JP2012217155A - 圧電デバイス及び圧電デバイスの製造方法 - Google Patents

圧電デバイス及び圧電デバイスの製造方法 Download PDF

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Publication number
JP2012217155A
JP2012217155A JP2012058933A JP2012058933A JP2012217155A JP 2012217155 A JP2012217155 A JP 2012217155A JP 2012058933 A JP2012058933 A JP 2012058933A JP 2012058933 A JP2012058933 A JP 2012058933A JP 2012217155 A JP2012217155 A JP 2012217155A
Authority
JP
Japan
Prior art keywords
wafer
piezoelectric
adhesive
plate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012058933A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012217155A5 (enExample
Inventor
Ko Arimichi
巧 有路
Kunio Morita
邦夫 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2012058933A priority Critical patent/JP2012217155A/ja
Priority to US13/434,836 priority patent/US9018825B2/en
Publication of JP2012217155A publication Critical patent/JP2012217155A/ja
Publication of JP2012217155A5 publication Critical patent/JP2012217155A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2012058933A 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法 Pending JP2012217155A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012058933A JP2012217155A (ja) 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法
US13/434,836 US9018825B2 (en) 2011-03-30 2012-03-29 Piezoelectric device and manufacturing method of piezoelectric device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011075237 2011-03-30
JP2011075237 2011-03-30
JP2012058933A JP2012217155A (ja) 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016076969A Division JP2016154368A (ja) 2011-03-30 2016-04-07 圧電デバイス及び圧電デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2012217155A true JP2012217155A (ja) 2012-11-08
JP2012217155A5 JP2012217155A5 (enExample) 2015-04-23

Family

ID=46926266

Family Applications (1)

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JP2012058933A Pending JP2012217155A (ja) 2011-03-30 2012-03-15 圧電デバイス及び圧電デバイスの製造方法

Country Status (2)

Country Link
US (1) US9018825B2 (enExample)
JP (1) JP2012217155A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120248940A1 (en) * 2011-03-30 2012-10-04 Nihon Dempa Kogyo Co., Ltd. Piezoelectric device and manufacturing method of piezoelectric device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011199065A (ja) * 2010-03-19 2011-10-06 Seiko Instruments Inc 真空パッケージ、真空パッケージの製造方法、圧電振動子、発振器、電子機器及び電波時計
JP5972598B2 (ja) * 2012-02-22 2016-08-17 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法
JP1565481S (enExample) * 2016-05-25 2016-12-19
USD857020S1 (en) * 2016-05-25 2019-08-20 Tdk Corporation Piezoelectric element
CN109427828B (zh) * 2017-09-04 2021-02-09 中芯国际集成电路制造(上海)有限公司 半导体装置的制造方法
WO2019195334A1 (en) * 2018-04-03 2019-10-10 Corning Incorporated Hermetically sealed optically transparent wafer-level packages and methods for making the same
JP1649916S (enExample) * 2019-05-20 2020-01-20
USD958763S1 (en) * 2019-05-20 2022-07-26 Tdk Corporation Piezoelectric element

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10289962A (ja) * 1997-02-17 1998-10-27 Denso Corp 電子回路装置の製造方法
JPH11163668A (ja) * 1997-11-28 1999-06-18 Matsushita Electric Ind Co Ltd 積層圧電単結晶基板及びそれを用いた圧電デバイス
JP2002319710A (ja) * 2001-04-20 2002-10-31 Matsushita Electric Ind Co Ltd 発光装置とその製造方法
WO2006118192A1 (ja) * 2005-04-27 2006-11-09 Kyocera Corporation 圧電部品及びその製造方法
JP2007013636A (ja) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp 圧電振動子の製造方法及び圧電振動子
JP2008116648A (ja) * 2006-11-02 2008-05-22 Nishiyama Stainless Chem Kk Ｆｐｄの製造方法、及びこれに使用する封止材
JP2008167302A (ja) * 2006-12-28 2008-07-17 Kyocera Kinseki Corp 水晶振動子の電気的導通路の形成方法
WO2009104310A1 (ja) * 2008-02-18 2009-08-27 セイコーインスツル株式会社 圧電振動子の製造方法、圧電振動子、発振器、電子機器および電波時計
JP2010124448A (ja) * 2008-10-24 2010-06-03 Epson Toyocom Corp 電子部品用パッケージ、圧電デバイスおよびその製造方法
JP2010124015A (ja) * 2008-11-17 2010-06-03 Nippon Dempa Kogyo Co Ltd 圧電デバイスとその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704478B2 (ja) 2001-03-12 2005-10-12 株式会社巴川製紙所 電子部品封止用蓋材ウエハ及びその製造方法
JP2012217155A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2012217143A (ja) * 2011-03-31 2012-11-08 Nippon Dempa Kogyo Co Ltd 水晶デバイス及びその製造方法
JP2012253587A (ja) * 2011-06-03 2012-12-20 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2013098814A (ja) * 2011-11-02 2013-05-20 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10289962A (ja) * 1997-02-17 1998-10-27 Denso Corp 電子回路装置の製造方法
JPH11163668A (ja) * 1997-11-28 1999-06-18 Matsushita Electric Ind Co Ltd 積層圧電単結晶基板及びそれを用いた圧電デバイス
JP2002319710A (ja) * 2001-04-20 2002-10-31 Matsushita Electric Ind Co Ltd 発光装置とその製造方法
WO2006118192A1 (ja) * 2005-04-27 2006-11-09 Kyocera Corporation 圧電部品及びその製造方法
JP2007013636A (ja) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp 圧電振動子の製造方法及び圧電振動子
JP2008116648A (ja) * 2006-11-02 2008-05-22 Nishiyama Stainless Chem Kk Ｆｐｄの製造方法、及びこれに使用する封止材
JP2008167302A (ja) * 2006-12-28 2008-07-17 Kyocera Kinseki Corp 水晶振動子の電気的導通路の形成方法
WO2009104310A1 (ja) * 2008-02-18 2009-08-27 セイコーインスツル株式会社 圧電振動子の製造方法、圧電振動子、発振器、電子機器および電波時計
JP2010124448A (ja) * 2008-10-24 2010-06-03 Epson Toyocom Corp 電子部品用パッケージ、圧電デバイスおよびその製造方法
JP2010124015A (ja) * 2008-11-17 2010-06-03 Nippon Dempa Kogyo Co Ltd 圧電デバイスとその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120248940A1 (en) * 2011-03-30 2012-10-04 Nihon Dempa Kogyo Co., Ltd. Piezoelectric device and manufacturing method of piezoelectric device
US9018825B2 (en) * 2011-03-30 2015-04-28 Nihon Dempa Kogyo Co., Ltd. Piezoelectric device and manufacturing method of piezoelectric device

Also Published As

Publication number Publication date
US20120248940A1 (en) 2012-10-04
US9018825B2 (en) 2015-04-28

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