JP2013021215A - ビーム計測装置、描画装置、および物品の製造方法 - Google Patents

ビーム計測装置、描画装置、および物品の製造方法 Download PDF

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Publication number
JP2013021215A
JP2013021215A JP2011154766A JP2011154766A JP2013021215A JP 2013021215 A JP2013021215 A JP 2013021215A JP 2011154766 A JP2011154766 A JP 2011154766A JP 2011154766 A JP2011154766 A JP 2011154766A JP 2013021215 A JP2013021215 A JP 2013021215A
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JP
Japan
Prior art keywords
edge
electron beam
relative movement
control unit
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011154766A
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English (en)
Japanese (ja)
Other versions
JP2013021215A5 (enExample
Inventor
Shigeki Ogawa
茂樹 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2011154766A priority Critical patent/JP2013021215A/ja
Priority to US13/547,390 priority patent/US8927949B2/en
Publication of JP2013021215A publication Critical patent/JP2013021215A/ja
Publication of JP2013021215A5 publication Critical patent/JP2013021215A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
    • H01J2237/24521—Beam diameter

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Electron Sources, Ion Sources (AREA)
JP2011154766A 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法 Pending JP2013021215A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011154766A JP2013021215A (ja) 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法
US13/547,390 US8927949B2 (en) 2011-07-13 2012-07-12 Measuring apparatus, drawing apparatus, and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011154766A JP2013021215A (ja) 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法

Publications (2)

Publication Number Publication Date
JP2013021215A true JP2013021215A (ja) 2013-01-31
JP2013021215A5 JP2013021215A5 (enExample) 2014-08-28

Family

ID=47519087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011154766A Pending JP2013021215A (ja) 2011-07-13 2011-07-13 ビーム計測装置、描画装置、および物品の製造方法

Country Status (2)

Country Link
US (1) US8927949B2 (enExample)
JP (1) JP2013021215A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015133400A (ja) * 2014-01-14 2015-07-23 株式会社アドバンテスト 電子ビーム露光装置
JP2021517277A (ja) * 2018-03-29 2021-07-15 エーエスエムエル ネザーランズ ビー．ブイ． スキャン露光装置を制御する方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116518A (ja) * 2012-12-11 2014-06-26 Canon Inc 描画装置及び物品の製造方法
NL2013411B1 (en) * 2014-09-04 2016-09-27 Univ Delft Tech Multi electron beam inspection apparatus.
EP3547029A1 (en) * 2018-03-29 2019-10-02 ASML Netherlands B.V. Control method for a scanning exposure apparatus

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151064A (en) * 1978-05-18 1979-11-27 Cho Lsi Gijutsu Kenkyu Kumiai Method of measuring diameter of electron beam
JPS5569076A (en) * 1978-11-21 1980-05-24 Fujitsu Ltd Measurement system for charge beam shape
JPS59120406U (ja) * 1983-02-03 1984-08-14 日本電子株式会社 電子ビ−ム露光装置における電子ビ−ム測定装置
US4827436A (en) * 1987-04-22 1989-05-02 Micro Component Technology, Inc. Non-contact high resolution displacement measurement technique
JPH01231483A (ja) * 1988-03-10 1989-09-14 Canon Inc 撮像装置
JPH0428155A (ja) * 1990-02-28 1992-01-30 Jeol Ltd 集束荷電粒子ビームのビーム径測定方法
US5120976A (en) * 1990-07-25 1992-06-09 The Boeing Company Strip lay-up verification system with width and centerline skew determination
JPH0829126A (ja) * 1994-07-12 1996-02-02 Canon Inc 対応点マッチング方法および装置
JPH09245708A (ja) * 1996-03-04 1997-09-19 Canon Inc 電子ビーム露光装置とその露光方法
JPH10149449A (ja) * 1996-11-20 1998-06-02 Canon Inc 画像分割方法、画像識別方法、画像分割装置および画像識別装置
WO2002040980A1 (en) * 2000-11-17 2002-05-23 Ebara Corporation Wafer inspecting method, wafer inspecting instrument, and electron beam apparatus
JP2003240509A (ja) * 2002-02-15 2003-08-27 Omron Corp 変位センサ
JP2006194618A (ja) * 2005-01-11 2006-07-27 Jeol Ltd 荷電粒子ビームの評価方法及び走査方法並びに荷電粒子ビーム装置
JP2009211626A (ja) * 2008-03-06 2009-09-17 Toshiba Corp 画像処理装置及び方法
JP2010079883A (ja) * 2008-08-29 2010-04-08 Toshiba Corp 情報処理装置、画像処理方法およびプログラム
JP2012508462A (ja) * 2008-11-07 2012-04-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステムのビームの同時測定

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012270A (en) * 1988-03-10 1991-04-30 Canon Kabushiki Kaisha Image shake detecting device
JP3335845B2 (ja) 1996-08-26 2002-10-21 株式会社東芝 荷電ビーム描画装置及び描画方法
JPH10106931A (ja) 1996-10-03 1998-04-24 Hitachi Ltd 電子ビーム露光方法およびそれを用いた半導体集積回路装置の製造方法
US6453069B1 (en) * 1996-11-20 2002-09-17 Canon Kabushiki Kaisha Method of extracting image from input image using reference image
US7095022B2 (en) * 2000-12-12 2006-08-22 Ebara Corporation Electron beam apparatus and method of manufacturing semiconductor device using the apparatus
US20100061638A1 (en) * 2008-08-29 2010-03-11 Yasuyuki Tanaka Information processing apparatus, information processing method, and computer-readable storage medium

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151064A (en) * 1978-05-18 1979-11-27 Cho Lsi Gijutsu Kenkyu Kumiai Method of measuring diameter of electron beam
JPS5569076A (en) * 1978-11-21 1980-05-24 Fujitsu Ltd Measurement system for charge beam shape
JPS59120406U (ja) * 1983-02-03 1984-08-14 日本電子株式会社 電子ビ−ム露光装置における電子ビ−ム測定装置
US4827436A (en) * 1987-04-22 1989-05-02 Micro Component Technology, Inc. Non-contact high resolution displacement measurement technique
JPH01231483A (ja) * 1988-03-10 1989-09-14 Canon Inc 撮像装置
JPH0428155A (ja) * 1990-02-28 1992-01-30 Jeol Ltd 集束荷電粒子ビームのビーム径測定方法
US5120976A (en) * 1990-07-25 1992-06-09 The Boeing Company Strip lay-up verification system with width and centerline skew determination
JPH0829126A (ja) * 1994-07-12 1996-02-02 Canon Inc 対応点マッチング方法および装置
JPH09245708A (ja) * 1996-03-04 1997-09-19 Canon Inc 電子ビーム露光装置とその露光方法
JPH10149449A (ja) * 1996-11-20 1998-06-02 Canon Inc 画像分割方法、画像識別方法、画像分割装置および画像識別装置
WO2002040980A1 (en) * 2000-11-17 2002-05-23 Ebara Corporation Wafer inspecting method, wafer inspecting instrument, and electron beam apparatus
JP2003240509A (ja) * 2002-02-15 2003-08-27 Omron Corp 変位センサ
JP2006194618A (ja) * 2005-01-11 2006-07-27 Jeol Ltd 荷電粒子ビームの評価方法及び走査方法並びに荷電粒子ビーム装置
JP2009211626A (ja) * 2008-03-06 2009-09-17 Toshiba Corp 画像処理装置及び方法
JP2010079883A (ja) * 2008-08-29 2010-04-08 Toshiba Corp 情報処理装置、画像処理方法およびプログラム
JP2012508462A (ja) * 2008-11-07 2012-04-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステムのビームの同時測定

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015133400A (ja) * 2014-01-14 2015-07-23 株式会社アドバンテスト 電子ビーム露光装置
JP2021517277A (ja) * 2018-03-29 2021-07-15 エーエスエムエル ネザーランズ ビー．ブイ． スキャン露光装置を制御する方法
JP7309748B2 (ja) 2018-03-29 2023-07-18 エーエスエムエル ネザーランズ ビー．ブイ． スキャン露光装置を制御する方法

Also Published As

Publication number Publication date
US8927949B2 (en) 2015-01-06
US20130017476A1 (en) 2013-01-17

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