WO2010077015A3 - Copolymère de polyester-amide aromatique, film à poids moléculaire élevé, préimprégné, laminé préimprégné, laminé de feuilles métalliques et carte de circuits imprimés - Google Patents

Copolymère de polyester-amide aromatique, film à poids moléculaire élevé, préimprégné, laminé préimprégné, laminé de feuilles métalliques et carte de circuits imprimés Download PDF

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Publication number
WO2010077015A3
WO2010077015A3 PCT/KR2009/007764 KR2009007764W WO2010077015A3 WO 2010077015 A3 WO2010077015 A3 WO 2010077015A3 KR 2009007764 W KR2009007764 W KR 2009007764W WO 2010077015 A3 WO2010077015 A3 WO 2010077015A3
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
laminate
derived
recurrent unit
aromatic
Prior art date
Application number
PCT/KR2009/007764
Other languages
English (en)
Korean (ko)
Other versions
WO2010077015A2 (fr
Inventor
크라브주그드미트리
옥태준
박정원
구본혁
오영택
김만종
Original Assignee
삼성정밀화학(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성정밀화학(주) filed Critical 삼성정밀화학(주)
Priority to JP2011543430A priority Critical patent/JP2012514067A/ja
Priority to CN2009801532718A priority patent/CN102272195B/zh
Publication of WO2010077015A2 publication Critical patent/WO2010077015A2/fr
Publication of WO2010077015A3 publication Critical patent/WO2010077015A3/fr

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181Acids containing aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyamides (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un copolymère de polyester-amide aromatique, un film à poids moléculaire élevé, un préimprégné, un laminé préimprégné, un laminé de feuilles métalliques et une carte de circuits imprimés. Le copolymère de polyester-amide aromatique décrit dans l'invention comprend: de 20 à 40 % en moles d'un motif récurrent aromatique obtenu à partir de diol (A); de 20 à 40 % en moles d'au moins un motif récurrent choisi parmi un motif récurrent (B) obtenu à partir d'une amine aromatique comprenant un groupe hydroxyle phénolique et un motif récurrent (B') obtenu à partir d'une diamine aromatique; et de 20 à 60 % en moles d'un motif récurrent (C) obtenu à partir d'un acide dicarboxylique aromatique, le motif récurrent aromatique obtenu à partir de diol (A) contenant un motif récurrent obtenu à partir de résorcinol (RCN).
PCT/KR2009/007764 2008-12-31 2009-12-24 Copolymère de polyester-amide aromatique, film à poids moléculaire élevé, préimprégné, laminé préimprégné, laminé de feuilles métalliques et carte de circuits imprimés WO2010077015A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011543430A JP2012514067A (ja) 2008-12-31 2009-12-24 芳香族ポリエステルアミド共重合体、高分子フィルム、プリプレグ、プリプレグ積層体、金属箔積層板及びプリント配線板
CN2009801532718A CN102272195B (zh) 2008-12-31 2009-12-24 芳香族聚酯酰胺共聚物、高分子膜、预浸料坯、预浸料坯层叠体、金属箔层叠板和印刷线路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080138704A KR101054271B1 (ko) 2008-12-31 2008-12-31 방향족 폴리에스테르 아미드 공중합체, 상기 방향족 폴리에스테르 아미드 공중합체를 채용한 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판
KR10-2008-0138704 2008-12-31

Publications (2)

Publication Number Publication Date
WO2010077015A2 WO2010077015A2 (fr) 2010-07-08
WO2010077015A3 true WO2010077015A3 (fr) 2010-10-07

Family

ID=42310340

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/007764 WO2010077015A2 (fr) 2008-12-31 2009-12-24 Copolymère de polyester-amide aromatique, film à poids moléculaire élevé, préimprégné, laminé préimprégné, laminé de feuilles métalliques et carte de circuits imprimés

Country Status (5)

Country Link
JP (1) JP2012514067A (fr)
KR (1) KR101054271B1 (fr)
CN (1) CN102272195B (fr)
TW (1) TW201035169A (fr)
WO (1) WO2010077015A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120100306A (ko) * 2011-03-03 2012-09-12 삼성정밀화학 주식회사 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 수지를 포함하는 필름, 상기 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판
KR101798237B1 (ko) * 2011-05-06 2017-11-15 심천 워트 어드밴스드 머티리얼즈 주식회사 전방향족 폴리에스테르 아미드 공중합체 수지, 상기 전방향족 폴리에스테르 아미드 공중합체 수지를 포함하는 고분자 필름, 상기 고분자 필름을 포함하는 연성 금속박 적층판, 및 상기 연성 금속박 적층판을 구비하는 연성 인쇄 회로기판
KR101767691B1 (ko) * 2011-08-04 2017-08-14 심천 워트 어드밴스드 머티리얼즈 주식회사 열경화성 수지 제조용 조성물 및 그의 경화물, 상기 경화물을 포함하는 프리프레그, 및 상기 프리프레그를 채용한 금속박 적층판과 프린트 배선판
CN106480735B (zh) * 2015-08-28 2019-06-14 广东生益科技股份有限公司 电路基板及其制备方法
CN106810690B (zh) * 2017-01-12 2019-09-10 苏州大学 一种芳香族聚酯酰胺及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920003419B1 (ko) * 1986-10-17 1992-04-30 폴리플라스틱스 가부시끼가이샤 폴리에스테르 수지조성물
JPH07126916A (ja) * 1993-09-03 1995-05-16 Polymer Processing Res Inst サーモトロピック液晶ポリマーフィラメントの製法
US20040061105A1 (en) * 2002-09-30 2004-04-01 St. Lawrence Michael R. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP2008291168A (ja) * 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0723446B2 (ja) * 1985-12-06 1995-03-15 ポリプラスチックス株式会社 安定化ポリエステル樹脂組成物
KR100929383B1 (ko) * 2007-05-23 2009-12-02 삼성정밀화학 주식회사 방향족 액정 폴리에스테르 아미드 공중합체, 상기 방향족액정 폴리에스테르 아미드 공중합체를 채용한 프리프레그,및 상기 프리프레그를 채용한 적층판과 프린트 배선판

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920003419B1 (ko) * 1986-10-17 1992-04-30 폴리플라스틱스 가부시끼가이샤 폴리에스테르 수지조성물
JPH07126916A (ja) * 1993-09-03 1995-05-16 Polymer Processing Res Inst サーモトロピック液晶ポリマーフィラメントの製法
US20040061105A1 (en) * 2002-09-30 2004-04-01 St. Lawrence Michael R. Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP2008291168A (ja) * 2007-05-28 2008-12-04 Sumitomo Chemical Co Ltd 液晶ポリマーフィルムの製造方法、及びプリント配線板用基板

Also Published As

Publication number Publication date
CN102272195B (zh) 2013-06-05
KR20100080082A (ko) 2010-07-08
TW201035169A (en) 2010-10-01
KR101054271B1 (ko) 2011-08-08
JP2012514067A (ja) 2012-06-21
CN102272195A (zh) 2011-12-07
WO2010077015A2 (fr) 2010-07-08

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