CN102460696B - 光电子半导体器件 - Google Patents

光电子半导体器件 Download PDF

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Publication number
CN102460696B
CN102460696B CN201080024683.4A CN201080024683A CN102460696B CN 102460696 B CN102460696 B CN 102460696B CN 201080024683 A CN201080024683 A CN 201080024683A CN 102460696 B CN102460696 B CN 102460696B
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CN
China
Prior art keywords
carrier
region
optoelectronic semiconductor
housing body
electronic component
Prior art date
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Application number
CN201080024683.4A
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English (en)
Chinese (zh)
Other versions
CN102460696A (zh
Inventor
斯蒂芬·普罗伊斯
迈克尔·资特兹尔斯伯尔格尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102460696A publication Critical patent/CN102460696A/zh
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10W90/00—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Led Device Packages (AREA)
CN201080024683.4A 2009-06-04 2010-05-05 光电子半导体器件 Active CN102460696B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009023854.9A DE102009023854B4 (de) 2009-06-04 2009-06-04 Optoelektronisches Halbleiterbauelement
DE102009023854.9 2009-06-04
PCT/EP2010/056118 WO2010139518A1 (de) 2009-06-04 2010-05-05 Optoelektronisches halbleiterbauelement

Publications (2)

Publication Number Publication Date
CN102460696A CN102460696A (zh) 2012-05-16
CN102460696B true CN102460696B (zh) 2014-10-29

Family

ID=42651263

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080024683.4A Active CN102460696B (zh) 2009-06-04 2010-05-05 光电子半导体器件

Country Status (7)

Country Link
US (1) US8482025B2 (enExample)
EP (1) EP2438613B1 (enExample)
JP (1) JP2012529164A (enExample)
KR (1) KR20120032512A (enExample)
CN (1) CN102460696B (enExample)
DE (1) DE102009023854B4 (enExample)
WO (1) WO2010139518A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014119390A1 (de) * 2014-12-22 2016-06-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE102024115867A1 (de) * 2024-06-06 2025-12-11 Ams-Osram International Gmbh Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1901190A (zh) * 2005-07-22 2007-01-24 三星电机株式会社 具有改进的保护器件布置的侧光式发光二极管
JP2007150229A (ja) * 2005-10-27 2007-06-14 Kyocera Corp 発光素子収納用パッケージならびにこれを用いた光源および発光装置
US20080099779A1 (en) * 2006-10-25 2008-05-01 Yi-Ming Huang SMD diode holding structure and package thereof
CN101315963A (zh) * 2007-05-29 2008-12-03 岩谷产业株式会社 半导体发光装置

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DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
JP2966591B2 (ja) 1991-08-02 1999-10-25 三洋電機株式会社 光半導体装置
JPH05327027A (ja) 1992-05-26 1993-12-10 Sharp Corp 電圧変動表示素子
JP2816629B2 (ja) * 1992-06-12 1998-10-27 シャープ株式会社 抵抗内蔵型発光装置
TW408497B (en) 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
US6185240B1 (en) 1998-01-30 2001-02-06 Motorola, Inc. Semiconductor laser having electro-static discharge protection
JP2001036140A (ja) * 1999-07-16 2001-02-09 Stanley Electric Co Ltd 静電対策表面実装型ｌｅｄ
US6787916B2 (en) * 2001-09-13 2004-09-07 Tru-Si Technologies, Inc. Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
JP4020644B2 (ja) * 2002-01-09 2007-12-12 アルプス電気株式会社 Ｓａｗフィルタモジュール
JP3657246B2 (ja) * 2002-07-29 2005-06-08 Ｎｅｃエレクトロニクス株式会社 半導体装置
DE10237084A1 (de) * 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
DE102006032415A1 (de) 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strahlungsemittierenden Bauelements und strahlungsemittierendes Bauelement
KR100735310B1 (ko) * 2006-04-21 2007-07-04 삼성전기주식회사 다층 반사 면 구조를 갖는 엘이디 패키지 및 그 제조방법
KR101134752B1 (ko) * 2006-07-14 2012-04-13 엘지이노텍 주식회사 Ｌｅｄ 패키지
US20080089072A1 (en) 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
DE102007001706A1 (de) 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
US7781872B2 (en) * 2007-12-19 2010-08-24 Fairchild Semiconductor Corporation Package with multiple dies

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1901190A (zh) * 2005-07-22 2007-01-24 三星电机株式会社 具有改进的保护器件布置的侧光式发光二极管
JP2007150229A (ja) * 2005-10-27 2007-06-14 Kyocera Corp 発光素子収納用パッケージならびにこれを用いた光源および発光装置
US20080099779A1 (en) * 2006-10-25 2008-05-01 Yi-Ming Huang SMD diode holding structure and package thereof
CN101315963A (zh) * 2007-05-29 2008-12-03 岩谷产业株式会社 半导体发光装置

Also Published As

Publication number Publication date
DE102009023854A1 (de) 2010-12-09
WO2010139518A1 (de) 2010-12-09
KR20120032512A (ko) 2012-04-05
JP2012529164A (ja) 2012-11-15
US8482025B2 (en) 2013-07-09
CN102460696A (zh) 2012-05-16
EP2438613B1 (de) 2019-07-03
EP2438613A1 (de) 2012-04-11
DE102009023854B4 (de) 2023-11-09
US20120126279A1 (en) 2012-05-24

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