JP2012528470A5 - - Google Patents

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Publication number
JP2012528470A5
JP2012528470A5 JP2012512198A JP2012512198A JP2012528470A5 JP 2012528470 A5 JP2012528470 A5 JP 2012528470A5 JP 2012512198 A JP2012512198 A JP 2012512198A JP 2012512198 A JP2012512198 A JP 2012512198A JP 2012528470 A5 JP2012528470 A5 JP 2012528470A5
Authority
JP
Japan
Prior art keywords
support substrate
optoelectronic module
output semiconductor
module according
radiation output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012512198A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012528470A (ja
Filing date
Publication date
Priority claimed from DE102009022901A external-priority patent/DE102009022901A1/de
Application filed filed Critical
Publication of JP2012528470A publication Critical patent/JP2012528470A/ja
Publication of JP2012528470A5 publication Critical patent/JP2012528470A5/ja
Pending legal-status Critical Current

Links

JP2012512198A 2009-05-27 2010-04-28 オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法 Pending JP2012528470A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009022901A DE102009022901A1 (de) 2009-05-27 2009-05-27 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
DE102009022901.9 2009-05-27
PCT/DE2010/000492 WO2010136006A1 (de) 2009-05-27 2010-04-28 Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls

Publications (2)

Publication Number Publication Date
JP2012528470A JP2012528470A (ja) 2012-11-12
JP2012528470A5 true JP2012528470A5 (https=) 2013-03-21

Family

ID=42558477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012512198A Pending JP2012528470A (ja) 2009-05-27 2010-04-28 オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法

Country Status (7)

Country Link
US (1) US8916900B2 (https=)
EP (1) EP2436242B1 (https=)
JP (1) JP2012528470A (https=)
KR (1) KR101675008B1 (https=)
CN (1) CN102450109B (https=)
DE (1) DE102009022901A1 (https=)
WO (1) WO2010136006A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6827295B2 (ja) * 2015-12-22 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
KR102801218B1 (ko) * 2019-08-30 2025-04-29 삼성전자주식회사 디스플레이 모듈 패키지
DE102024115867A1 (de) * 2024-06-06 2025-12-11 Ams-Osram International Gmbh Optoelektronisches bauteil mit einem optoelektronischen-halbleiterchip und einem dem optoelektronischen halbleiterchip zugeordneten zusatzchip

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281976A (ja) 1989-04-24 1990-11-19 Sharp Corp Ｌｅｄプリンタヘッド
JPH04276649A (ja) 1991-03-04 1992-10-01 Hitachi Ltd 複合形半導体装置およびその実装構造体並びにその実装方法
JP2001203427A (ja) * 2000-01-20 2001-07-27 Canon Inc 波長多重面型発光素子装置、その製造方法およびこれを用いた波長多重伝送システム
JP2002231885A (ja) * 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置
JP2004319530A (ja) * 2003-02-28 2004-11-11 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
US20070257901A1 (en) * 2004-04-19 2007-11-08 Matsushita Electric Industrial Co., Ltd. Semiconductor chip for driving light emitting element, light emitting device, and lighting device
US20070295975A1 (en) * 2004-06-25 2007-12-27 Sanyo Electric Co., Ltd. Light-Emitting Device
DE102004064150B4 (de) * 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
CN100539219C (zh) * 2005-04-28 2009-09-09 皇家飞利浦电子股份有限公司 包括设置在凹部中的led的光源
DE102006004397A1 (de) 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP2007312107A (ja) 2006-05-18 2007-11-29 Alps Electric Co Ltd 表面弾性波装置
DE102006025162B3 (de) * 2006-05-30 2008-01-31 Epcos Ag Flip-Chip-Bauelement und Verfahren zur Herstellung
US20080106251A1 (en) * 2006-11-03 2008-05-08 Cabral Roy Manuel Daylight-readable digital panel meter with auto-brightness adjusting led display
DE102007020475A1 (de) 2007-04-27 2008-11-06 Häusermann GmbH Verfahren zur Herstellung einer Leiterplatte mit einer Kavität für die Integration von Bauteilen und Leiterplatte und Anwendung
JP4912275B2 (ja) * 2007-11-06 2012-04-11 新光電気工業株式会社 半導体パッケージ
US20090173958A1 (en) * 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
US20100059783A1 (en) * 2008-09-08 2010-03-11 Harry Chandra Light Emitting Chip Package With Metal Leads For Enhanced Heat Dissipation

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