JP2012525692A5 - - Google Patents

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Publication number
JP2012525692A5
JP2012525692A5 JP2012507683A JP2012507683A JP2012525692A5 JP 2012525692 A5 JP2012525692 A5 JP 2012525692A5 JP 2012507683 A JP2012507683 A JP 2012507683A JP 2012507683 A JP2012507683 A JP 2012507683A JP 2012525692 A5 JP2012525692 A5 JP 2012525692A5
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JP
Japan
Prior art keywords
dielectric layer
metal
layer
component according
optoelectronic component
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JP2012507683A
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English (en)
Japanese (ja)
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JP2012525692A (ja
JP5740551B2 (ja
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Priority claimed from DE200910022900 external-priority patent/DE102009022900A1/de
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Publication of JP2012525692A publication Critical patent/JP2012525692A/ja
Publication of JP2012525692A5 publication Critical patent/JP2012525692A5/ja
Application granted granted Critical
Publication of JP5740551B2 publication Critical patent/JP5740551B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012507683A 2009-04-30 2010-04-21 光電構成素子およびその製造方法 Expired - Fee Related JP5740551B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009019520.3 2009-04-30
DE102009019520 2009-04-30
DE102009022900.0 2009-05-27
DE200910022900 DE102009022900A1 (de) 2009-04-30 2009-05-27 Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
PCT/EP2010/055289 WO2010124979A1 (de) 2009-04-30 2010-04-21 Optoelektronisches bauelement und verfahren zu dessen herstellung

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015000285A Division JP2015130344A (ja) 2009-04-30 2015-01-05 光電構成素子およびその製造方法

Publications (3)

Publication Number Publication Date
JP2012525692A JP2012525692A (ja) 2012-10-22
JP2012525692A5 true JP2012525692A5 (enExample) 2013-05-02
JP5740551B2 JP5740551B2 (ja) 2015-06-24

Family

ID=42979234

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012507683A Expired - Fee Related JP5740551B2 (ja) 2009-04-30 2010-04-21 光電構成素子およびその製造方法
JP2015000285A Granted JP2015130344A (ja) 2009-04-30 2015-01-05 光電構成素子およびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015000285A Granted JP2015130344A (ja) 2009-04-30 2015-01-05 光電構成素子およびその製造方法

Country Status (7)

Country Link
US (2) US8680563B2 (enExample)
EP (1) EP2425037A1 (enExample)
JP (2) JP5740551B2 (enExample)
KR (1) KR20120042747A (enExample)
CN (1) CN102439197B (enExample)
DE (1) DE102009022900A1 (enExample)
WO (1) WO2010124979A1 (enExample)

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DE102010040839B4 (de) * 2010-09-15 2013-10-17 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektronsichen Bauelements und elektronisches Bauelement
US20130242533A1 (en) * 2011-09-12 2013-09-19 Appotronics Corporation Limited Method and apparatus for a color filter
CN103999232B (zh) * 2012-03-06 2015-10-14 国立研究开发法人科学技术振兴机构 多量子阱太阳能电池及多量子阱太阳能电池的制造方法
KR101387918B1 (ko) * 2012-04-30 2014-04-23 엘지디스플레이 주식회사 유기전계발광표시장치 및 그 제조 방법
FR2992098A1 (fr) * 2012-06-19 2013-12-20 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede de fabrication.
CN102728238B (zh) * 2012-07-06 2015-02-18 南京工业大学 聚丙烯分离膜表面改性的方法
US9570662B2 (en) * 2012-07-10 2017-02-14 Osram Opto Semiconductors Gmbh Method of encapsulating an optoelectronic device and light-emitting diode chip
CN103840089B (zh) 2012-11-20 2016-12-21 群康科技(深圳)有限公司 有机发光二极管装置及其显示面板
JP2014149994A (ja) * 2013-02-01 2014-08-21 Denso Corp 表示装置の製造方法
CN104009180A (zh) * 2013-02-26 2014-08-27 海洋王照明科技股份有限公司 有机电致发光器件及其制备方法
US20160043247A1 (en) * 2013-03-15 2016-02-11 Arkema Inc. Nitrogen-containing transparent conductive oxide cap layer composition
JP6119408B2 (ja) * 2013-05-09 2017-04-26 ソニー株式会社 原子層堆積装置
EP2918701A1 (en) * 2014-03-14 2015-09-16 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method of manufacturing a stacked organic light emitting diode, stacked OLED device, and apparatus for manufacturing thereof
FR3020179B1 (fr) * 2014-04-22 2017-10-06 Saint Gobain Electrode supportee transparente pour oled
DE102014111346B4 (de) * 2014-08-08 2022-11-03 Pictiva Displays International Limited Optoelektronische Bauelementevorrichtung und Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung
US9490453B2 (en) * 2014-10-06 2016-11-08 Winbond Electronics Corp. Quasi-crystal organic light-emitting display panel and method for simulating optical efficiency of the same
DE102015112681B4 (de) * 2015-08-03 2025-08-28 Pictiva Displays International Limited Organisches optoelektronisches Bauelement und Verfahren zum Herstellen eines organischen optoelektronischen Bauelements
DE102016103059A1 (de) * 2016-02-22 2017-08-24 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
CN106784350A (zh) * 2016-12-23 2017-05-31 京东方科技集团股份有限公司 一种有机电致发光显示面板及其制作方法、显示装置
CN108123050B (zh) * 2017-12-04 2020-05-12 武汉华美晨曦光电有限责任公司 一种以交流驱动的白光oled器件
DE102020113616A1 (de) * 2020-02-24 2021-08-26 Taiwan Semiconductor Manufacturing Co., Ltd. Hartmaskenschicht unter einer durchkontaktierungsstruktur in einer anzeigevorrichtung
US11682692B2 (en) 2020-02-24 2023-06-20 Taiwan Semiconductor Manufacturing Company, Ltd. Hard mask layer below via structure in display device

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DE102009022900A1 (de) * 2009-04-30 2010-11-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung

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