JP2012514067A - 芳香族ポリエステルアミド共重合体、高分子フィルム、プリプレグ、プリプレグ積層体、金属箔積層板及びプリント配線板 - Google Patents

芳香族ポリエステルアミド共重合体、高分子フィルム、プリプレグ、プリプレグ積層体、金属箔積層板及びプリント配線板 Download PDF

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Publication number
JP2012514067A
JP2012514067A JP2011543430A JP2011543430A JP2012514067A JP 2012514067 A JP2012514067 A JP 2012514067A JP 2011543430 A JP2011543430 A JP 2011543430A JP 2011543430 A JP2011543430 A JP 2011543430A JP 2012514067 A JP2012514067 A JP 2012514067A
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JP
Japan
Prior art keywords
aromatic
prepreg
derived
repeating unit
rcn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011543430A
Other languages
English (en)
Japanese (ja)
Inventor
ドミトリー エヌ クラシュク
テジュン オク
チョンウォン パク
ボンヒョク グ
ヨンテク オウ
マンジョン キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lotte Fine Chemical Co Ltd
Original Assignee
Lotte Fine Chemical Co Ltd
Samsung Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lotte Fine Chemical Co Ltd, Samsung Fine Chemicals Co Ltd filed Critical Lotte Fine Chemical Co Ltd
Publication of JP2012514067A publication Critical patent/JP2012514067A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181—Acids containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyamides (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP2011543430A 2008-12-31 2009-12-24 芳香族ポリエステルアミド共重合体、高分子フィルム、プリプレグ、プリプレグ積層体、金属箔積層板及びプリント配線板 Pending JP2012514067A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020080138704A KR101054271B1 (ko) 2008-12-31 2008-12-31 방향족 폴리에스테르 아미드 공중합체, 상기 방향족 폴리에스테르 아미드 공중합체를 채용한 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판
KR10-2008-0138704 2008-12-31
PCT/KR2009/007764 WO2010077015A2 (fr) 2008-12-31 2009-12-24 Copolymère de polyester-amide aromatique, film à poids moléculaire élevé, préimprégné, laminé préimprégné, laminé de feuilles métalliques et carte de circuits imprimés

Publications (1)

Publication Number Publication Date
JP2012514067A true JP2012514067A (ja) 2012-06-21

Family

ID=42310340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011543430A Pending JP2012514067A (ja) 2008-12-31 2009-12-24 芳香族ポリエステルアミド共重合体、高分子フィルム、プリプレグ、プリプレグ積層体、金属箔積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP2012514067A (fr)
KR (1) KR101054271B1 (fr)
CN (1) CN102272195B (fr)
TW (1) TW201035169A (fr)
WO (1) WO2010077015A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106480735A (zh) * 2015-08-28 2017-03-08 广东生益科技股份有限公司 电路基板及其制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120100306A (ko) * 2011-03-03 2012-09-12 삼성정밀화학 주식회사 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 수지를 포함하는 필름, 상기 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판
KR101798237B1 (ko) * 2011-05-06 2017-11-15 심천 워트 어드밴스드 머티리얼즈 주식회사 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판
KR101767691B1 (ko) * 2011-08-04 2017-08-14 심천 워트 어드밴스드 머티리얼즈 주식회사 열경화성 수지 제조용 조성물 및 그의 경화물, 상기 경화물을 포함하는 프리프레그, 및 상기 프리프레그를 채용한 금속박 적층판과 프린트 배선판
CN106810690B (zh) * 2017-01-12 2019-09-10 苏州大学 一种芳香族聚酯酰胺及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0723446B2 (ja) * 1985-12-06 1995-03-15 ポリプラスチックス株式会社 安定化ポリエステル樹脂組成物
JPH0726011B2 (ja) * 1986-10-17 1995-03-22 ポリプラスチックス株式会社 ポリエステル樹脂組成物
JP3619867B2 (ja) * 1993-09-03 2005-02-16 株式会社高分子加工研究所 サーモトロピック液晶ポリマーフィラメントの製法
US7227179B2 (en) * 2002-09-30 2007-06-05 World Properties, Inc. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
KR100929383B1 (ko) * 2007-05-23 2009-12-02 삼성정밀화학 주식회사 방향족 액정 폴리에스테르 아미드 공중합체, 상기 방향족액정 폴리에스테르 아미드 공중합체를 채용한 프리프레그,및 상기 프리프레그를 채용한 적층판과 프린트 배선판
JP2008291168A (ja) * 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106480735A (zh) * 2015-08-28 2017-03-08 广东生益科技股份有限公司 电路基板及其制备方法
CN106480735B (zh) * 2015-08-28 2019-06-14 广东生益科技股份有限公司 电路基板及其制备方法

Also Published As

Publication number Publication date
CN102272195B (zh) 2013-06-05
KR20100080082A (ko) 2010-07-08
WO2010077015A3 (fr) 2010-10-07
TW201035169A (en) 2010-10-01
KR101054271B1 (ko) 2011-08-08
CN102272195A (zh) 2011-12-07
WO2010077015A2 (fr) 2010-07-08

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