JP2012503586A - 制御可能な幅広い粒径分布及び最小粒径を有するシリカゾルの製造方法 - Google Patents

制御可能な幅広い粒径分布及び最小粒径を有するシリカゾルの製造方法 Download PDF

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JP2012503586A
JP2012503586A JP2011528099A JP2011528099A JP2012503586A JP 2012503586 A JP2012503586 A JP 2012503586A JP 2011528099 A JP2011528099 A JP 2011528099A JP 2011528099 A JP2011528099 A JP 2011528099A JP 2012503586 A JP2012503586 A JP 2012503586A
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Japan
Prior art keywords
particle size
reactor
component
colloidal silica
particles
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JP2011528099A
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Japanese (ja)
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JP2012503586A5 (enExample
Inventor
マクドナルド，デニス，エル．
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ChampionX LLC
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Nalco Co LLC
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Publication of JP2012503586A publication Critical patent/JP2012503586A/ja
Publication of JP2012503586A5 publication Critical patent/JP2012503586A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Colloid Chemistry (AREA)
JP2011528099A 2008-09-24 2009-09-24 制御可能な幅広い粒径分布及び最小粒径を有するシリカゾルの製造方法 Pending JP2012503586A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/237,047 US8052788B2 (en) 2005-08-10 2008-09-24 Method of producing silica sols with controllable broad size distribution and minimum particle size
US12/237,047 2008-09-24
PCT/US2009/058216 WO2010036797A1 (en) 2008-09-24 2009-09-24 Method of producing silica sols with controllable broad size distribution and minimum particle size

Publications (2)

Publication Number Publication Date
JP2012503586A true JP2012503586A (ja) 2012-02-09
JP2012503586A5 JP2012503586A5 (enExample) 2012-10-25

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ID=41382418

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JP2011528099A Pending JP2012503586A (ja) 2008-09-24 2009-09-24 制御可能な幅広い粒径分布及び最小粒径を有するシリカゾルの製造方法

Country Status (8)

Country Link
US (1) US8052788B2 (enExample)
EP (1) EP2346784A1 (enExample)
JP (1) JP2012503586A (enExample)
KR (1) KR20110069025A (enExample)
CN (1) CN102164854B (enExample)
MY (1) MY158518A (enExample)
TW (1) TWI491563B (enExample)
WO (1) WO2010036797A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153852A (ja) * 2014-02-13 2015-08-24 三菱化学株式会社 窒化物半導体基板の製造方法
JP2015533868A (ja) * 2012-08-24 2015-11-26 エコラブ ユーエスエイ インク サファイア表面を研磨する方法
US9896604B2 (en) 2013-03-15 2018-02-20 Ecolab Usa Inc. Methods of polishing sapphire surfaces
JP2019214502A (ja) * 2018-06-14 2019-12-19 日本製鉄株式会社 キャスタブル耐火物の製造方法
WO2024237073A1 (ja) * 2023-05-12 2024-11-21 日揮触媒化成株式会社 研磨用シリカ微粒子分散液、研磨用組成物、および研磨用シリカ微粒子分散液の製造方法

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US20050234136A1 (en) * 2004-04-19 2005-10-20 Holland Brian T Colloidal compositions and methods of preparing same
WO2014136039A1 (en) * 2013-03-05 2014-09-12 Jawaharlal Nehru Centre For Advanced Scientific Research Composition, substrates and methods thereof
CN103311106B (zh) * 2013-05-14 2015-12-23 中国科学院半导体研究所 低表面粗糙度的硅基砷化镓材料的制备方法
US9764292B2 (en) 2014-02-28 2017-09-19 Pall Corporation Porous polymeric membrane with high void volume
US9737860B2 (en) 2014-02-28 2017-08-22 Pall Corporation Hollow fiber membrane having hexagonal voids
US9610548B2 (en) 2014-02-28 2017-04-04 Pall Corporation Composite porous polymeric membrane with high void volume
US9309126B2 (en) 2014-02-28 2016-04-12 Pall Corporation Rapidly dissolvable nanoparticles
US9776142B2 (en) 2014-02-28 2017-10-03 Pall Corporation Porous polymeric membrane with high void volume
US9302228B2 (en) 2014-02-28 2016-04-05 Pall Corporation Charged porous polymeric membrane with high void volume
US9446355B2 (en) 2014-02-28 2016-09-20 Pall Corporation Porous polymeric membrane with high void volume
US9561473B2 (en) 2014-02-28 2017-02-07 Pall Corporation Charged hollow fiber membrane having hexagonal voids
CN106044786B (zh) * 2016-06-01 2019-05-07 上海新安纳电子科技有限公司 多分散大粒径硅溶胶及其制备方法
US10377014B2 (en) 2017-02-28 2019-08-13 Ecolab Usa Inc. Increased wetting of colloidal silica as a polishing slurry
KR102670426B1 (ko) 2020-01-15 2024-06-03 오씨아이 주식회사 흄드 실리카로부터 단일 응집체를 분리 및 포집하는 방법 및 단일 응집체의 형상 분류 방법

Citations (1)

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US20070034116A1 (en) * 2005-08-10 2007-02-15 Mac Donald Dennis L Silica sols with controlled minimum particle size and preparation thereof

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US3650977A (en) * 1969-03-27 1972-03-21 Philadelphia Quartz Co Method of preparing silica sol and product thereof
US3789009A (en) * 1971-07-15 1974-01-29 Du Pont Process for the preparation of large particle silica sols
US5221497A (en) * 1988-03-16 1993-06-22 Nissan Chemical Industries, Ltd. Elongated-shaped silica sol and method for preparing the same
US4996084A (en) * 1989-06-30 1991-02-26 Pfizer Hospital Products Group, Inc. Colloidal silica water based slurry system for investment casting shell backup coats
US5100581A (en) * 1990-02-22 1992-03-31 Nissan Chemical Industries Ltd. Method of preparing high-purity aqueous silica sol
JPH05170424A (ja) * 1991-12-24 1993-07-09 Nittetsu Mining Co Ltd シリカゾルの製造方法
DE4216119C2 (de) * 1992-05-15 1995-08-10 Bayer Ag Verfahren zur Herstellung und Konzentrierung von Kieselsolen
DE4218306C2 (de) * 1992-06-03 1995-06-22 Bayer Ag Verfahren zur kontinuierlichen Herstellung großpartikulärer Kieselsole
CO5070714A1 (es) * 1998-03-06 2001-08-28 Nalco Chemical Co Proceso para la preparacion de silice coloidal estable
JP4113288B2 (ja) * 1998-09-04 2008-07-09 スピードファム株式会社 研磨用組成物およびそれを用いたシリコンウェーハの加工方法
US6906109B2 (en) * 2000-09-01 2005-06-14 Chemical Products Corp. Method for controling uniformity of colloidal silica particle size
US6747065B1 (en) * 2000-09-01 2004-06-08 Chemical Products Corporation System and method for producing high purity colloidal silica and potassium hydroxide
JP2002275274A (ja) * 2001-03-19 2002-09-25 Dokai Chemical Industries Co Ltd 鱗片状シリカ粒子を含有する高い保存安定性を有する硬化性組成物及びその製造方法
US6918820B2 (en) * 2003-04-11 2005-07-19 Eastman Kodak Company Polishing compositions comprising polymeric cores having inorganic surface particles and method of use
US6939211B2 (en) * 2003-10-09 2005-09-06 Micron Technology, Inc. Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
US20050234136A1 (en) * 2004-04-19 2005-10-20 Holland Brian T Colloidal compositions and methods of preparing same
US20060283095A1 (en) * 2005-06-15 2006-12-21 Planar Solutions, Llc Fumed silica to colloidal silica conversion process
JP5137521B2 (ja) * 2006-10-12 2013-02-06 日揮触媒化成株式会社 金平糖状シリカ系ゾルおよびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070034116A1 (en) * 2005-08-10 2007-02-15 Mac Donald Dennis L Silica sols with controlled minimum particle size and preparation thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015533868A (ja) * 2012-08-24 2015-11-26 エコラブ ユーエスエイ インク サファイア表面を研磨する方法
US9896604B2 (en) 2013-03-15 2018-02-20 Ecolab Usa Inc. Methods of polishing sapphire surfaces
JP2015153852A (ja) * 2014-02-13 2015-08-24 三菱化学株式会社 窒化物半導体基板の製造方法
JP2019214502A (ja) * 2018-06-14 2019-12-19 日本製鉄株式会社 キャスタブル耐火物の製造方法
JP7003849B2 (ja) 2018-06-14 2022-01-21 日本製鉄株式会社 キャスタブル耐火物の製造方法
WO2024237073A1 (ja) * 2023-05-12 2024-11-21 日揮触媒化成株式会社 研磨用シリカ微粒子分散液、研磨用組成物、および研磨用シリカ微粒子分散液の製造方法

Also Published As

Publication number Publication date
US20090018219A1 (en) 2009-01-15
CN102164854B (zh) 2013-11-20
TWI491563B (zh) 2015-07-11
KR20110069025A (ko) 2011-06-22
MY158518A (en) 2016-10-14
WO2010036797A1 (en) 2010-04-01
CN102164854A (zh) 2011-08-24
US8052788B2 (en) 2011-11-08
TW201012752A (en) 2010-04-01
EP2346784A1 (en) 2011-07-27

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