JP2012500505A5 - - Google Patents
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- JP2012500505A5 JP2012500505A5 JP2011523981A JP2011523981A JP2012500505A5 JP 2012500505 A5 JP2012500505 A5 JP 2012500505A5 JP 2011523981 A JP2011523981 A JP 2011523981A JP 2011523981 A JP2011523981 A JP 2011523981A JP 2012500505 A5 JP2012500505 A5 JP 2012500505A5
- Authority
- JP
- Japan
- Prior art keywords
- spaced apart
- circular
- gas
- gas outlets
- baffle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 description 1
Description
図2Bを参照すると、幾つかの実施形態においては、複数のガス出口210を、バッフル200の前側201上に円形パターンで均等に離間配置することができる。代替的に、複数のガス出口210を、基板106の表面へのガスの流れを容易にするのに必要な任意の好適なパターンで離間配置することもでき、従って、その構成は、均等又は円形に離間配置することに限定されるものではない。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/195,127 US9222172B2 (en) | 2008-08-20 | 2008-08-20 | Surface treated aluminum nitride baffle |
US12/195,127 | 2008-08-20 | ||
PCT/US2009/054416 WO2010022212A2 (en) | 2008-08-20 | 2009-08-20 | Surface treated aluminum nitride baffle |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015084016A Division JP2015146459A (ja) | 2008-08-20 | 2015-04-16 | 表面処理された窒化アルミニウム製バッフル |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012500505A JP2012500505A (ja) | 2012-01-05 |
JP2012500505A5 true JP2012500505A5 (ja) | 2012-10-04 |
JP5757869B2 JP5757869B2 (ja) | 2015-08-05 |
Family
ID=41696788
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011523981A Expired - Fee Related JP5757869B2 (ja) | 2008-08-20 | 2009-08-20 | 表面処理された窒化アルミニウム製バッフルを製造する方法 |
JP2015084016A Pending JP2015146459A (ja) | 2008-08-20 | 2015-04-16 | 表面処理された窒化アルミニウム製バッフル |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015084016A Pending JP2015146459A (ja) | 2008-08-20 | 2015-04-16 | 表面処理された窒化アルミニウム製バッフル |
Country Status (7)
Country | Link |
---|---|
US (2) | US9222172B2 (ja) |
JP (2) | JP5757869B2 (ja) |
KR (1) | KR20110053360A (ja) |
CN (1) | CN102132382B (ja) |
SG (1) | SG193208A1 (ja) |
TW (1) | TWI480922B (ja) |
WO (1) | WO2010022212A2 (ja) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9222172B2 (en) * | 2008-08-20 | 2015-12-29 | Applied Materials, Inc. | Surface treated aluminum nitride baffle |
JP5728482B2 (ja) | 2009-09-25 | 2015-06-03 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 誘導結合プラズマリアクタ内での高効率ガス解離のための方法及び装置 |
US8968537B2 (en) | 2011-02-09 | 2015-03-03 | Applied Materials, Inc. | PVD sputtering target with a protected backing plate |
US9388494B2 (en) | 2012-06-25 | 2016-07-12 | Novellus Systems, Inc. | Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region |
KR101419515B1 (ko) * | 2012-09-24 | 2014-07-15 | 피에스케이 주식회사 | 배플 및 배플의 표면처리장치, 그리고 기판 처리 장치 및 표면 처리 방법 |
US10316409B2 (en) * | 2012-12-21 | 2019-06-11 | Novellus Systems, Inc. | Radical source design for remote plasma atomic layer deposition |
US9399228B2 (en) * | 2013-02-06 | 2016-07-26 | Novellus Systems, Inc. | Method and apparatus for purging and plasma suppression in a process chamber |
US9745658B2 (en) | 2013-11-25 | 2017-08-29 | Lam Research Corporation | Chamber undercoat preparation method for low temperature ALD films |
US10741365B2 (en) * | 2014-05-05 | 2020-08-11 | Lam Research Corporation | Low volume showerhead with porous baffle |
US9551070B2 (en) * | 2014-05-30 | 2017-01-24 | Applied Materials, Inc. | In-situ corrosion resistant substrate support coating |
KR102339563B1 (ko) | 2014-06-02 | 2021-12-16 | 주식회사 미코세라믹스 | 플라즈마 화학기상증착 장치용 배플 구조물 및 이의 제조 방법 |
KR20160002059A (ko) * | 2014-06-30 | 2016-01-07 | 삼성전자주식회사 | 하드 마스크 제거 방법 |
US9355922B2 (en) | 2014-10-14 | 2016-05-31 | Applied Materials, Inc. | Systems and methods for internal surface conditioning in plasma processing equipment |
US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
US10224210B2 (en) | 2014-12-09 | 2019-03-05 | Applied Materials, Inc. | Plasma processing system with direct outlet toroidal plasma source |
US10573496B2 (en) | 2014-12-09 | 2020-02-25 | Applied Materials, Inc. | Direct outlet toroidal plasma source |
US9951421B2 (en) * | 2014-12-10 | 2018-04-24 | Lam Research Corporation | Inlet for effective mixing and purging |
US9728437B2 (en) | 2015-02-03 | 2017-08-08 | Applied Materials, Inc. | High temperature chuck for plasma processing systems |
US9828672B2 (en) | 2015-03-26 | 2017-11-28 | Lam Research Corporation | Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma |
US10023956B2 (en) * | 2015-04-09 | 2018-07-17 | Lam Research Corporation | Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems |
US20160362782A1 (en) * | 2015-06-15 | 2016-12-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gas dispenser and deposition apparatus using the same |
US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
US9691645B2 (en) | 2015-08-06 | 2017-06-27 | Applied Materials, Inc. | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
US10662529B2 (en) * | 2016-01-05 | 2020-05-26 | Applied Materials, Inc. | Cooled gas feed block with baffle and nozzle for HDP-CVD |
US9589846B1 (en) * | 2016-01-25 | 2017-03-07 | United Microelectronics Corp. | Method of forming semiconductor device |
US9758868B1 (en) | 2016-03-10 | 2017-09-12 | Lam Research Corporation | Plasma suppression behind a showerhead through the use of increased pressure |
US9850573B1 (en) | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
US10604841B2 (en) | 2016-12-14 | 2020-03-31 | Lam Research Corporation | Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
US10211099B2 (en) | 2016-12-19 | 2019-02-19 | Lam Research Corporation | Chamber conditioning for remote plasma process |
US10409295B2 (en) * | 2016-12-31 | 2019-09-10 | Applied Materials, Inc. | Methods and apparatus for enhanced flow detection repeatability of thermal-based mass flow controllers (MFCS) |
US10975469B2 (en) | 2017-03-17 | 2021-04-13 | Applied Materials, Inc. | Plasma resistant coating of porous body by atomic layer deposition |
KR20180134182A (ko) * | 2017-06-08 | 2018-12-18 | 삼성전자주식회사 | 플라즈마 처리 장치 |
US20190131112A1 (en) * | 2017-10-30 | 2019-05-02 | Mattson Technology, Inc. | Inductively Coupled Plasma Wafer Bevel Strip Apparatus |
JP2021506126A (ja) | 2017-12-07 | 2021-02-18 | ラム リサーチ コーポレーションLam Research Corporation | チャンバ調整における耐酸化保護層 |
WO2019113478A1 (en) | 2017-12-08 | 2019-06-13 | Lam Research Corporation | Integrated showerhead with improved hole pattern for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
US10760158B2 (en) | 2017-12-15 | 2020-09-01 | Lam Research Corporation | Ex situ coating of chamber components for semiconductor processing |
US12087573B2 (en) | 2019-07-17 | 2024-09-10 | Lam Research Corporation | Modulation of oxidation profile for substrate processing |
US12012653B2 (en) * | 2021-03-23 | 2024-06-18 | Applied Materials, Inc. | Cleaning assemblies for substrate processing chambers |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3078671B2 (ja) * | 1992-11-26 | 2000-08-21 | 日本碍子株式会社 | 耐蝕性部材、その使用方法およびその製造方法 |
JP3145519B2 (ja) * | 1992-12-28 | 2001-03-12 | 京セラ株式会社 | 窒化アルミニウム質焼結体 |
JPH06219844A (ja) * | 1993-01-27 | 1994-08-09 | Showa Denko Kk | AlN焼結体およびその製造方法 |
JPH10296610A (ja) * | 1997-04-28 | 1998-11-10 | Sony Corp | 研磨方法 |
JP2000086346A (ja) * | 1998-07-10 | 2000-03-28 | Sumitomo Electric Ind Ltd | セラミックス基材 |
US6383964B1 (en) | 1998-11-27 | 2002-05-07 | Kyocera Corporation | Ceramic member resistant to halogen-plasma corrosion |
JP2001233676A (ja) * | 2000-02-23 | 2001-08-28 | Taiheiyo Cement Corp | プラズマ耐食部材及びその製造方法 |
JP2002031972A (ja) * | 2000-05-10 | 2002-01-31 | Sumitomo Electric Ind Ltd | トナー定着器用セラミックスヒータ及びその製造方法 |
JP4032971B2 (ja) * | 2001-04-13 | 2008-01-16 | 住友電気工業株式会社 | セラミックス接合体、基板保持構造体および基板処理装置 |
JP3973872B2 (ja) * | 2001-10-17 | 2007-09-12 | 住友大阪セメント株式会社 | 電極内蔵型サセプタ及びその製造方法 |
US7166166B2 (en) * | 2002-09-30 | 2007-01-23 | Tokyo Electron Limited | Method and apparatus for an improved baffle plate in a plasma processing system |
JP4529608B2 (ja) * | 2004-09-16 | 2010-08-25 | 株式会社村田製作所 | 超音波接合装置 |
US7552521B2 (en) | 2004-12-08 | 2009-06-30 | Tokyo Electron Limited | Method and apparatus for improved baffle plate |
US7722719B2 (en) * | 2005-03-07 | 2010-05-25 | Applied Materials, Inc. | Gas baffle and distributor for semiconductor processing chamber |
JP2007042672A (ja) | 2005-07-29 | 2007-02-15 | Ibiden Co Ltd | プラズマプロセス装置用チャンバー部材及びその製造方法 |
JP2008053390A (ja) * | 2006-08-23 | 2008-03-06 | Sumitomo Metal Electronics Devices Inc | 窒化アルミニウム多層基板 |
US7740706B2 (en) | 2006-11-28 | 2010-06-22 | Applied Materials, Inc. | Gas baffle and distributor for semiconductor processing chamber |
US9222172B2 (en) * | 2008-08-20 | 2015-12-29 | Applied Materials, Inc. | Surface treated aluminum nitride baffle |
JP5789512B2 (ja) * | 2009-07-31 | 2015-10-07 | 電気化学工業株式会社 | Led搭載用ウエハとその製造方法、及びそのウエハを用いたled搭載構造体 |
-
2008
- 2008-08-20 US US12/195,127 patent/US9222172B2/en active Active
-
2009
- 2009-08-20 TW TW098128087A patent/TWI480922B/zh not_active IP Right Cessation
- 2009-08-20 KR KR1020117006239A patent/KR20110053360A/ko not_active Application Discontinuation
- 2009-08-20 JP JP2011523981A patent/JP5757869B2/ja not_active Expired - Fee Related
- 2009-08-20 CN CN200980132709.4A patent/CN102132382B/zh not_active Expired - Fee Related
- 2009-08-20 WO PCT/US2009/054416 patent/WO2010022212A2/en active Application Filing
- 2009-08-20 SG SG2013061734A patent/SG193208A1/en unknown
-
2015
- 2015-04-16 JP JP2015084016A patent/JP2015146459A/ja active Pending
- 2015-11-20 US US14/947,594 patent/US10214815B2/en active Active
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