いた半導体集積回路装置の製造方法
JP3814353B2 (ja) * 1996-11-20 2006-08-30 キヤノン株式会社 画像分割方法および画像分割装置
US6453069B1 (en) * 1996-11-20 2002-09-17 Canon Kabushiki Kaisha Method of extracting image from input image using reference image
WO2002040980A1 (en) * 2000-11-17 2002-05-23 Ebara Corporation Wafer inspecting method, wafer inspecting instrument, and electron beam apparatus
US7095022B2 (en) * 2000-12-12 2006-08-22 Ebara Corporation Electron beam apparatus and method of manufacturing semiconductor device using the apparatus
JP3809803B2 (ja) * 2002-02-15 2006-08-16 オムロン株式会社 変位センサ
JP4522267B2 (ja) * 2005-01-11 2010-08-11 日本電子株式会社 荷電粒子ビームの評価方法及び走査方法並びに荷電粒子ビーム装置
JP4908440B2 (ja) * 2008-03-06 2012-04-04 株式会社東芝 画像処理装置及び方法
US20100053166A1 (en) * 2008-08-29 2010-03-04 Kabushiki Kaisha Toshiba Information processing apparatus, and super-resolution achievement method and program
US20100061638A1 (en) * 2008-08-29 2010-03-11 Yasuyuki Tanaka Information processing apparatus, information processing method, and computer-readable storage medium
WO2010053365A1 (en) * 2008-11-07 2010-05-14 Mapper Lithography Ip B.V. Simultaneous measurement of beams in lithography system

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