JP2012500505A5 - - Google Patents

Download PDF

Info

Publication number
JP2012500505A5
JP2012500505A5 JP2011523981A JP2011523981A JP2012500505A5 JP 2012500505 A5 JP2012500505 A5 JP 2012500505A5 JP 2011523981 A JP2011523981 A JP 2011523981A JP 2011523981 A JP2011523981 A JP 2011523981A JP 2012500505 A5 JP2012500505 A5 JP 2012500505A5
Authority
JP
Japan
Prior art keywords
spaced apart
circular
gas
gas outlets
baffle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011523981A
Other languages
English (en)
Other versions
JP2012500505A (ja
JP5757869B2 (ja
Filing date
Publication date
Priority claimed from US12/195,127 external-priority patent/US9222172B2/en
Application filed filed Critical
Publication of JP2012500505A publication Critical patent/JP2012500505A/ja
Publication of JP2012500505A5 publication Critical patent/JP2012500505A5/ja
Application granted granted Critical
Publication of JP5757869B2 publication Critical patent/JP5757869B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

図2Bを参照すると、幾つかの実施形態においては、複数のガス出口210を、バッフル200の前側201上に円形パターンで均等に離間配置することができる。代替的に、複数のガス出口210を、基板106の表面へのガスの流れを容易にするのに必要な任意の好適なパターンで離間配置することもでき、従って、その構成は、均等又は円形に離間配置することに限定されるものではない。
JP2011523981A 2008-08-20 2009-08-20 表面処理された窒化アルミニウム製バッフルを製造する方法 Expired - Fee Related JP5757869B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/195,127 US9222172B2 (en) 2008-08-20 2008-08-20 Surface treated aluminum nitride baffle
US12/195,127 2008-08-20
PCT/US2009/054416 WO2010022212A2 (en) 2008-08-20 2009-08-20 Surface treated aluminum nitride baffle

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015084016A Division JP2015146459A (ja) 2008-08-20 2015-04-16 表面処理された窒化アルミニウム製バッフル

Publications (3)

Publication Number Publication Date
JP2012500505A JP2012500505A (ja) 2012-01-05
JP2012500505A5 true JP2012500505A5 (ja) 2012-10-04
JP5757869B2 JP5757869B2 (ja) 2015-08-05

Family

ID=41696788

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011523981A Expired - Fee Related JP5757869B2 (ja) 2008-08-20 2009-08-20 表面処理された窒化アルミニウム製バッフルを製造する方法
JP2015084016A Pending JP2015146459A (ja) 2008-08-20 2015-04-16 表面処理された窒化アルミニウム製バッフル

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015084016A Pending JP2015146459A (ja) 2008-08-20 2015-04-16 表面処理された窒化アルミニウム製バッフル

Country Status (7)

Country Link
US (2) US9222172B2 (ja)
JP (2) JP5757869B2 (ja)
KR (1) KR20110053360A (ja)
CN (1) CN102132382B (ja)
SG (1) SG193208A1 (ja)
TW (1) TWI480922B (ja)
WO (1) WO2010022212A2 (ja)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9222172B2 (en) * 2008-08-20 2015-12-29 Applied Materials, Inc. Surface treated aluminum nitride baffle
JP5728482B2 (ja) 2009-09-25 2015-06-03 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 誘導結合プラズマリアクタ内での高効率ガス解離のための方法及び装置
US8968537B2 (en) 2011-02-09 2015-03-03 Applied Materials, Inc. PVD sputtering target with a protected backing plate
US9388494B2 (en) 2012-06-25 2016-07-12 Novellus Systems, Inc. Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region
KR101419515B1 (ko) * 2012-09-24 2014-07-15 피에스케이 주식회사 배플 및 배플의 표면처리장치, 그리고 기판 처리 장치 및 표면 처리 방법
US10316409B2 (en) * 2012-12-21 2019-06-11 Novellus Systems, Inc. Radical source design for remote plasma atomic layer deposition
US9399228B2 (en) * 2013-02-06 2016-07-26 Novellus Systems, Inc. Method and apparatus for purging and plasma suppression in a process chamber
US9745658B2 (en) 2013-11-25 2017-08-29 Lam Research Corporation Chamber undercoat preparation method for low temperature ALD films
US10741365B2 (en) * 2014-05-05 2020-08-11 Lam Research Corporation Low volume showerhead with porous baffle
US9551070B2 (en) * 2014-05-30 2017-01-24 Applied Materials, Inc. In-situ corrosion resistant substrate support coating
KR102339563B1 (ko) 2014-06-02 2021-12-16 주식회사 미코세라믹스 플라즈마 화학기상증착 장치용 배플 구조물 및 이의 제조 방법
KR20160002059A (ko) * 2014-06-30 2016-01-07 삼성전자주식회사 하드 마스크 제거 방법
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US10224210B2 (en) 2014-12-09 2019-03-05 Applied Materials, Inc. Plasma processing system with direct outlet toroidal plasma source
US10573496B2 (en) 2014-12-09 2020-02-25 Applied Materials, Inc. Direct outlet toroidal plasma source
US9951421B2 (en) * 2014-12-10 2018-04-24 Lam Research Corporation Inlet for effective mixing and purging
US9728437B2 (en) 2015-02-03 2017-08-08 Applied Materials, Inc. High temperature chuck for plasma processing systems
US9828672B2 (en) 2015-03-26 2017-11-28 Lam Research Corporation Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma
US10023956B2 (en) * 2015-04-09 2018-07-17 Lam Research Corporation Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems
US20160362782A1 (en) * 2015-06-15 2016-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Gas dispenser and deposition apparatus using the same
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
US10662529B2 (en) * 2016-01-05 2020-05-26 Applied Materials, Inc. Cooled gas feed block with baffle and nozzle for HDP-CVD
US9589846B1 (en) * 2016-01-25 2017-03-07 United Microelectronics Corp. Method of forming semiconductor device
US9758868B1 (en) 2016-03-10 2017-09-12 Lam Research Corporation Plasma suppression behind a showerhead through the use of increased pressure
US9850573B1 (en) 2016-06-23 2017-12-26 Applied Materials, Inc. Non-line of sight deposition of erbium based plasma resistant ceramic coating
US10604841B2 (en) 2016-12-14 2020-03-31 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US10211099B2 (en) 2016-12-19 2019-02-19 Lam Research Corporation Chamber conditioning for remote plasma process
US10409295B2 (en) * 2016-12-31 2019-09-10 Applied Materials, Inc. Methods and apparatus for enhanced flow detection repeatability of thermal-based mass flow controllers (MFCS)
US10975469B2 (en) 2017-03-17 2021-04-13 Applied Materials, Inc. Plasma resistant coating of porous body by atomic layer deposition
KR20180134182A (ko) * 2017-06-08 2018-12-18 삼성전자주식회사 플라즈마 처리 장치
US20190131112A1 (en) * 2017-10-30 2019-05-02 Mattson Technology, Inc. Inductively Coupled Plasma Wafer Bevel Strip Apparatus
JP2021506126A (ja) 2017-12-07 2021-02-18 ラム リサーチ コーポレーションLam Research Corporation チャンバ調整における耐酸化保護層
WO2019113478A1 (en) 2017-12-08 2019-06-13 Lam Research Corporation Integrated showerhead with improved hole pattern for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US10760158B2 (en) 2017-12-15 2020-09-01 Lam Research Corporation Ex situ coating of chamber components for semiconductor processing
US12087573B2 (en) 2019-07-17 2024-09-10 Lam Research Corporation Modulation of oxidation profile for substrate processing
US12012653B2 (en) * 2021-03-23 2024-06-18 Applied Materials, Inc. Cleaning assemblies for substrate processing chambers

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3078671B2 (ja) * 1992-11-26 2000-08-21 日本碍子株式会社 耐蝕性部材、その使用方法およびその製造方法
JP3145519B2 (ja) * 1992-12-28 2001-03-12 京セラ株式会社 窒化アルミニウム質焼結体
JPH06219844A (ja) * 1993-01-27 1994-08-09 Showa Denko Kk AlN焼結体およびその製造方法
JPH10296610A (ja) * 1997-04-28 1998-11-10 Sony Corp 研磨方法
JP2000086346A (ja) * 1998-07-10 2000-03-28 Sumitomo Electric Ind Ltd セラミックス基材
US6383964B1 (en) 1998-11-27 2002-05-07 Kyocera Corporation Ceramic member resistant to halogen-plasma corrosion
JP2001233676A (ja) * 2000-02-23 2001-08-28 Taiheiyo Cement Corp プラズマ耐食部材及びその製造方法
JP2002031972A (ja) * 2000-05-10 2002-01-31 Sumitomo Electric Ind Ltd トナー定着器用セラミックスヒータ及びその製造方法
JP4032971B2 (ja) * 2001-04-13 2008-01-16 住友電気工業株式会社 セラミックス接合体、基板保持構造体および基板処理装置
JP3973872B2 (ja) * 2001-10-17 2007-09-12 住友大阪セメント株式会社 電極内蔵型サセプタ及びその製造方法
US7166166B2 (en) * 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
JP4529608B2 (ja) * 2004-09-16 2010-08-25 株式会社村田製作所 超音波接合装置
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7722719B2 (en) * 2005-03-07 2010-05-25 Applied Materials, Inc. Gas baffle and distributor for semiconductor processing chamber
JP2007042672A (ja) 2005-07-29 2007-02-15 Ibiden Co Ltd プラズマプロセス装置用チャンバー部材及びその製造方法
JP2008053390A (ja) * 2006-08-23 2008-03-06 Sumitomo Metal Electronics Devices Inc 窒化アルミニウム多層基板
US7740706B2 (en) 2006-11-28 2010-06-22 Applied Materials, Inc. Gas baffle and distributor for semiconductor processing chamber
US9222172B2 (en) * 2008-08-20 2015-12-29 Applied Materials, Inc. Surface treated aluminum nitride baffle
JP5789512B2 (ja) * 2009-07-31 2015-10-07 電気化学工業株式会社 Led搭載用ウエハとその製造方法、及びそのウエハを用いたled搭載構造体

Similar Documents

Publication Publication Date Title
JP2012500505A5 (ja)
USD861440S1 (en) Strainer
USD672010S1 (en) Adjustable chemical vapor deposition showerhead assembly
JP2019508651A5 (ja)
JP2013510590A5 (ja)
JP2010524750A5 (ja)
JP2014506836A5 (ja)
JP2010535608A5 (ja)
JP2011506530A5 (ja)
JP2012030068A5 (ja)
CA139824S (en) Fluid filter
CA142386S (en) Faucet mount device with pressure fit
JP2010064069A5 (ja)
JP2014096347A5 (ja)
JP2013530911A5 (ja)
CA142385S (en) Faucet mount device with flip configuration
JP2012236289A5 (ja)
JP2010151225A5 (ja)
JP2014237895A5 (ja)
JP2011019413A5 (ja)
USD664139S1 (en) Cover of an electronic device with surface pattern
JP2012502796A5 (ja)
JP2011117352A5 (ja)
USD664132S1 (en) Cover of an electronic device with surface pattern
JP2014152503A5 (ja)