CN102272195B - 芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板 - Google Patents
芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板 Download PDFInfo
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- CN102272195B CN102272195B CN2009801532718A CN200980153271A CN102272195B CN 102272195 B CN102272195 B CN 102272195B CN 2009801532718 A CN2009801532718 A CN 2009801532718A CN 200980153271 A CN200980153271 A CN 200980153271A CN 102272195 B CN102272195 B CN 102272195B
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- aromatic
- polyester amide
- amide copolymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/181—Acids containing aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polyamides (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
区分 | 实施例1 | 实施例2 | 比较例1 |
是否发生变形或起泡 | × | × | × |
溶解度(%) | 40 | 48 | 17 |
熔融温度(℃) | 315 | 235 | 360 |
热膨胀率(ppm/K) | 7.2 | 12.4 | 6.8 |
预浸料坯的介电常数 | 3.0 | 3.5 | 3.3 |
预浸料坯的介电损耗 | 0.005 | 0.007 | 0.007 |
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080138704A KR101054271B1 (ko) | 2008-12-31 | 2008-12-31 | 방향족 폴리에스테르 아미드 공중합체, 상기 방향족 폴리에스테르 아미드 공중합체를 채용한 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판 |
KR10-2008-0138704 | 2008-12-31 | ||
PCT/KR2009/007764 WO2010077015A2 (ko) | 2008-12-31 | 2009-12-24 | 방향족 폴리에스테르 아미드 공중합체, 고분자 필름, 프리프레그, 프리프레그 적층체, 금속박 적층판 및 프린트 배선판 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102272195A CN102272195A (zh) | 2011-12-07 |
CN102272195B true CN102272195B (zh) | 2013-06-05 |
Family
ID=42310340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009801532718A Active CN102272195B (zh) | 2008-12-31 | 2009-12-24 | 芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2012514067A (zh) |
KR (1) | KR101054271B1 (zh) |
CN (1) | CN102272195B (zh) |
TW (1) | TW201035169A (zh) |
WO (1) | WO2010077015A2 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120100306A (ko) * | 2011-03-03 | 2012-09-12 | 삼성정밀화학 주식회사 | 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 수지를 포함하는 필름, 상기 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판 |
KR101798237B1 (ko) * | 2011-05-06 | 2017-11-15 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판 |
KR101767691B1 (ko) * | 2011-08-04 | 2017-08-14 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 열경화성 수지 제조용 조성물 및 그의 경화물, 상기 경화물을 포함하는 프리프레그, 및 상기 프리프레그를 채용한 금속박 적층판과 프린트 배선판 |
CN106480735B (zh) * | 2015-08-28 | 2019-06-14 | 广东生益科技股份有限公司 | 电路基板及其制备方法 |
CN106810690B (zh) * | 2017-01-12 | 2019-09-10 | 苏州大学 | 一种芳香族聚酯酰胺及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758636A (en) * | 1985-12-06 | 1988-07-19 | Polyplastics Company, Ltd. | Polyester composition |
US4874800A (en) * | 1986-10-17 | 1989-10-17 | Polyplastics Co., Ltd. | Polyester resin composition |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3619867B2 (ja) * | 1993-09-03 | 2005-02-16 | 株式会社高分子加工研究所 | サーモトロピック液晶ポリマーフィラメントの製法 |
US7227179B2 (en) * | 2002-09-30 | 2007-06-05 | World Properties, Inc. | Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
KR100929383B1 (ko) * | 2007-05-23 | 2009-12-02 | 삼성정밀화학 주식회사 | 방향족 액정 폴리에스테르 아미드 공중합체, 상기 방향족액정 폴리에스테르 아미드 공중합체를 채용한 프리프레그,및 상기 프리프레그를 채용한 적층판과 프린트 배선판 |
JP2008291168A (ja) * | 2007-05-28 | 2008-12-04 | Sumitomo Chemical Co Ltd | 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板 |
-
2008
- 2008-12-31 KR KR1020080138704A patent/KR101054271B1/ko active IP Right Grant
-
2009
- 2009-12-24 CN CN2009801532718A patent/CN102272195B/zh active Active
- 2009-12-24 JP JP2011543430A patent/JP2012514067A/ja active Pending
- 2009-12-24 WO PCT/KR2009/007764 patent/WO2010077015A2/ko active Application Filing
- 2009-12-30 TW TW098145786A patent/TW201035169A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758636A (en) * | 1985-12-06 | 1988-07-19 | Polyplastics Company, Ltd. | Polyester composition |
US4874800A (en) * | 1986-10-17 | 1989-10-17 | Polyplastics Co., Ltd. | Polyester resin composition |
Non-Patent Citations (1)
Title |
---|
JP特开2008-291168A 2008.12.04 |
Also Published As
Publication number | Publication date |
---|---|
KR20100080082A (ko) | 2010-07-08 |
WO2010077015A3 (ko) | 2010-10-07 |
TW201035169A (en) | 2010-10-01 |
KR101054271B1 (ko) | 2011-08-08 |
JP2012514067A (ja) | 2012-06-21 |
CN102272195A (zh) | 2011-12-07 |
WO2010077015A2 (ko) | 2010-07-08 |
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Owner name: SHENZHEN WOTE ADVANCED MATERIALS CO., LTD. Free format text: FORMER OWNER: SAMSUNG FINE CHEMICALS CO., LTD. Effective date: 20150130 |
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Address after: 518000 31 / F, block B, building 7, Wanke Yuncheng phase 3, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Water New Material Co.,Ltd. Address before: 518052 Guangdong city of Shenzhen province Nanshan District Nantou two road crossing forward hot electrons strategic emerging industrial park 10 Patentee before: Shenzhen Water New Material Co.,Ltd. |