JP2012524389A5 - - Google Patents

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Publication number
JP2012524389A5
JP2012524389A5 JP2012505070A JP2012505070A JP2012524389A5 JP 2012524389 A5 JP2012524389 A5 JP 2012524389A5 JP 2012505070 A JP2012505070 A JP 2012505070A JP 2012505070 A JP2012505070 A JP 2012505070A JP 2012524389 A5 JP2012524389 A5 JP 2012524389A5
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JP
Japan
Prior art keywords
conductive layer
solder material
strip conductor
conductive
zno
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012505070A
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English (en)
Japanese (ja)
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JP2012524389A (ja
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Publication date
Priority claimed from DE102009017659A external-priority patent/DE102009017659A1/de
Application filed filed Critical
Publication of JP2012524389A publication Critical patent/JP2012524389A/ja
Publication of JP2012524389A5 publication Critical patent/JP2012524389A5/ja
Pending legal-status Critical Current

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JP2012505070A 2009-04-16 2010-03-27 透明の基板の上にデバイスを導電性結合する方法 Pending JP2012524389A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009017659A DE102009017659A1 (de) 2009-04-16 2009-04-16 Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat
DE102009017659.4 2009-04-16
PCT/EP2010/001961 WO2010118821A1 (de) 2009-04-16 2010-03-27 Verfahren zur leitenden verbindung eines bauelementes auf einem transparenten substrat

Publications (2)

Publication Number Publication Date
JP2012524389A JP2012524389A (ja) 2012-10-11
JP2012524389A5 true JP2012524389A5 (cg-RX-API-DMAC7.html) 2013-05-16

Family

ID=42312941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012505070A Pending JP2012524389A (ja) 2009-04-16 2010-03-27 透明の基板の上にデバイスを導電性結合する方法

Country Status (12)

Country Link
US (1) US8484837B2 (cg-RX-API-DMAC7.html)
EP (1) EP2420114A1 (cg-RX-API-DMAC7.html)
JP (1) JP2012524389A (cg-RX-API-DMAC7.html)
KR (1) KR20110137793A (cg-RX-API-DMAC7.html)
CN (1) CN102396298A (cg-RX-API-DMAC7.html)
BR (1) BRPI1011386A2 (cg-RX-API-DMAC7.html)
CA (1) CA2758752A1 (cg-RX-API-DMAC7.html)
DE (1) DE102009017659A1 (cg-RX-API-DMAC7.html)
RU (1) RU2011146319A (cg-RX-API-DMAC7.html)
SG (1) SG175176A1 (cg-RX-API-DMAC7.html)
WO (1) WO2010118821A1 (cg-RX-API-DMAC7.html)
ZA (1) ZA201106915B (cg-RX-API-DMAC7.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009017659A1 (de) 2009-04-16 2010-10-28 Schott Ag Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat
CN108687442B (zh) * 2017-03-30 2021-10-01 法拉第未来公司 用于焊接的系统和方法
US10843885B2 (en) 2018-02-23 2020-11-24 International Test Solutions, Inc. Material and hardware to automatically clean flexible electronic web rolls
US10512586B1 (en) * 2018-07-12 2019-12-24 Rayer Lavonne Lee System and method for vision rehabilitation therapy
TWI693119B (zh) * 2019-03-06 2020-05-11 台灣愛司帝科技股份有限公司 應用於固接led的雷射加熱裝置
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US11443981B2 (en) * 2019-08-16 2022-09-13 Taiwan Semiconductor Manufacturing Company, Ltd. Bonding method of package components and bonding apparatus
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
SE545042C2 (en) * 2019-12-20 2023-03-07 Digital Tags Finland Oy Method for producing a conductive pattern on a substrate
US11035898B1 (en) * 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
DE102021101334A1 (de) 2021-01-22 2022-07-28 André LeGuin Verfahren zum Verbinden von zwei flächigen Bauteilen

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DE102009017659A1 (de) 2009-04-16 2010-10-28 Schott Ag Verfahren zur leitenden Verbindung eines Bauelementes auf einem transprenten Substrat

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