JP2012529164A5 - - Google Patents
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- Publication number
- JP2012529164A5 JP2012529164A5 JP2012513524A JP2012513524A JP2012529164A5 JP 2012529164 A5 JP2012529164 A5 JP 2012529164A5 JP 2012513524 A JP2012513524 A JP 2012513524A JP 2012513524 A JP2012513524 A JP 2012513524A JP 2012529164 A5 JP2012529164 A5 JP 2012529164A5
- Authority
- JP
- Japan
- Prior art keywords
- optoelectronic semiconductor
- region
- support
- semiconductor device
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005693 optoelectronics Effects 0.000 claims 19
- 239000004065 semiconductor Substances 0.000 claims 19
- 230000015556 catabolic process Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009023854.9A DE102009023854B4 (de) | 2009-06-04 | 2009-06-04 | Optoelektronisches Halbleiterbauelement |
| DE102009023854.9 | 2009-06-04 | ||
| PCT/EP2010/056118 WO2010139518A1 (de) | 2009-06-04 | 2010-05-05 | Optoelektronisches halbleiterbauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012529164A JP2012529164A (ja) | 2012-11-15 |
| JP2012529164A5 true JP2012529164A5 (enExample) | 2013-05-02 |
Family
ID=42651263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012513524A Pending JP2012529164A (ja) | 2009-06-04 | 2010-05-05 | オプトエレクトロニクス半導体素子 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8482025B2 (enExample) |
| EP (1) | EP2438613B1 (enExample) |
| JP (1) | JP2012529164A (enExample) |
| KR (1) | KR20120032512A (enExample) |
| CN (1) | CN102460696B (enExample) |
| DE (1) | DE102009023854B4 (enExample) |
| WO (1) | WO2010139518A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014119390A1 (de) * | 2014-12-22 | 2016-06-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
| DE102024115867A1 (de) * | 2024-06-06 | 2025-12-11 | Ams-Osram International Gmbh | Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
| JP2966591B2 (ja) | 1991-08-02 | 1999-10-25 | 三洋電機株式会社 | 光半導体装置 |
| JPH05327027A (ja) | 1992-05-26 | 1993-12-10 | Sharp Corp | 電圧変動表示素子 |
| JP2816629B2 (ja) * | 1992-06-12 | 1998-10-27 | シャープ株式会社 | 抵抗内蔵型発光装置 |
| TW408497B (en) | 1997-11-25 | 2000-10-11 | Matsushita Electric Works Ltd | LED illuminating apparatus |
| US6185240B1 (en) | 1998-01-30 | 2001-02-06 | Motorola, Inc. | Semiconductor laser having electro-static discharge protection |
| JP2001036140A (ja) * | 1999-07-16 | 2001-02-09 | Stanley Electric Co Ltd | 静電対策表面実装型ｌｅｄ |
| US6787916B2 (en) * | 2001-09-13 | 2004-09-07 | Tru-Si Technologies, Inc. | Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
| JP4020644B2 (ja) * | 2002-01-09 | 2007-12-12 | アルプス電気株式会社 | Ｓａｗフィルタモジュール |
| JP3657246B2 (ja) * | 2002-07-29 | 2005-06-08 | Ｎｅｃエレクトロニクス株式会社 | 半導体装置 |
| DE10237084A1 (de) * | 2002-08-05 | 2004-02-19 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements |
| US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| KR100638876B1 (ko) * | 2005-07-22 | 2006-10-27 | 삼성전기주식회사 | 보호 소자의 배치 구성을 개선한 측면형 발광 다이오드 |
| DE102006032415A1 (de) | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines strahlungsemittierenden Bauelements und strahlungsemittierendes Bauelement |
| JP4789673B2 (ja) | 2005-10-27 | 2011-10-12 | 京セラ株式会社 | 発光素子収納用パッケージならびにこれを用いた光源および発光装置 |
| KR100735310B1 (ko) * | 2006-04-21 | 2007-07-04 | 삼성전기주식회사 | 다층 반사 면 구조를 갖는 엘이디 패키지 및 그 제조방법 |
| KR101134752B1 (ko) * | 2006-07-14 | 2012-04-13 | 엘지이노텍 주식회사 | Ｌｅｄ 패키지 |
| US20080089072A1 (en) | 2006-10-11 | 2008-04-17 | Alti-Electronics Co., Ltd. | High Power Light Emitting Diode Package |
| TW200820463A (en) | 2006-10-25 | 2008-05-01 | Lighthouse Technology Co Ltd | Light-improving SMD diode holder and package thereof |
| DE102007001706A1 (de) | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse |
| JP5060172B2 (ja) * | 2007-05-29 | 2012-10-31 | 岩谷産業株式会社 | 半導体発光装置 |
| US7781872B2 (en) * | 2007-12-19 | 2010-08-24 | Fairchild Semiconductor Corporation | Package with multiple dies |
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2009
- 2009-06-04 DE DE102009023854.9A patent/DE102009023854B4/de active Active
-
2010
- 2010-05-05 KR KR1020127000258A patent/KR20120032512A/ko not_active Withdrawn
- 2010-05-05 EP EP10716549.0A patent/EP2438613B1/de active Active
- 2010-05-05 US US13/375,813 patent/US8482025B2/en active Active
- 2010-05-05 JP JP2012513524A patent/JP2012529164A/ja active Pending
- 2010-05-05 WO PCT/EP2010/056118 patent/WO2010139518A1/de not_active Ceased
- 2010-05-05 CN CN201080024683.4A patent/CN102460696B/zh active Active